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    OPTICAL INTERCONNECTS AND METHODS OF FABRICATING SAME
    3.
    发明申请
    OPTICAL INTERCONNECTS AND METHODS OF FABRICATING SAME 审中-公开
    光学互连及其制作方法

    公开(公告)号：US20160109653A1

    公开(公告)日：2016-04-21

    申请号：US14884242

    申请日：2015-10-15

    申请人： GEORGIA TECH RESEARCH CORPORATION

    发明人： William A. Vis ,  Bruce Chia-Te Chou ,  Venkatesh Sundaram ,  Rao R. Tummala ,  Terry P. Bowen ,  Jibin Sun

    IPC分类号： G02B6/12 ,  G02B6/26 ,  G02B6/122 ,  G02B6/136 ,  G02B6/132

    CPC分类号： G02B6/1221 ,  G02B6/4202 ,  G02B2006/12069

    摘要： An embodiment provides an optical interconnect comprising first and second planar metallization layers, a glass substrate disposed between at least portions of the first and second metallization layers, an aperture in the second metallization layer having a first and second ends, and a polymer waveguide having a first end adjacent the first end of the aperture. The first end of the waveguide can have a first edge defining a first acute angle with respect to a top surface of the waveguide. The first end of the optical waveguide can be configured to receive an optical signal traversing through the glass substrate from a source proximate a first position on a top surface of the glass substrate and direct the optical signal with the first edge in a direction parallel to the glass substrate towards a second end of the waveguide.

    摘要翻译： 实施例提供了包括第一和第二平面金属化层的光学互连，设置在第一和第二金属化层的至少部分之间的玻璃衬底，第二金属化层中的孔具有第一和第二端，以及聚合物波导，其具有 第一端邻近孔的第一端。 波导的第一端可以具有相对于波导的顶表面限定第一锐角的第一边缘。 光波导的第一端可以被配置为接收从玻璃基板的顶表面附近的第一位置处的源极穿过玻璃基板的光信号，并且将光信号与第一边缘沿平行于玻璃基板的方向引导 玻璃基板朝向波导的第二端。

    Glass-Polymer Optical Interposer
    4.
    发明申请
    Glass-Polymer Optical Interposer 有权
    玻璃聚合物光学插件

    公开(公告)号：US20140355931A1

    公开(公告)日：2014-12-04

    申请号：US14288680

    申请日：2014-05-28

    申请人： Georgia Tech Research Corporation

    发明人： Rao R. Tummala ,  Chia-Te Chou ,  Venkatesh Sundaram

    IPC分类号： G02B6/122 ,  G02B6/136

    CPC分类号： G02B6/43 ,  H05K1/0274 ,  H05K2201/09827

    摘要： An optical interposer that includes a glass substrate having one or more optical vias extending through the glass substrate. A first optical polymer may be bonded to the substrate and to interior surfaces of the one or more optical vias. Implementations include one or more optical via cores comprising a second optical polymer that has a greater refractive index than the first optical polymer. The one or more optical via cores may be at least partially surrounded by the first optical polymer. Embodiments include encapsulated optical waveguides in communication with the optical vias and/or via cores. Example implementations include layers of electrical insulation, electrical traces, and electrical vias. A method of manufacture includes forming the optical vias by laser ablation. Certain embodiments may include chemically etching the inside of the vias to improve surface roughness.

    摘要翻译： 一种光学插入器，其包括具有延伸穿过玻璃基板的一个或多个光学通孔的玻璃基板。 第一光学聚合物可以结合到基底和一个或多个光学通孔的内表面。 实施方案包括一个或多个光学通孔芯，其包含具有比第一光学聚合物更大的折射率的第二光学聚合物。 一个或多个光学通孔芯可以至少部分地被第一光学聚合物包围。 实施例包括与光通孔和/或通孔芯通信的封装光波导。 示例实现包括电绝缘层，电迹线和电气通孔。 一种制造方法包括通过激光烧蚀形成光学通孔。 某些实施例可以包括化学蚀刻通孔内部以改善表面粗糙度。

    Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrate
    5.
    发明授权
    Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrate 有权
    在薄玻璃基板中具有聚合物填充或聚合物衬里光学通孔的插入件

    公开(公告)号：US09417415B2

    公开(公告)日：2016-08-16

    申请号：US14288680

    申请日：2014-05-28

    申请人： Georgia Tech Research Corporation

    发明人： Rao R. Tummala ,  Chia-Te Chou ,  Venkatesh Sundaram

    IPC分类号： G02B6/43 ,  G02B6/136 ,  H05K1/02

    CPC分类号： G02B6/43 ,  H05K1/0274 ,  H05K2201/09827

    摘要： An optical interposer that includes a glass substrate having one or more optical vias extending through the glass substrate. A first optical polymer may be bonded to the substrate and to interior surfaces of the one or more optical vias. Implementations include one or more optical via cores comprising a second optical polymer that has a greater refractive index than the first optical polymer. The one or more optical via cores may be at least partially surrounded by the first optical polymer. Embodiments include encapsulated optical waveguides in communication with the optical vias and/or via cores. Example implementations include layers of electrical insulation, electrical traces, and electrical vias. A method of manufacture includes forming the optical vias by laser ablation. Certain embodiments may include chemically etching the inside of the vias to improve surface roughness.

    摘要翻译： 一种光学插入器，其包括具有延伸穿过玻璃基板的一个或多个光学通孔的玻璃基板。 第一光学聚合物可以结合到基底和一个或多个光学通孔的内表面。 实施方案包括一个或多个光学通孔芯，其包含具有比第一光学聚合物更大的折射率的第二光学聚合物。 一个或多个光学通孔芯可以至少部分地被第一光学聚合物包围。 实施例包括与光通孔和/或通孔芯通信的封装光波导。 示例实现包括电绝缘层，电迹线和电气通孔。 一种制造方法包括通过激光烧蚀形成光学通孔。 某些实施例可以包括化学蚀刻通孔内部以改善表面粗糙度。