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公开(公告)号：US20220418134A1
公开(公告)日：2022-12-29
申请号：US17304855
申请日：2021-06-28
发明人： Noah Singer , Jeffrey Allen Zitz , Mark D. Schultz , John Torok , William L. Brodsky , Yuet-Ying Yu , Shawn Canfield
摘要： An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes an open position and a closed position.
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公开(公告)号：US20220418129A1
公开(公告)日：2022-12-29
申请号：US17304856
申请日：2021-06-28
发明人： Noah Singer , Jeffrey Allen Zitz , Mark D. Schultz , John Torok , Yuet-Ying Yu , William L. Brodsky , Shawn Canfield
摘要： An electronic module assembly is provided. The electronic module assembly may include one or more processors mounted to a laminate, a top frame mounted to the laminate and surrounding the one or more processors, and a removable lid covering the one or more processors. The removable lid includes latches arranged along a perimeter of the removable lid, the latches engage with a lip of the top frame and secure the removable lid to the module assembly, and the removable lid can only be removed from the module assembly by releasing all of the latches.
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公开(公告)号：US11122682B2
公开(公告)日：2021-09-14
申请号：US15944898
申请日：2018-04-04
发明人： James A. Busby , John R. Dangler , Mark K. Hoffmeyer , William L. Brodsky , William Santiago-Fernandez , David C. Long , Silvio Dragone , Michael J. Fisher , Arthur J. Higby
摘要： Tamper-respondent assemblies and fabrication methods are provided which utilize liquid crystal polymer layers in solid form. The tamper-respondent assemblies include a circuit board, and an enclosure assembly mounted to the circuit board to enclose one or more electronic components coupled to the circuit board within a secure volume. The assembly includes a tamper-respondent sensor that is a three-dimensional multilayer sensor structure, which includes multiple liquid crystal polymer layers, and at least one tamper-detect circuit. The at least one tamper-detect circuit includes one or more circuit lines in a tamper-detect pattern disposed on at least one liquid crystal polymer layer of the multiple liquid crystal polymer layers. Further, a monitor circuit is provided disposed within the secure volume to monitor the at least one tamper-detect circuit of the tamper-respondent sensor for a tamper event.
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公开(公告)号：US20190380877A1
公开(公告)日：2019-12-19
申请号：US16010807
申请日：2018-06-18
发明人： John S. Werner , Byron S. Green , Arkadiy O. Tsfasman , William L. Brodsky , Robert K. Mullady , Jeffrey A. Newcomer
IPC分类号： A61F11/14
摘要： Acoustic attenuating ear muffs is provided with a first ear pod including a first ear cup having an inner surface and an outer surface, and a first acoustic attenuating member including a first opening coupled to the first ear cup. A second ear pod includes a second ear cup having an inner surface portion and an outer surface portion, and a second acoustic attenuating member including a second opening coupled to the second ear cup. A connecting member links the first ear pod to the second ear pod. A first selectively deployable plug member is arranged between the inner surface and the first acoustic attenuating member. A second selectively deployable plug member is arranged between the inner surface portion and the second acoustic attenuating member.
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公开(公告)号：US10395067B2
公开(公告)日：2019-08-27
申请号：US15249671
申请日：2016-08-29
摘要： Methods of fabricating tamper-respondent assemblies and electronic assembly packages are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
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公开(公告)号：US10229806B2
公开(公告)日：2019-03-12
申请号：US15813858
申请日：2017-11-15
发明人： William L. Brodsky , Byron S. Green , Robert K. Mullady , Jeffrey A. Newcomer , Arkadiy O. Tsfasman , John S. Werner
IPC分类号： H01R11/00 , H01H71/46 , H01R13/703 , H01R103/00 , H01R24/30 , H01R24/78
摘要： A plug comprises power contacts and a trip jumper having jumper contacts configured to make a trip connection, during a plugging action with the plug and a receptacle, with mating trip contacts in the receptacle. When the receptacle is connected to electrical power during the plugging action, a current over the trip connection can cause disconnection of a receptacle power contact from the power. A receptacle comprises receptacle power contacts and a trip circuit having receptacle trip contacts configured to make a trip connection, during a plugging action with the receptacle and plug, with mating trip contacts in the plug. When the receptacle is connected to electrical power during the plugging action, a current over the trip connection can cause disconnection of power to a receptacle power contact. A system can have an electrical device with a line cord connected to the plug.
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公开(公告)号：US10175064B2
公开(公告)日：2019-01-08
申请号：US14865610
申请日：2015-09-25
发明人： William L. Brodsky , Silvio Dragone , Roger S. Krabbenhoft , David C. Long , Stefano S. Oggioni , Michael T. Peets , William Santiago-Fernandez
摘要： Electronic circuits, electronic packages, and methods of fabrication are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.
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公开(公告)号：US10143090B2
公开(公告)日：2018-11-27
申请号：US14886179
申请日：2015-10-19
摘要： Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes, for instance, a tamper-respondent sensor having at least one flexible layer and paired conductive lines disposed on the at least one flexible layer. The paired conductive lines form, at least in part, at least one tamper-detect network of the tamper-respondent sensor. The tamper-respondent electronic circuit structure further includes monitor circuitry electrically connected to the paired conductive lines to differentially monitor the paired conductive lines for a tamper event. In enhanced embodiments, multiple interconnect vias electrically connect to two or more layers of paired conductive lines and are disposed in an unfolded interconnect area of the tamper-respondent sensor when the sensor is operatively positioned about an electronic component or assembly to be protected.
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公开(公告)号：US20180303011A1
公开(公告)日：2018-10-18
申请号：US16008112
申请日：2018-06-14
IPC分类号： H05K9/00 , H01R13/6584 , H01R13/6592 , H01R13/74
CPC分类号： H05K9/0016 , H01R13/6584 , H01R13/6592 , H01R13/74 , H05K9/0015
摘要： A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.
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公开(公告)号：US20180123278A1
公开(公告)日：2018-05-03
申请号：US15814023
申请日：2017-11-15
发明人： William L. Brodsky , Byron S. Green , Robert K. Mullady , Jeffrey A. Newcomer , Arkadiy O. Tsfasman , John S. Werner
IPC分类号： H01R13/44 , H01R13/71 , H01R13/703
CPC分类号： H01R13/44 , H01R13/703 , H01R13/71
摘要： A plug comprises power contacts and a plug trip contact. During a plugging action between the plug and a receptacle, the plug trip contact makes a trip connection with mating contacts in the receptacle. Electrical power to the receptacle allows a current through the trip connection, which causes disconnection of the power to the receptacle. A receptacle comprises receptacle power contacts and receptacle trip contacts. During a plugging action between the receptacle and a plug, trip contacts in the receptacle makes a trip connection with a mating contact in the plug. Electrical power to the receptacle allows a current through the trip connection, which can cause disconnection of the power to the receptacle. The receptacle can be included in an enclosure having a trip breaker with a trip mechanism. An electrical system can have an electrical device with a line cord connected to a plug having the trip contact.
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