公开(公告)号：US20200118907A1

公开(公告)日：2020-04-16

申请号：US16705278

申请日：2019-12-06

Applicant: International Business Machines Corporation

Inventor： Thomas J. Brunschwiler ,  Timothy J. Chainer ,  Evan G. Colgan ,  Arvind Raj Mahankali Sridhar ,  Chin Lee Ong ,  Pritish R. Parida ,  Gerd Schlottig ,  Mark D. Schultz ,  Joel A. Silberman

IPC: H01L23/427 ,  H01L23/473 ,  H01L21/48

Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

公开(公告)号：US10596540B2

公开(公告)日：2020-03-24

申请号：US14973241

申请日：2015-12-17

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Alexey Y. Lvov ,  Stanislav Polonsky

IPC: C12Q1/68 ,  B01J19/00 ,  B01L3/00 ,  C12Q1/6874

Abstract: Apparatus and methods for using a flow cell array are provided herein. A method includes delivering multiple items of chemical matter independently to multiple reaction sites of a flow cell array across multiple distinct instances of time; imaging multiple parallel chemical reactions at the multiple reaction sites of the flow cell array; and recording an emission from each of the multiple chemical reactions site.

公开(公告)号：US20190298317A1

公开(公告)日：2019-10-03

申请号：US15943031

申请日：2018-04-02

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Evan G. Colgan ,  Minhua Lu ,  Vince S. Siu

IPC: A61B10/00 ,  A61B5/145 ,  A61B5/20 ,  G01N33/493

Abstract: A health analysis fixture includes a receptacle. A volume of water and a body fluid sample form a water line within the receptacle. A light-emitting device and a light-sensing device are disposed within the receptacle. A measurement device determines a height of the water line before and after an introduction of the body fluid sample. A computer processor is configured to receive sensor data from the light-sensing device, receive the determined height of the water line before and after the introduction of the body fluid sample from the measurement device, calculate a dilution factor for the body fluid sample from the received height of the water line before and after the introduction of the body fluid sample, receive sensor data from the light-sensing device, and interpret the received sensor data based on the dilution factor to generate health information therefrom.

公开(公告)号：US10232337B2

公开(公告)日：2019-03-19

申请号：US14973225

申请日：2015-12-17

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Alexey Y. Lvov ,  Stanislav Polonsky

IPC: B01J19/00 ,  B01L3/00 ,  C12Q1/6874

Abstract: Apparatus and methods for using a flow cell array are provided herein. A method includes determining placement of one or more reaction sites on a first component; providing a material for the one or more reaction sites in one or more surface channels of the first component; connecting the first component to a second component to form an array, wherein the one or more surface channels of the first component connect the one or more reaction sites with one or more vias, and wherein the second component comprises the one or more vias connected to multiple sub-surface channels; and aligning the one or more surface channels of the first component with the one or more vias of the second component to form a connection between the first component and the second component.

公开(公告)号：US10132433B2

公开(公告)日：2018-11-20

申请号：US15879567

申请日：2018-01-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Thomas J. Brunschwiler ,  Evan G. Colgan ,  Michael J. Ellsworth, Jr. ,  Gerd Schlottig

IPC: F16L21/03 ,  F28F1/00 ,  F16L37/098 ,  F16L37/138 ,  F28F3/12 ,  F28F9/02

Abstract: Conduit connectors for liquid manifolds and methods of fabrication are provided. In one embodiment, a conduit connector is recessed, at least in part, within a liquid manifold, and includes a conduit-receiving opening or socket and at least one releasable retention component. The conduit-receiving opening is disposed within the liquid manifold and in fluid communication with at least one liquid-carrying channel of the liquid manifold. The releasable retention component(s) is selectively operative to threadlessly secure in a fluid-tight manner a conduit within the conduit-receiving opening in fluid communication with the at least one liquid-carrying channel of the liquid manifold to facilitate flow of liquid through the liquid-carrying channel(s), or to release the conduit from the conduit-receiving opening of the conduit connector. The releasable retention component(s) resides at least partially within the liquid manifold when operatively holding the conduit within the conduit-receiving opening.

公开(公告)号：US20160358836A1

公开(公告)日：2016-12-08

申请号：US14732119

申请日：2015-06-05

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Yi Pan ,  Hilton T. Toy ,  Jeffrey A. Zitz

IPC: H01L23/367 ,  H05K3/30 ,  H01L21/52 ,  H01L23/04 ,  H01L23/498

CPC classification number: H01L21/52 ,  H01L23/04 ,  H01L23/16 ,  H01L23/3675 ,  H01L23/467 ,  H01L23/473 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00014 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16793 ,  H01L2924/171 ,  H01L2924/1715 ,  H01L2924/176 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/2018 ,  H01L2924/014

Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.

