摘要:
In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (μm) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23). When the top end is connected with the conductive pattern (25) by means of a solder (27) in mounting the printed wiring circuit board (23) of IC (17), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.
摘要:
In order to provide an electronic component of a high frequency current suppression type, which can completely suppress a high frequency current to prevent an electromagnetic interference from occurring even when it is used at a high frequency, and a bonding wire for the same, the semiconductor integrated circuit device (IC) (17) operates at a high speed in using at a high frequency band, and a predetermined number of terminals (19) are provided with a high frequency current suppressor (21) for attenuating a high frequency current passing through the terminals themselves. This high frequency current suppressor (21) is a thin film magnetic substance having a range from 0.3 to 20 (&mgr;m) in thickness, and is disposed on the entire surface of each terminal (19), covering a mounting portion to be mounted on a printed wiring circuit board (23) for mounting IC (17) and an edge including a connecting portion to a conductive pattern (25) disposed on the printed wiring circuit board (23). When the top end is connected with the conductive pattern (25) by means of a solder (27) in mounting the printed wiring circuit board (23) of IC (17), the vicinity of the mounting portion has conductivity in a using frequency band, which is less than a few tens MHz.
摘要:
In a display device (70, 70A, 80-80G, 90-90F) having a display window (73, 81, 93), a magnetic loss layer or layer (75, 75A, 88-88C, 97-97C) is formed on at least a part of a principal surface of the display window. The magnetic loss layer may be a granular magnetic thin layer which is, for example, made of a magnetic substance of a magnetic composition comprising M, X and Y, where M is a metallic magnetic material consisting of Fe, Co, and/or Ni, X being element or elements other than M and Y, and Y being F, N, and/or O. The magnetic loss layer may be formed in any one selected from mat, lattice, stripe, and speck fashions. The magnetic loss layer may be formed in a mesh fashion.
摘要:
A multilayer printed circuit board includes an inner magnetic layer essentially consisting of magnetic material. The inner magnetic layer may be formed by an action of chemical bond or van der Waals force. The inner magnetic layer may comprise a plurality of magnetic units, each of which provides magnetism, and may be formed by magnetically coupling the magnetic units with each other by using a strong interaction. The inner magnetic layer may essentially consist of a ferrite film. The ferrite film may be formed directly on the inner conductive layer by means of an electroless plating method. The ferrite film may essentially consist of an oxide metal composition, the metal composition being represented by the formula of FeaNibZncCod, where: a+b+c+d=3.0; 2.1≦a≦2.7; 0.1≦b≦0.3; 0.1≦c≦0.7; and 0≦d≦0.15.
摘要翻译:多层印刷电路板包括基本由磁性材料组成的内部磁性层。 内部磁性层可以通过化学键或范德华力的作用形成。 内磁性层可以包括多个磁性单元,每个磁性单元提供磁性,并且可以通过使用强相互作用将磁性单元彼此磁耦合而形成。 内部磁性层可以基本上由铁氧体膜组成。 铁氧体膜可以通过化学镀方法直接形成在内导电层上。 铁氧体膜可以基本上由氧化物金属组合物组成,金属组成由式FeaNibZncCod表示,其中:a + b + c + d = 3.0; 2.1≦̸ a≦̸ 2.7; 0.1≦̸ b≦̸ 0.3; 0.1≦̸ c≦̸ 0.7; 和0≦̸ d≦̸ 0.15。
摘要:
A ferrite film is formed by regularly arranging constituents such as magnetized grains or one analogous to that. In the ferrite film, the constituents have at least one of the uniaxial anisotropy and the multiaxial anisotropy. The ferrite film has the magnetic anisotropy or the magnetic isotropy. The ferrite film is formed by the use of the plating method in the presence of a magnetic field. Furthermore, an electromagnetic noise suppressor includes the ferrite film.
摘要:
A ferrite material is disclosed, consisting of an oxide metal composition, the metal composition having the formula of FeaNibZncCod, where: a+b+c+d=3.0; 2.1≦a≦2.7; 0≦b≦0.4; 0≦c≦0.4; and 0.1≦d≦0.5. A ferrite film is made of the ferrite material. Preferably, the ferrite film is formed by a ferrite plating method to have a thickness of 30 μm or less and an aspect ratio of 30 or more. The ferrite film is arranged or provided in the vicinity of an antenna conductor of a radio frequency identification tag. The ferrite film may be in direct contact with the antenna conductor.
摘要翻译:公开了一种铁氧体材料,其由氧化物金属组合物组成,该金属组合物具有下式的金属组成:具有下式的金属组成: > d SUB>,其中:a + b + c + d = 3.0; 2.1 <= a <= 2.7; 0 <= b <= 0.4; 0 <= c <= 0.4; 和0.1 <= d <= 0.5。 铁氧体膜由铁氧体材料制成。 优选地,通过铁素体电镀法形成厚度为30μm以下,纵横比为30以上的铁氧体膜。 铁氧体膜被布置或设置在射频识别标签的天线导体附近。 铁氧体膜可以与天线导体直接接触。
摘要:
A component for suppressing EMI includes a composite magnetic material layer and a composite permanent magnet layer disposed on at least part of the composite magnetic material layer. In the component, the composite magnetic material layer contains an organic binder and a soft magnetic material powder dispersed in the organic binder. The composite permanent magnet layer contains a binder and a permanent magnet powder dispersed in the binder. A bias magnetic field is applied to the composite magnetic material layer from the composite permanent magnet layer.
摘要:
In a magnetic random access memory having a memory device portion (33,34,35) using magnetic material, a high-frequency current suppressor (26) is arranged in the vicinity of the magnetic material to suppress a high-frequency current which flows in the memory device portion. The memory device and the high-frequency current suppressor may be collectively molded in a mold body (25) of a plastic resin. It is preferable that the high-frequency current suppressor is made of a thin film of a granular magnetic material which has a composition represented by M-X-Y where M is a magnetic metal element, Y is one element selected from oxygen, nitrogen, and fluorine, and X is an element other than M and Y.
摘要:
An electromagnetic noise suppressor including a ferrite film is formed by regularly arranging constituents such as magnetized grains or one analogous to that. In the ferrite film, the constituents have at least one of the uniaxial anisotropy and the multiaxial anisotropy. The ferrite film has the magnetic anisotropy or the magnetic isotropy. The ferrite film is formed by a plating method in the presence of a magnetic field.
摘要:
An electromagnetic noise suppressor including a ferrite film is formed by regularly arranging constituents such as magnetized grains or one analogous to that. In the ferrite film, the constituents have at least one of the uniaxial anisotropy and the multiaxial anisotropy. The ferrite film has the magnetic anisotropy or the magnetic isotropy. The ferrite film is formed by a plating method in the presence of a magnetic field.