公开(公告)号：US07866988B2

公开(公告)日：2011-01-11

申请号：US12635977

申请日：2009-12-11

申请人： Masaaki Shimada

发明人： Masaaki Shimada

IPC分类号： H01R1/00

CPC分类号： G06K7/0021 ,  G06K13/0862 ,  H01R12/88

摘要： A connector in which contact between a circuit board and a card-type electronic device is made less liable to be unstable, even when the connector is subject to a shock. One (37) of a pair of arms (37, 38) of a base (3) is made elastically deformable. A holddown (43) is provided on the arm (37) such that the arm (37) cannot be elastically deformed when the base (3) is mounted on the circuit board.

摘要翻译： 即使在连接器受到冲击的情况下，使电路板与卡式电子设备之间的接触不容易变得不稳定的连接器。 使基座（3）的一对臂（37,38）中的一个（37）可弹性变形。 在臂（37）上设置有按压（43），使得当基座（3）安装在电路板上时臂（37）不会弹性变形。

公开(公告)号：US07367818B2

公开(公告)日：2008-05-06

申请号：US11472320

申请日：2006-06-22

申请人： Nobuyuki Sakamoto

发明人： Nobuyuki Sakamoto

IPC分类号： H01R1/00

CPC分类号： H01R12/725 ,  H01R12/7047 ,  H01R12/707 ,  H01R13/502

摘要： In an onboard connector 10, an outer housing 11 is fixed to a circuit board 22 in such a manner that external connection portions 36, 39, 42, 42 and 45, projecting from respective first, second, third, fourth and fifth inner housings 13, 15, 17, 19 and 21, are disposed within respective mating connector-fitting through holes 25 and 30. The first, second, third, fourth and fifth inner housings 13, 15, 17, 19 and 21 and the outer housing 11 are mounted on the circuit board 22 in such a manner that these inner housings are disposed out of contact with the inner housing.

摘要翻译： 在机载连接器10中，外部壳体11以从外部连接部分36,39,42,42和45从相应的第一，第二，第三，第四和第五内部壳体13突出的方式固定到电路板22 ，15,17,19和21设置在相应的配合连接器配件通孔25和30内。 第一，第二，第三，第四和第五内部壳体13,15,17,19和21以及外部壳体11以这样的方式安装在电路板22上，使得这些内部壳体设置成与内部壳体 。

公开(公告)号：US07175445B2

公开(公告)日：2007-02-13

申请号：US10930485

申请日：2004-08-31

申请人： John Joseph Consoli ,  Brent Ryan Rothermel ,  James Lee Fedder ,  George Richard Defibaugh ,  Henry Otto Herman, Jr. ,  Lynn Robert Sipe

发明人： John Joseph Consoli ,  Brent Ryan Rothermel ,  James Lee Fedder ,  George Richard Defibaugh ,  Henry Otto Herman, Jr. ,  Lynn Robert Sipe

IPC分类号： H01R1/00

CPC分类号： H01R13/514 ,  H01R12/7088 ,  H01R12/724

摘要： An electrical connector is provided that includes a dielectric housing having a plurality of slots therein, and a plurality of electrical contacts disposed within at least one of the slots. A plurality of electrical wafers, are each received in one of the plurality of slots. Each wafer has a first edge and a second edge. Some of the plurality of electrical wafers are signal wafers and some of the plurality of wafers are power wafers. Each of the power wafers includes at least one trace and at least one contact pad. The contact pad is sized to mate with a predetermined number of the plurality of contacts to transfer a predetermined amount of current through the trace.

摘要翻译： 提供了一种电连接器，其包括其中具有多个狭槽的绝缘外壳和设置在至少一个狭槽内的多个电触点。 多个电晶片分别被接收在多个槽中的一个中。 每个晶片具有第一边缘和第二边缘。 多个电晶片中的一些是信号晶片，并且多个晶片中的一些是功率晶片。 每个功率晶片包括至少一个迹线和至少一个接触焊盘。 接触垫的尺寸设置成与预定数量的多个触点配合以将预定量的电流传送通过迹线。

公开(公告)号：US6126455A

公开(公告)日：2000-10-03

申请号：US363496

申请日：1999-07-29

申请人： Belgacem Haba

发明人： Belgacem Haba

IPC分类号： H01R12/70 ,  H05K3/32 ,  H01R1/00

CPC分类号： H01R12/7076 ,  H01R12/57 ,  H05K3/326 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49204 ,  Y10T29/49218

摘要： A socket for use with a semiconductor chip assembly having conductive joining units such as solder balls thereon. The socket includes a flexible dielectric element such as a polyimide sheet having a plurality of apertures extending through it. A backing element disposed beneath the dielectric element has holes of slightly larger diameter than the apertures, the holes being aligned with the apertures so that a lip region of the flexible dielectric element overlies each hole. The socket also includes contacts disposed adjacent to the holes and apertures. The joining units on the chip assembly are of larger diameter than the apertures but smaller than the holes. When the chip assembly is engaged with the socket, the dielectric element deforms. The joining units pass through the apertures and are retained in engagement with the socket, and in electrical contact with the contacts of the socket, by the dielectric element.

