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公开(公告)号：US10334722B2
公开(公告)日：2019-06-25
申请号：US15800497
申请日：2017-11-01
IPC分类号： H05K1/02 , H05K1/03 , H05K1/18 , H05K1/09 , H05K7/02 , H05K3/30 , H05K3/12 , H05K3/46 , H05K5/02
摘要： Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≤200 μm, as well as a line-to-line spacing width Ws≤200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
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公开(公告)号：US09858776B1
公开(公告)日：2018-01-02
申请号：US15194738
申请日：2016-06-28
CPC分类号： G08B13/128 , G01N27/205 , H05K1/0275 , H05K1/0296 , H05K1/182 , H05K2201/10151
摘要： Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor and a detector. The at least one tamper-respondent sensor includes conductive lines which form, at least in part, at least one tamper-detect network of the tamper-respondent sensor(s). The detector monitors the tamper-respondent sensor(s) by applying an electrical signal to the conductive lines of the at least one tamper-respondent sensor to monitor for a non-linear conductivity change indicative of a tamper event at the tamper-respondent sensor(s). For instance, the detector may monitor a second harmonic of the electrical signal applied to the conductive lines for the non-linear conductivity change indicative of the tamper event, such as an attempted shunt of one or more conductive lines of the tamper-respondent sensor(s).
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公开(公告)号：US10331915B2
公开(公告)日：2019-06-25
申请号：US15819540
申请日：2017-11-21
摘要： Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
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公开(公告)号：US10169967B1
公开(公告)日：2019-01-01
申请号：US16048622
申请日：2018-07-30
IPC分类号： G08B13/12
摘要： Tamper-respondent assemblies and methods of fabrication are provided which include a multi-layer stack having multiple discrete component layers stacked and electrically connected together via a plurality of electrical contacts in between the component layers. Further, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure embedded within the multi-layer stack. The tamper-respondent electronic circuit structure includes at least one tamper-respondent sensor embedded, at least in part, within at least one component layer of the multiple discrete component layers of the multi-layer stack. The tamper-respondent electronic circuit structure defines a secure volume within the multi-layer stack. For instance, the tamper-respondent electronic circuit structure may be fully embedded within the multi-layer stack, with monitor circuitry of the tamper-respondent electronic circuit structure residing within the secure volume within the multi-layer stack.
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公开(公告)号：US09911012B2
公开(公告)日：2018-03-06
申请号：US14865572
申请日：2015-09-25
CPC分类号： G06F21/87 , G06F21/75 , H01R12/59 , H05K1/0275 , H05K5/0208 , H05K5/03 , H05K2201/055 , H05K2201/056
摘要： Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
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公开(公告)号：US10395067B2
公开(公告)日：2019-08-27
申请号：US15249671
申请日：2016-08-29
摘要： Methods of fabricating tamper-respondent assemblies and electronic assembly packages are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
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公开(公告)号：US10217336B2
公开(公告)日：2019-02-26
申请号：US16048650
申请日：2018-07-30
IPC分类号： G08B13/12
摘要： Tamper-respondent assemblies and methods of fabrication are provided which include a multi-layer stack having multiple discrete component layers stacked and electrically connected together via a plurality of electrical contacts in between the component layers. Further, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure embedded within the multi-layer stack. The tamper-respondent electronic circuit structure includes at least one tamper-respondent sensor embedded, at least in part, within at least one component layer of the multiple discrete component layers of the multi-layer stack. The tamper-respondent electronic circuit structure defines a secure volume within the multi-layer stack. For instance, the tamper-respondent electronic circuit structure may be fully embedded within the multi-layer stack, with monitor circuitry of the tamper-respondent electronic circuit structure residing within the secure volume within the multi-layer stack.
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公开(公告)号：US10172239B2
公开(公告)日：2019-01-01
申请号：US14865551
申请日：2015-09-25
IPC分类号： G06F21/87 , H05K3/10 , G06F21/72 , H05K1/02 , H05K1/03 , H05K1/14 , H05K1/16 , H05K3/06 , H05K3/36
摘要： Tamper-respondent electronic circuit structures, electronic assembly packages, and methods of fabrication are provided which include, at least in part, a tamper-respondent sensor. The tamper-respondent sensor includes one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.
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公开(公告)号：US10169968B1
公开(公告)日：2019-01-01
申请号：US16048634
申请日：2018-07-30
IPC分类号： G08B13/12
摘要： Tamper-respondent assemblies and methods of fabrication are provided which include a multi-layer stack having multiple discrete component layers stacked and electrically connected together via a plurality of electrical contacts in between the component layers. Further, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure embedded within the multi-layer stack. The tamper-respondent electronic circuit structure includes at least one tamper-respondent sensor embedded, at least in part, within at least one component layer of the multiple discrete component layers of the multi-layer stack. The tamper-respondent electronic circuit structure defines a secure volume within the multi-layer stack. For instance, the tamper-respondent electronic circuit structure may be fully embedded within the multi-layer stack, with monitor circuitry of the tamper-respondent electronic circuit structure residing within the secure volume within the multi-layer stack.
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公开(公告)号：US10143090B2
公开(公告)日：2018-11-27
申请号：US14886179
申请日：2015-10-19
摘要： Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes, for instance, a tamper-respondent sensor having at least one flexible layer and paired conductive lines disposed on the at least one flexible layer. The paired conductive lines form, at least in part, at least one tamper-detect network of the tamper-respondent sensor. The tamper-respondent electronic circuit structure further includes monitor circuitry electrically connected to the paired conductive lines to differentially monitor the paired conductive lines for a tamper event. In enhanced embodiments, multiple interconnect vias electrically connect to two or more layers of paired conductive lines and are disposed in an unfolded interconnect area of the tamper-respondent sensor when the sensor is operatively positioned about an electronic component or assembly to be protected.
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