公开(公告)号：US06310285B1

公开(公告)日：2001-10-30

申请号：US09065030

申请日：1998-04-22

申请人： Mitsuharu Sato ,  Koji Kamei ,  Shigeyoshi Yoshida

发明人： Mitsuharu Sato ,  Koji Kamei ,  Shigeyoshi Yoshida

IPC分类号： H05K900

CPC分类号： H01L23/552 ,  H01F1/24 ,  H01F1/26 ,  H01F1/33 ,  H01L2924/0002 ,  H01Q1/526 ,  H01Q17/00 ,  Y10T428/24372 ,  Y10T428/24413 ,  H01L2924/00

摘要： An EMI countermeasure component is provided relative to an active element, which does not deteriorate a circuit function of the active element, but has a sufficient shielding effect against permeation of electromagnetic waves radiated to the exterior, and further suppresses a malfunction or the like due to mutual interferences between peripheral components or an electromagnetic induction to a signal line. The EMI countermeasure component is made of a composite magnetic body including soft magnetic powder having oxide films on the surfaces thereof and an organic binding agent, and extinguishes undesired high frequency electromagnetic radiation as heat due to its complex permeability.

摘要翻译： 相对于有源元件提供EMI对抗部件，其不会使有源元件的电路功能劣化，而是对辐射到外部的电磁波的透过具有足够的屏蔽效果，并且进一步抑制由于 外围组件之间的相互干扰或对信号线的电磁感应。 EMI对抗部件由包括其表面上具有氧化物膜的软磁性粉末和有机粘合剂的复合磁性体制成，并且由于其复合渗透性而将不需要的高频电磁辐射作为热量熄灭。

公开(公告)号：US06362434B1

公开(公告)日：2002-03-26

申请号：US09066381

申请日：1998-04-29

申请人： Shigeyoshi Yoshida ,  Mitsuharu Sato ,  Koji Kamei

发明人： Shigeyoshi Yoshida ,  Mitsuharu Sato ,  Koji Kamei

IPC分类号： H05K109

CPC分类号： H05K9/0039 ,  B29C70/025 ,  B29K2995/0008 ,  C08J5/24 ,  H05K1/0233 ,  H05K1/0373 ,  H05K2201/086 ,  Y10T428/24926

摘要： For improving a noise characteristic of a printed circuit board excellent in noise characteristic, a magnetic prepreg formed by impregnating a magnetic paint composed of soft magnetic powder and thermosetting resin into a glass cloth is used as a prepreg constituting the printed circuit board. It is preferable that the soft magnetic powder is metal powder being essentially flat. Further, it is preferable that a main component of the thermosetting resin is epoxy resin.

摘要翻译： 为了提高噪声特性优异的印刷电路板的噪声特性，使用将由软磁粉末和热固性树脂构成的磁性涂料浸渍在玻璃布中而形成的磁性预浸料作为构成印刷电路板的预浸料坯。 优选软磁性粉末是金属粉末基本上平坦的。 此外，热固性树脂的主要成分优选为环氧树脂。

公开(公告)号：US6051156A

公开(公告)日：2000-04-18

申请号：US77442

申请日：1998-05-28

申请人： Shigeyoshi Yoshida ,  Mitsuharu Sato ,  Koji Kamei

发明人： Shigeyoshi Yoshida ,  Mitsuharu Sato ,  Koji Kamei

IPC分类号： H01F1/00 ,  H01F1/113 ,  H01F1/26 ,  H01F1/37 ,  H01Q17/00 ,  H05K9/00 ,  H01R1/00

CPC分类号： H05K9/0083 ,  H01F1/0027 ,  H01F1/26 ,  H01F1/37 ,  H01Q17/00 ,  H01Q17/002 ,  H01Q17/004 ,  Y10T307/653

摘要： A thin electromagnetic interference suppressing body effective for electromagnetic interference suppression at a microwave band. As a material of the electromagnetic interference suppressing body, there is provided a composite magnetic body formed by bonding powder made of a semi-hard magnetic material by an organic bonding agent and having a high magnetic loss at the microwave band. As the semi-hard magnetic material, a metallic magnetic body, such as Fe--Co--Mo alloy, Co--Fe--Nb alloy or Fe--Co--V alloy, or an oxide magnetic body, such as .gamma.-Fe.sub.2 O.sub.3 or Co--Ti substituted Ba ferrite, can be used. Further, as an example of the organic bonding agent, polyurethane resin can be cited.

