公开(公告)号：US20140210059A1

公开(公告)日：2014-07-31

申请号：US13752737

申请日：2013-01-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  Timothy W. Budell ,  Samuel R. Connor ,  Mark Curtis Hayes Lamorey ,  Janak G. Patel ,  Peter Slota, JR. ,  David B. Stone

IPC: H01L23/552 ,  H01L21/50

CPC classification number: H01L23/552 ,  H01L21/50 ,  H01L23/053 ,  H01L23/295 ,  H01L23/3128 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16172 ,  H01L2924/16178 ,  H01L2924/16179 ,  H01L2924/167 ,  H01L2924/1676 ,  H01L2924/16793 ,  H01L2924/16798 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/284 ,  H05K9/0081 ,  Y10T29/49128 ,  H01L2924/014

Abstract: Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An electromagnetic interference (EMI) shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material.

Abstract translation: 用于电子封装的装置和方法，其包含防止电磁干扰（EMI）发射的屏蔽。 根据集成电路结构，衬底在印刷电路板上。 集成电路芯片在基板上。 集成电路芯片电连接到基板。 电磁干扰（EMI）屏蔽单元位于集成电路芯片和基板上。 EMI屏蔽单元包括覆盖集成电路芯片的盖和集成电路芯片外的基板的部分。 填充材料可以沉积在形成在盖和基底之间的空腔内。 填充材料包括EMI吸收材料。 盖的周边包括侧裙，侧裙围绕集成电路芯片和衬底。 EMI吸收材料在印刷电路板上，并且侧裙的一部分嵌入在EMI吸收材料中。

公开(公告)号：US09401315B1

公开(公告)日：2016-07-26

申请号：US14669775

申请日：2015-03-26

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Paul F. Bodenweber ,  Taryn J. Davis ,  Marcus E. Interrante ,  Chenzhou Lian ,  Kenneth C. Marston ,  Kathryn C. Rivera ,  Kamal K. Sikka ,  Hilton T. Toy

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/492 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/10 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/492 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83201 ,  H01L2224/83447 ,  H01L2224/83493 ,  H01L2224/839 ,  H01L2224/83901 ,  H01L2924/16747 ,  H01L2924/16793 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/01006 ,  H01L2924/00014

Abstract: A semiconductor device package which includes a semiconductor package, a semiconductor device joined to the semiconductor package; and a lid to be placed over the semiconductor device and joined to the semiconductor package. The lid includes: a block of a first material having a first surface and a second surface, the second surface facing the semiconductor device, the block having perforations extending between the first surface and the second surface; inserts for filling the perforations, each of the inserts being made of a second material, at least one of the inserts protrudes beyond the second surface towards the semiconductor device; and a bonding material to bond the inserts to the block so that the at least one of the inserts protrudes beyond the second surface towards the semiconductor device. Also included is a method of assembling a semiconductor device package.

Abstract translation: 一种半导体器件封装，其包括半导体封装，与半导体封装相连接的半导体器件; 以及放置在半导体器件上并连接到半导体封装的盖子。 所述盖包括：第一材料的块，具有第一表面和第二表面，所述第二表面面向所述半导体器件，所述块具有在所述第一表面和所述第二表面之间延伸的穿孔; 用于填充穿孔的插入件，每个插入件由第二材料制成，至少一个插入件朝向半导体器件突出超过第二表面; 以及接合材料，以将所述插入件结合到所述块，使得所述插入件中的所述至少一个插入件朝向所述半导体器件突出超过所述第二表面。 还包括组装半导体器件封装的方法。

公开(公告)号：US20160358836A1

公开(公告)日：2016-12-08

申请号：US14732119

申请日：2015-06-05

Applicant: International Business Machines Corporation

Inventor： Evan G. Colgan ,  Yi Pan ,  Hilton T. Toy ,  Jeffrey A. Zitz

IPC: H01L23/367 ,  H05K3/30 ,  H01L21/52 ,  H01L23/04 ,  H01L23/498

CPC classification number: H01L21/52 ,  H01L23/04 ,  H01L23/16 ,  H01L23/3675 ,  H01L23/467 ,  H01L23/473 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/00014 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16793 ,  H01L2924/171 ,  H01L2924/1715 ,  H01L2924/176 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/2018 ,  H01L2924/014

Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, and a first directional heat spreader. A second directional heat spreader may further be arranged orthogonal to the first directional heat spreader. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes an opening that accepts the IC chip and may be attached to the top surface of the carrier. The IC chip is concentrically arranged within the opening of the stiffening frame. The first directional heat spreader is attached to the stiffening frame and to the IC chip and generally removes heat in a first opposing bivector direction. When included in the IC chip module, the second directional heat spreader is attached to the stiffening frame and to the first directional heat spreader and generally removes heat in a second opposing bivector direction orthogonal to the first opposing bivector direction.