摘要翻译： 一种与半导体芯片组件一起使用的插座，其具有导电接合单元，例如其上的焊球。 插座包括柔性电介质元件，例如具有延伸穿过它的多个孔的聚酰亚胺片。 布置在电介质元件下面的背衬元件具有比孔稍大的直径的孔，孔与孔对齐，使得柔性介电元件的唇缘区域​​覆盖每个孔。 插座还包括邻近孔和孔设置的触点。 芯片组件上的接合单元的直径大于孔的直径，但小于孔。 当芯片组件与插座接合时，电介质元件变形。 接合单元通过孔并保持与插座接合，并通过电介质元件与插座的触点电接触。

公开(公告)号：US6051156A

公开(公告)日：2000-04-18

申请号：US77442

申请日：1998-05-28

申请人： Shigeyoshi Yoshida ,  Mitsuharu Sato ,  Koji Kamei

发明人： Shigeyoshi Yoshida ,  Mitsuharu Sato ,  Koji Kamei

IPC分类号： H01F1/00 ,  H01F1/113 ,  H01F1/26 ,  H01F1/37 ,  H01Q17/00 ,  H05K9/00 ,  H01R1/00

CPC分类号： H05K9/0083 ,  H01F1/0027 ,  H01F1/26 ,  H01F1/37 ,  H01Q17/00 ,  H01Q17/002 ,  H01Q17/004 ,  Y10T307/653

摘要： A thin electromagnetic interference suppressing body effective for electromagnetic interference suppression at a microwave band. As a material of the electromagnetic interference suppressing body, there is provided a composite magnetic body formed by bonding powder made of a semi-hard magnetic material by an organic bonding agent and having a high magnetic loss at the microwave band. As the semi-hard magnetic material, a metallic magnetic body, such as Fe--Co--Mo alloy, Co--Fe--Nb alloy or Fe--Co--V alloy, or an oxide magnetic body, such as .gamma.-Fe.sub.2 O.sub.3 or Co--Ti substituted Ba ferrite, can be used. Further, as an example of the organic bonding agent, polyurethane resin can be cited.

摘要翻译： PCT No.PCT / JP97 / 03396 371日期：1998年5月28日 102（e）日期1998年5月28日PCT 1997年9月24日PCT公布。 公开号WO98 / 14962 日期：1998年4月9日一种薄膜电磁干扰抑制体，对于微波波段的电磁干扰抑制有效。 作为电磁干扰抑制体的材料，提供了一种复合磁体，该复合磁体通过有机粘合剂将由半硬磁性材料制成的粉末粘合在微波带上而具有高的磁损耗而形成。 作为半硬磁性材料，可以使用诸如Fe-Co-Mo合金，Co-Fe-Nb合金或Fe-Co-V合金的金属磁性体，或诸如γ-Fe 2 O 3或Co- 可以使用Ti取代的Ba铁氧体。 此外，作为有机粘合剂的实例，可以列举聚氨酯树脂。

公开(公告)号：US08333596B2

公开(公告)日：2012-12-18

申请号：US13256582

申请日：2009-12-10

申请人： Kyoung il Kang ,  Yong Goo Lee ,  Jang Mook Lee ,  Nam Sik Lee

发明人： Kyoung il Kang ,  Yong Goo Lee ,  Jang Mook Lee ,  Nam Sik Lee

IPC分类号： H01R1/00

CPC分类号： H01R43/20 ,  H01R43/16 ,  H01R2201/02

摘要： There is provided a micro connector mounted on a printed circuit board (PCB) comprising a core conductor including a contact terminal formed of two or more insertion panels and a signal transmission panel; a body including a trunk formed in the shape of a barrel surrounding the contact terminal, and one or more projection arms extended from a bottom of the trunk; a dielectric; and a tail including a bottom panel disposed opposite to the signal transmission panel, interposing the body therebetween, and supporting the dielectric.

摘要翻译： 提供了一种安装在印刷电路板（PCB）上的微型连接器，该印刷电路板包括：芯导体，其包括由两个或更多个插入面板构成的接触端子和信号传输面板; 主体，其包括形成为围绕接触端子的筒状的躯干，以及从躯干的底部延伸的一个或多个突起臂; 电介质 以及包括与信号传输板相对设置的底板的尾部，将主体插入其间并支撑电介质。

公开(公告)号：US07775806B2

公开(公告)日：2010-08-17

申请号：US12322673

申请日：2009-02-05

申请人： Christian Heggemann ,  Jens Oesterhaus ,  Matthias Boensch ,  Matthias Niggemann ,  Michael Lenschen ,  Stephan Fehling ,  Torsten Diekmann

发明人： Christian Heggemann ,  Jens Oesterhaus ,  Matthias Boensch ,  Matthias Niggemann ,  Michael Lenschen ,  Stephan Fehling ,  Torsten Diekmann

IPC分类号： H01R1/00

CPC分类号： H05K7/1428 ,  H01R9/2625 ,  H05K1/182 ,  H05K3/0052 ,  H05K3/3405 ,  H05K2201/09145 ,  H05K2201/10189 ,  H05K2201/10446 ,  Y10T29/49149