摘要翻译： PCT No.PCT / JP97 / 03396 371日期：1998年5月28日 102（e）日期1998年5月28日PCT 1997年9月24日PCT公布。 公开号WO98 / 14962 日期：1998年4月9日一种薄膜电磁干扰抑制体，对于微波波段的电磁干扰抑制有效。 作为电磁干扰抑制体的材料，提供了一种复合磁体，该复合磁体通过有机粘合剂将由半硬磁性材料制成的粉末粘合在微波带上而具有高的磁损耗而形成。 作为半硬磁性材料，可以使用诸如Fe-Co-Mo合金，Co-Fe-Nb合金或Fe-Co-V合金的金属磁性体，或诸如γ-Fe 2 O 3或Co- 可以使用Ti取代的Ba铁氧体。 此外，作为有机粘合剂的实例，可以列举聚氨酯树脂。

公开(公告)号：US06903440B2

公开(公告)日：2005-06-07

申请号：US10355593

申请日：2003-01-31

申请人： Shigeyoshi Yoshida ,  Hiroshi Ono ,  Koji Kamei

发明人： Shigeyoshi Yoshida ,  Hiroshi Ono ,  Koji Kamei

IPC分类号： H01L21/60 ,  H01L23/49 ,  H01L23/495 ,  H01L23/66 ,  H03H1/00 ,  H05K1/02 ,  H01L27/082

CPC分类号： H05K1/0233 ,  H01L23/4952 ,  H01L23/66 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/745 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/432 ,  H01L2224/43826 ,  H01L2224/43827 ,  H01L2224/451 ,  H01L2224/45117 ,  H01L2224/45118 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45163 ,  H01L2224/45166 ,  H01L2224/45179 ,  H01L2224/45181 ,  H01L2224/45188 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/45617 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45663 ,  H01L2224/45666 ,  H01L2224/45679 ,  H01L2224/45681 ,  H01L2224/45686 ,  H01L2224/45693 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/745 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H03H2001/0092 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/01008 ,  H01L2924/01009 ,  H01L2924/049 ,  H01L2924/053 ,  H01L2224/45015 ,  H01L2924/207

摘要： In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (μm) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23). When the top end is connected with the conductive pattern (25) by means of a solder (27) in mounting the printed wiring circuit board (23) of IC (17), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.

摘要翻译： 为了提供高频电流抑制型的电子部件，能够完全抑制高频电流，即使在高频时使用也能够发生电磁干扰，也可以使用该接合线等。 集成电路器件（IC）17在高频使用时高速工作，并且预定数量的端子（19）设置有高频电流抑制器（21），用于衰减通过的高频电流 终端本身。 该高频电流抑制器（21）是厚度为0.3〜20（μm）范围的薄膜磁性物质，并且设置在各端子（19）的整个表面上，覆盖安装部 用于安装IC（17）的印刷布线电路板（23）和包括设置在印刷布线电路板（23）上的导电图案的连接部分的边缘。 当在安装IC（17）的印刷布线电路板（23）时顶端通过焊料（27）与导电图案（25）连接时，安装部分的附近具有使用频带的导电性 ，小于几十MHz。

公开(公告)号：US06635961B2

公开(公告)日：2003-10-21

申请号：US09826436

申请日：2001-04-04

申请人： Shigeyoshi Yoshida ,  Hiroshi Ono ,  Koji Kamei

发明人： Shigeyoshi Yoshida ,  Hiroshi Ono ,  Koji Kamei

IPC分类号： H01L2334

CPC分类号： H05K1/0233 ,  H01L23/4952 ,  H01L23/66 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/745 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/432 ,  H01L2224/43826 ,  H01L2224/43827 ,  H01L2224/451 ,  H01L2224/45117 ,  H01L2224/45118 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45163 ,  H01L2224/45166 ,  H01L2224/45179 ,  H01L2224/45181 ,  H01L2224/45188 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/45617 ,  H01L2224/45618 ,  H01L2224/45623 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45663 ,  H01L2224/45666 ,  H01L2224/45679 ,  H01L2224/45681 ,  H01L2224/45686 ,  H01L2224/45693 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/745 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H03H2001/0092 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/01008 ,  H01L2924/01009 ,  H01L2924/049 ,  H01L2924/053 ,  H01L2224/45015 ,  H01L2924/207

摘要： In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (&mgr;m) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23). When the top end is connected with the conductive pattern (25) by means of a solder (27) in mounting the printed wiring circuit board (23) of IC (17), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.