Abstract translation: 集成电路（IC）芯片模块包括载体，加强框架，IC芯片和第一定向散热器。 第二定向散热器还可以布置成与第一定向散热器正交。 载体具有构造成电连接到母板的顶表面和底表面。 加强框架包括容纳IC芯片并且可以附接到载体的顶表面的开口。 IC芯片同心地布置在加强框架的开口内。 第一定向散热器附接到加强框架和IC芯片，并且通常在第一相对的双向驱动器方向上移除热量。 当包括在IC芯片模块中时，第二定向散热器附接到加强框架和第一定向散热器，并且通常在与第一相对的双向驱动器方向正交的第二相对的双向驱动器方向上去除热量。

公开(公告)号：US09245854B2

公开(公告)日：2016-01-26

申请号：US14515597

申请日：2014-10-16

Applicant: International Business Machines Corporation

Inventor： William L. Brodsky ,  Timothy W. Budell ,  Samuel R. Connor ,  Mark Curtis Hayes Lamorey ,  Janak G. Patel ,  Peter Slota, Jr. ,  David B. Stone

IPC: H01L23/552 ,  H01L23/29 ,  H05K3/28 ,  H05K9/00 ,  H01L21/50 ,  H01L23/31 ,  H01L23/053

CPC classification number: H01L23/552 ,  H01L21/50 ,  H01L23/053 ,  H01L23/295 ,  H01L23/3128 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16172 ,  H01L2924/16178 ,  H01L2924/16179 ,  H01L2924/167 ,  H01L2924/1676 ,  H01L2924/16793 ,  H01L2924/16798 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/284 ,  H05K9/0081 ,  Y10T29/49128 ,  H01L2924/014

Abstract: Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An EMI shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material.

Abstract translation: 用于电子封装的装置和方法，其包含防止电磁干扰（EMI）发射的屏蔽。 根据集成电路结构，衬底在印刷电路板上。 集成电路芯片在基板上。 集成电路芯片电连接到基板。 EMI屏蔽单元位于集成电路芯片和基板上。 EMI屏蔽单元包括覆盖集成电路芯片的盖和集成电路芯片外的基板的部分。 填充材料可以沉积在形成在盖和基底之间的空腔内。 填充材料包括EMI吸收材料。 盖的周边包括侧裙，侧裙围绕集成电路芯片和衬底。 EMI吸收材料在印刷电路板上，并且侧裙的一部分嵌入在EMI吸收材料中。

公开(公告)号：US08952503B2

公开(公告)日：2015-02-10

申请号：US13752737

申请日：2013-01-29

Applicant: International Business Machines Corporation

Inventor： William L. Brodsky ,  Timothy W. Budell ,  Samuel R. Connor ,  Mark Curtis Hayes Lamorey ,  Janak G. Patel ,  Peter Slota, Jr. ,  David B. Stone

IPC: H01L23/552 ,  H01L23/29 ,  H01L21/50 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/50 ,  H01L23/053 ,  H01L23/295 ,  H01L23/3128 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16172 ,  H01L2924/16178 ,  H01L2924/16179 ,  H01L2924/167 ,  H01L2924/1676 ,  H01L2924/16793 ,  H01L2924/16798 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/284 ,  H05K9/0081 ,  Y10T29/49128 ,  H01L2924/014

Abstract: Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An electromagnetic interference (EMI) shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material.

Abstract translation: 用于电子封装的装置和方法，其包含防止电磁干扰（EMI）发射的屏蔽。 根据集成电路结构，衬底在印刷电路板上。 集成电路芯片在基板上。 集成电路芯片电连接到基板。 电磁干扰（EMI）屏蔽单元位于集成电路芯片和基板上。 EMI屏蔽单元包括覆盖集成电路芯片的盖和集成电路芯片外的基板的部分。 填充材料可以沉积在形成在盖和基底之间的空腔内。 填充材料包括EMI吸收材料。 盖的周边包括侧裙，侧裙围绕集成电路芯片和衬底。 EMI吸收材料在印刷电路板上，并且侧裙的一部分嵌入在EMI吸收材料中。

公开(公告)号：US20150033554A1

公开(公告)日：2015-02-05

申请号：US14515597

申请日：2014-10-16

Applicant: International Business Machines Corporation

Inventor： William L. Brodsky ,  Timothy W. Budell ,  Samuel R. Connor ,  Mark Curtis Hayes Lamorey ,  Janak G. Patel ,  Peter Slota, JR. ,  David B. Stone

IPC: H05K3/28 ,  H01L23/552 ,  H05K9/00

CPC classification number: H01L23/552 ,  H01L21/50 ,  H01L23/053 ,  H01L23/295 ,  H01L23/3128 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16172 ,  H01L2924/16178 ,  H01L2924/16179 ,  H01L2924/167 ,  H01L2924/1676 ,  H01L2924/16793 ,  H01L2924/16798 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/284 ,  H05K9/0081 ,  Y10T29/49128 ,  H01L2924/014

Abstract: Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An EMI shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material.

Abstract translation: 用于电子封装的装置和方法，其包含防止电磁干扰（EMI）发射的屏蔽。 根据集成电路结构，衬底在印刷电路板上。 集成电路芯片在基板上。 集成电路芯片电连接到基板。 EMI屏蔽单元位于集成电路芯片和基板上。 EMI屏蔽单元包括覆盖集成电路芯片的盖和集成电路芯片外的基板的部分。 填充材料可以沉积在形成在盖和基底之间的空腔内。 填充材料包括EMI吸收材料。 盖的周边包括侧裙，侧裙围绕集成电路芯片和衬底。 EMI吸收材料在印刷电路板上，并且侧裙的一部分嵌入在EMI吸收材料中。