摘要： A printed circuit board arrangement and method includes a planar generally-rectangular vertically-arranged printed circuit board having front and rear surfaces terminating in a peripheral edge, at least one of the front and rear surfaces having a conductive printed circuit thereon. The printed circuit board has a vertical side edge portion containing a recess, and arranged adjacent the recess is a fixed contact connected with a conductor portion of the printed circuit. A relatively narrow conductor housing arranged outside the peripheral edge of the printed circuit board is mounted in the recess with a movable contact carried by the housing in electrical engagement with the fixed contact. The connector housing is supported by a rear wall mounted on the rear surface of the printed circuit board, and by a resilient clip on the connector housing that engages the printed circuit board adjacent the recess.

摘要翻译： 一种印刷电路板布置和方法包括一个平面大致矩形的垂直布置的印刷电路板，其具有终止于周边边缘的前表面和后表面，其中前表面和后表面中的至少一个在其上具有导电印刷电路。 印刷电路板具有包含凹部的垂直侧边缘部分，并且邻近凹部设置有与印刷电路的导体部分连接的固定触点。 布置在印刷电路板的外围边缘外侧的较窄的导体外壳安装在凹部中，其中壳体与固定触点电连接地承载有可动触点。 连接器壳体由安装在印刷电路板的后表面上的后壁以及连接器壳体上的靠近凹部接合印刷电路板的弹性夹持件支撑。

公开(公告)号：US07121891B2

公开(公告)日：2006-10-17

申请号：US10953600

申请日：2004-09-28

申请人： Gabe Cherian

发明人： Gabe Cherian

IPC分类号： H01R1/00

CPC分类号： H01J5/54 ,  H01R33/22 ,  H01R33/9555

摘要： Three-Way Light Bulbs and Sockets can create a condition, where “light flicker” can occur. One way to correct the situation and to reduce the chance of having light flicker is described in this patent. It consists of introducing an “INTERPOSER”, between the light bulb and the socket. Several interposer designs and construction options are described in the patent, as well.

摘要翻译： 三光灯泡和插座可以创建一种可以发生“轻闪烁”的状态。 在该专利中描述了一种校正情况并减少轻微闪烁的机会的方法。 它包括在灯泡和插座之间引入“INTERPOSER”。 该专利还描述了几种插入件设计和构造选项。

公开(公告)号：US07053496B2

公开(公告)日：2006-05-30

申请号：US10608050

申请日：2003-06-27

申请人： Brent Stone

发明人： Brent Stone

IPC分类号： H01L23/58 ,  G01R31/02 ,  H01R1/00 ,  H01L21/44

CPC分类号： H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/00

摘要： A hybrid electronic circuit package (102, FIG. 1) includes non-insertable conductive features (110) and insertable conductive features (112) at a surface of the package. A hybrid receptacle (120), such as a socket, for example, includes non-insertable contacts (124) and insertable contacts (126), which are positioned in a complementary manner with the non-insertable and insertable features of the package. A vertical securement device (132, 134, 136) applies a vertical compressive force to the package (102) to compress the non-insertable features (110) against the non-insertable contacts (124). Further, a normal force securement device can be used to provide a sustained normal force to compress the insertable features and contacts together. In one embodiment, the non-insertable features are land grid array lands and the insertable features are low insertion force features.

摘要翻译： 混合电子电路封装（102，图1）在封装的表面处包括不可插入的导电特征（110）和可插入的导电特征（112）。 例如，诸如插座的混合容座（120）包括不可插入的触点（124）和可插入触点（126），其以与封装的不可插入和插入的特征互补的方式定位。 垂直固定装置（132,134,136）向包装（102）施加垂直的压缩力以将不可插入的特征（110）压靠在不可插入的触点（124）上。 此外，可以使用法向力固定装置来提供持续的法向力以将可插入特征和触点压缩在一起。 在一个实施例中，不可插入的特征是平面栅格阵列平台，并且可插入特征是低插入力特征。

公开(公告)号：US07014492B1

公开(公告)日：2006-03-21

申请号：US11001542

申请日：2004-11-30

申请人： Hui-Leng Lim ,  Patrick Wallace ,  Michael Suekawa

发明人： Hui-Leng Lim ,  Patrick Wallace ,  Michael Suekawa

IPC分类号： H01R12/00 ,  H01R1/00 ,  H01R13/62

CPC分类号： G06K19/077 ,  G06K7/0021

摘要： Described is a circuit assembly including a circuit board including a connector, a card connectable to the connector and an apparatus securing the card to the connector, wherein the apparatus includes a front portion in substantially close contact with the card and a back portion in substantially close contact with the card, the apparatus being coupled to the circuit board.

摘要翻译： 描述了一种电路组件，其包括电路板，其包括连接器，可连接到连接器的卡和将卡固定到连接器的装置，其中该装置包括与该卡基本紧密接触的前部和基本接近的后部 与卡接触，该装置耦合到电路板。