摘要翻译： 为了提供高频电流抑制型的电子部件，能够完全抑制高频电流，即使在高频时使用也能够发生电磁干扰，也可以使用该接合线等。 集成电路器件（IC）17在高频使用时高速工作，并且预定数量的端子（19）设置有高频电流抑制器（21），用于衰减通过的高频电流 终端本身。 该高频电流抑制器（21）是薄膜磁性物质，其厚度范围为0.3〜20（μm），并且设置在各端子（19）的整个表面上，覆盖安装在安装部 用于安装IC（17）的印刷布线电路板（23）和包括设置在印刷布线电路板（23）上的导电图案的连接部分的边缘。 当在安装IC（17）的印刷布线电路板（23）时顶端通过焊料（27）与导电图案（25）连接时，安装部分的附近具有使用频带的导电性 ，小于几十MHz。

公开(公告)号：US5898346A

公开(公告)日：1999-04-27

申请号：US756035

申请日：1996-11-26

申请人： Koji Kamei ,  Atsushi Furuta ,  Norihiko Ono ,  Shigeyoshi Yoshida ,  Kenji Takamoro

发明人： Koji Kamei ,  Atsushi Furuta ,  Norihiko Ono ,  Shigeyoshi Yoshida ,  Kenji Takamoro

IPC分类号： H01P1/36 ,  H01P1/383 ,  H01P1/387 ,  H01P1/32

CPC分类号： H01P1/387

摘要： A dual-band nonreversible circuit device comprises a first circulator element (91) and a second circulator element (92) accommodated in a single housing (50, 50', 60) and operable around a first center frequency (f.sub.A) and a second center frequency (f.sub.B), respectively. The first circulator element (91) is formed by a combination of a first permanent magnet (31), a first ferrite plate (21) with a first center conductor (11), and a ground conductor plate (40) successively stacked on a lower magnetic yoke (50). Likewise, the second circulator element (92) is formed by a combination of the ground conductor plate (40), a second ferrite plate (22) with a second center conductor (12), and a second permanent magnet (32) successively stacked and covered by an upper magnetic yoke (60). Alternatively, a first circulator element (91') is formed by a combination of a first ground conductor plate (41), the first ferrite plate (21) with the first center conductor (11), and a permanent magnet (30) while the second circulator element (92') is formed by a combination of a second ground conductor plate (42), the second ferrite plate (22) with the second center conductor (12), and the permanent magnet (30).

摘要翻译： 双频带不可逆电路装置包括容纳在单个壳体（50,50'，60）中的第一循环器元件（91）和第二循环器元件（92），并且围绕第一中心频率（fA）和第二中心 频率（fB）。 第一循环器元件（91）由第一永久磁铁（31），第一铁氧体板（21）与第一中心导体（11）的组合和接地导体板（40）组合而成， 磁轭（50）。 类似地，第二循环器元件（92）由接地导体板（40），具有第二中心导体（12）的第二铁氧体板（22）和依次层叠的第二永磁体（32）的组合形成， 被上磁轭（60）覆盖。 或者，第一循环器元件（91'）由第一接地导体板（41），第一铁氧体板（21）与第一中心导体（11）和永磁体（30）的组合形成，同时 第二循环器元件（92'）由第二接地导体板（42），第二铁氧体板（22）与第二中心导体（12）和永磁体（30）的组合形成。

公开(公告)号：US06703778B2

公开(公告)日：2004-03-09

申请号：US09826145

申请日：2001-04-04

申请人： Shinya Watanabe ,  Koji Kamei ,  Hiroshi Ono ,  Shigeyoshi Yoshida ,  Michio Nemoto

发明人： Shinya Watanabe ,  Koji Kamei ,  Hiroshi Ono ,  Shigeyoshi Yoshida ,  Michio Nemoto

IPC分类号： H01J2988

CPC分类号： H01J11/12 ,  C03C17/22 ,  C03C17/245 ,  C03C2217/217 ,  C03C2217/23 ,  C03C2217/281 ,  C03C2217/285 ,  C03C2218/15 ,  C03C2218/154 ,  H01J11/44 ,  H01J29/867 ,  H01J2211/446 ,  H01J2329/869

摘要： In a display device (70, 70A, 80-80G, 90-90F) having a display window (73, 81, 93), a magnetic loss layer or layer (75, 75A, 88-88C, 97-97C) is formed on at least a part of a principal surface of the display window. The magnetic loss layer may be a granular magnetic thin layer which is, for example, made of a magnetic substance of a magnetic composition comprising M, X and Y, where M is a metallic magnetic material consisting of Fe, Co, and/or Ni, X being element or elements other than M and Y, and Y being F, N, and/or O. The magnetic loss layer may be formed in any one selected from mat, lattice, stripe, and speck fashions. The magnetic loss layer may be formed in a mesh fashion.