Abstract translation: 集成电路（IC）芯片模块包括载体，加强框架，IC芯片和第一定向散热器。 第二定向散热器还可以布置成与第一定向散热器正交。 载体具有构造成电连接到母板的顶表面和底表面。 加强框架包括容纳IC芯片并且可以附接到载体的顶表面的开口。 IC芯片同心地布置在加强框架的开口内。 第一定向散热器附接到加强框架和IC芯片，并且通常在第一相对的双向驱动器方向上移除热量。 当包括在IC芯片模块中时，第二定向散热器附接到加强框架和第一定向散热器，并且通常在与第一相对的双向驱动器方向正交的第二相对的双向驱动器方向上去除热量。

公开(公告)号：US09437515B2

公开(公告)日：2016-09-06

申请号：US14838524

申请日：2015-08-28

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC: H01L23/367 ,  H01L23/34 ,  H01L23/373 ,  H01L23/36 ,  H05K7/20 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

Abstract translation: 本发明的实施例包括芯片封装中均匀的散热帽元件，以便于更好的散热和散热。 散热帽包括由铜框架支撑的单个高K石墨层，用于在操作和操作期间增加稳定性和降低的热翘曲，同时通过减少常规热量所需的相对较低的热导率的材料的量来最小化热损失 散布帽

公开(公告)号：US09312761B2

公开(公告)日：2016-04-12

申请号：US14178791

申请日：2014-02-12

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Leland Chang ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bucknell C. Webb ,  Robert Wisnieff

IPC: H03K3/00 ,  H02M3/156 ,  H02M1/08 ,  G06F1/26 ,  H05K1/00

CPC classification number: H02M3/156 ,  G05F3/02 ,  G06F1/26 ,  G06F1/263 ,  G06F1/266 ,  H01L23/5286 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H02M1/08 ,  H05K1/00 ,  Y10T29/49117 ,  H01L2224/11 ,  H01L2924/014

Abstract: A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.

Abstract translation: 公开了一种集成电路中的开关电源，包括开关电源的集成电路和集成电路中的开关电源的组装方法。 在一个实施例中，本发明提供了一种包括器件层的集成电路中的三维开关电源。 开关电源包括与器件层串联布置的三个不同的层，三个不同的层包括包括开关电路的开关层，包括电容器组的电容器层和包括电感器的电感器层。 该开关电源还包括将器件层，开关层，电容层和电感层电连接和机械连接在一起的大量连接器。 开关电路，电容器和电感器形成用于向器件层供电的开关电源。

公开(公告)号：US20150371922A1

公开(公告)日：2015-12-24

申请号：US14838461

申请日：2015-08-28

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Taryn J. Davis ,  Chenzhou Lian ,  Yi Pan ,  Kamal K. Sikka ,  Jeffrey A. Zitz

IPC: H01L23/373

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K7/20509 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

公开(公告)号：US09059161B2

公开(公告)日：2015-06-16

申请号：US13623873

申请日：2012-09-20

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Evan G. Colgan ,  Robert L. Wisnieff

IPC: H05K1/03 ,  H05K1/18 ,  H05K1/14 ,  H05K1/02 ,  H01L23/498 ,  H01L23/15

CPC classification number: H01L23/49827 ,  H01L23/15 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/15788 ,  H05K1/0284 ,  H05K1/14 ,  H05K1/18 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A composite wiring circuit with electrical through connections and method of manufacturing the same. The composite wiring circuit includes a glass with first electrically-conducting through vias. The first electrically-conducting through vias pass from a top surface of the glass layer to a bottom surface of the glass layer. The composite wiring circuit further includes an interposer layer with second electrically-conducting through vias. The second electrically-conducting through vias pass from a top surface of the interposer layer to a bottom surface of the interposer layer. The second electrically-conducting through vias are electrically coupled to the first electrically-conducting through vias.

Abstract translation: 一种具有电气连接的复合布线电路及其制造方法。 复合布线电路包括具有第一导电通孔的玻璃。 第一导电通孔从玻璃层的顶表面传递到玻璃层的底表面。 复合布线电路还包括具有第二导电通孔的插入层。 第二导电通孔从中介层的顶表面传递到插入层的底表面。 第二导电通孔电耦合到第一导电通孔。