摘要翻译： 在具有显示窗口（73,81,93）的显示装置（70,70A，80-80G，90-90F）中，形成磁损耗层或层（75,75A，88-88C，97-97C） 在显示窗口的主表面的至少一部分上。 磁损耗层可以是粒状磁性薄膜，其例如由包含M，X和Y的磁性组合物的磁性物质制成，其中M是由Fe，Co和/或Ni组成的金属磁性材料 ，X是除了M和Y之外的元素或元素，Y是F，N和/或O.磁损耗层可以形成为从垫，格子，条纹和斑点时尚中选择的任何一种。 磁损耗层可以以网状形成。

公开(公告)号：US6011887A

公开(公告)日：2000-01-04

申请号：US68064

申请日：1998-04-28

申请人： Koji Kamei ,  Shigeyoshi Yoshida

发明人： Koji Kamei ,  Shigeyoshi Yoshida

IPC分类号： G02B6/44 ,  H01B11/22

CPC分类号： G02B6/4422 ,  G02B6/443

摘要： In an optical fiber cable, for effectively suppressing undesired radiant noise propagating in a reinforcing wire or generated from the reinforcing wire without providing an electromagnetic shielding member apart from the optical fiber cable, a buffer layer and an outer jacket of an LAP sheath covering the reinforcing wire being a tension member forming the optical fiber cable are constituted by composite magnetic bodies, respectively, composed of soft magnetic powder and organic binding agents. It is preferable that the soft magnetic powder is powder being essentially flat.

摘要翻译： PCT No.PCT / JP97 / 03003 Sec。 371日期：1998年4月28日 102（e）1998年4月28日PCT PCT 1997年8月28日PCT公布。 公开号WO98 / 09189 日期1998年5月3日在光纤电缆中，为了有效地抑制在加强线中传播或从加强线产生的不期望的辐射噪声，而不提供远离光纤电缆的电磁屏蔽构件，LAP的缓冲层和外护套 覆盖作为形成光缆的张力构件的加强丝的护套由分别由软磁性粉末和有机粘合剂构成的复合磁体构成。 软磁性粉末优选基本上为平坦的粉末。

公开(公告)号：US06723914B1

公开(公告)日：2004-04-20

申请号：US09598487

申请日：2000-02-23

申请人： Koji Kamei ,  Norihiko Ono ,  Mitsuharu Sato

发明人： Koji Kamei ,  Norihiko Ono ,  Mitsuharu Sato

IPC分类号： H01B1106

CPC分类号： H05K9/0088 ,  H01F1/26 ,  Y10S428/90 ,  Y10T428/24628 ,  Y10T428/28

摘要： There is provided a composite magnetic tape which can be easily applied irrespective of the inside or outside of an electronic equipment, prevent radiation of undesired electromagnetic waves from the inside of the equipment and reflection into the inside of the equipment, and shield electromagnetic noise from the outside of the equipment. The tape may be in the form of an adhesive tape or a self-welding tape. The tape is constituted of a composite magnetic layer formed by dispersing soft magnetic powder into an organic binding agent. Alternatively, it may have a stacked structure of a composite magnetic layer and a conductor layer.

摘要翻译： 提供了一种复合磁带，其可以容易地应用于电子设备的内部或外部，防止来自设备内部的不期望的电磁波的辐射和设备内部的反射，并且将电磁噪声从 在设备外面。 胶带可以是胶带或自焊带的形式。 胶带由将软磁粉末分散在有机粘合剂中形成的复合磁性层构成。 或者，其可以具有复合磁性层和导体层的堆叠结构。

公开(公告)号：US07759690B2

公开(公告)日：2010-07-20

申请号：US11994549

申请日：2006-06-30

申请人： Hisayuki Miki ,  Hironao Shinohara ,  Koji Kamei

发明人： Hisayuki Miki ,  Hironao Shinohara ,  Koji Kamei

IPC分类号： H01L29/225 ,  H01L29/22 ,  H01L25/16 ,  H01L33/00

CPC分类号： H01L33/40 ,  H01L33/22 ,  H01L33/32 ,  H01L33/405 ,  H01L33/42 ,  H01L2933/0083

摘要： An object of the present invention is to provide a gallium nitride-based compound semiconductor light-emitting device having a reflective positive electrode configured to achieve excellent light extraction efficiency.The inventive gallium nitride-based compound semiconductor light-emitting device has a gallium nitride-based compound semiconductor layer structure comprising an n-type semiconductor layer, a light-emitting layer and a p-type semiconductor layer, on a substrate, wherein a positive electrode provided on the p-type semiconductor layer is a reflective positive electrode comprising a transparent material layer and a reflective metal layer formed on the transparent material layer.

摘要翻译： 本发明的目的是提供一种具有反射性正极的氮化镓系化合物半导体发光元件，其具有优异的光提取效率。 本发明的氮化镓系化合物半导体发光元件在基板上具有含有n型半导体层，发光层和p型半导体层的氮化镓系化合物半导体层结构， 设置在p型半导体层上的电极是包括透明材料层和形成在透明材料层上的反射金属层的反射性正极。