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公开(公告)号:US20240121890A1
公开(公告)日:2024-04-11
申请号:US17963138
申请日:2022-10-10
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Arthur J. Higby , DAVID CLIFFORD LONG , James Busby , William Santiago-Fernandez , John R. Dangler , Russell A. Budd , Philipp K Buchling Rego , Hannah Wendling , Lauren Boston
CPC classification number: H05K1/0275 , H05K1/0292 , H05K5/0208 , H05K5/0217
Abstract: A structure of a circuitry substrate for securing an area from tampering is disclosed. The structure includes a circuitry substrate with at least one of a top tamper enclosure and a bottom tamper enclosure covering a component in a protected area of the circuitry substrate. The top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry substrate, and a tear initiation site is added to a side of the perimeter of circuitry substrate bordering the protected area that includes at least one tamper enclosure, such that the tear initiation site is located and configured to enable propagation of a delamination of at least one internal layer of the circuitry substrate and a severing of a security circuit when a removal force is applied to the at least one of the top tamper enclosure and the bottom tamper enclosure.
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公开(公告)号:US11822707B2
公开(公告)日:2023-11-21
申请号:US17335185
申请日:2021-06-01
Applicant: International Business Machines Corporation
Inventor: William Santiago-Fernandez , Russell A. Budd , James Busby , Arthur J Higby , Michael Fisher , Silvio Dragone , Stefano Sergio Oggioni , David Clifford Long
CPC classification number: G06F21/87 , H05K1/0275 , H05K2201/10151
Abstract: A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.
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3.
公开(公告)号:US20220201839A1
公开(公告)日:2022-06-23
申请号:US17124621
申请日:2020-12-17
Applicant: International Business Machines Corporation
Inventor: John R. Dangler , Arthur J. Higby , Philipp K. Buchling Rego , DAVID CLIFFORD LONG , James Busby , MATTHEW DOYLE , Edward N. Cohen , MICHAEL FISHER , William Santiago-Fernandez
Abstract: A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.
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公开(公告)号:US20200334175A1
公开(公告)日:2020-10-22
申请号:US16389530
申请日:2019-04-19
Applicant: International Business Machines Corporation
IPC: G06F13/16 , H04L9/08 , G06F21/62 , G06F9/30 , G06F9/4401
Abstract: The present disclosure relates to a computer-implemented method for controlling operation of multiple computational engines of a physical computing device. The computer-implemented method includes providing a multiplexer module in the device, the multiplexer module including a first and second memory region. The multiplexer module may receive from a first driver at the multiplexer module a data processing request to be processed by a first set of one or more computational engines of the computational engines. Subsequent to receiving the data processing request, the multiplexer module may assign a request sub-region of the first region and a response sub-region of the second region to the first driver. Data indicative of the request sub-region and the response sub-region may be submitted to the first driver. Results of processing the request may be received at the response sub-region.
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公开(公告)号:US10299372B2
公开(公告)日:2019-05-21
申请号:US15275748
申请日:2016-09-26
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Silvio Dragone , Stefano S. Oggioni , William Santiago-Fernandez
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a multilayer circuit board, a tamper-detection sensor, and a vent structure. The tamper-detection sensor is embedded within the multilayer circuit board, and defines, at least in part, a secure volume associated with the multilayer circuit board. The vent structure is incorporated into the multilayer circuit board, and includes at least one vent channel. The vent channel(s) is in fluid communication with a space within the secure volume to facilitate venting the space of the secure volume. The space within the secure volume may accommodate, for instance, one or more electronic components to be protected, and the at least one vent channel may, for instance, allow air pressure within the space of the secure volume to equalize with air pressure external to the tamper-respondent assembly.
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公开(公告)号:US10172232B2
公开(公告)日:2019-01-01
申请号:US15827275
申请日:2017-11-30
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: William L. Brodsky , James A. Busby , Edward N. Cohen , Silvio Dragone , Michael J. Fisher , David C. Long , Michael T. Peets , William Santiago-Fernandez , Thomas Weiss
Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.
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公开(公告)号:US10169967B1
公开(公告)日:2019-01-01
申请号:US16048622
申请日:2018-07-30
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: James A. Busby , Phillip Duane Isaacs , William Santiago-Fernandez
IPC: G08B13/12
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a multi-layer stack having multiple discrete component layers stacked and electrically connected together via a plurality of electrical contacts in between the component layers. Further, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure embedded within the multi-layer stack. The tamper-respondent electronic circuit structure includes at least one tamper-respondent sensor embedded, at least in part, within at least one component layer of the multiple discrete component layers of the multi-layer stack. The tamper-respondent electronic circuit structure defines a secure volume within the multi-layer stack. For instance, the tamper-respondent electronic circuit structure may be fully embedded within the multi-layer stack, with monitor circuitry of the tamper-respondent electronic circuit structure residing within the secure volume within the multi-layer stack.
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公开(公告)号:US09575769B2
公开(公告)日:2017-02-21
申请号:US14679533
申请日:2015-04-06
Applicant: International Business Machines Corporation
Inventor: Vincenzo Condorelli , Silvio Dragone , William Santiago-Fernandez , Tamas Visegrady
IPC: G06F9/00 , G06F15/177 , G06F9/44 , G06F21/57 , G06F12/02 , G06F13/40 , G06F9/445 , G05B19/05 , G06F11/14
CPC classification number: G06F9/4403 , G05B19/056 , G06F8/63 , G06F8/65 , G06F8/654 , G06F9/4401 , G06F9/44505 , G06F11/1433 , G06F12/0246 , G06F13/4022 , G06F21/575
Abstract: A method for updating code images in a system includes booting a first image of a code with a sub-system processor, receiving a second image of the code, performing a security and reliability check of the second image of the code with the sub-system processor, determining whether the security and reliability check of the second image of the code is successful, storing the second image of the code in a first memory device responsive to determining that the security and reliability check of the second image of the code is successful, designating the second image of the code as an active image, and sending the second image of the code to a second memory device, the second memory device communicatively connected with the first memory device and a main processor.
Abstract translation: 一种用于更新系统中的代码图像的方法包括用子系统处理器引导代码的第一图像,接收代码的第二图像,使用子系统执行代码的第二图像的安全性和可靠性检查 处理器,确定代码的第二图像的安全性和可靠性检查是否成功,将代码的第二图像存储在第一存储器设备中,以响应于确定代码的第二图像的安全性和可靠性检查成功, 将代码的第二图像指定为活动图像,以及将代码的第二图像发送到第二存储器设备,与第一存储器设备和主处理器通信地连接的第二存储器设备。
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9.
公开(公告)号:US11382210B1
公开(公告)日:2022-07-05
申请号:US17124621
申请日:2020-12-17
Applicant: International Business Machines Corporation
Inventor: John R. Dangler , Arthur J Higby , Philipp K Buchling Rego , David Clifford Long , James Busby , Matthew Doyle , Edward N. Cohen , Michael Fisher , William Santiago-Fernandez
Abstract: A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.
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公开(公告)号:US11244079B2
公开(公告)日:2022-02-08
申请号:US16574822
申请日:2019-09-18
Applicant: International Business Machines Corporation
Inventor: Matteo Cocchini , Silvio Dragone , Stefano Sergio Oggioni , James Busby , William Santiago-Fernandez
Abstract: Provided is a method for masking a sensitive signal by injecting noise into planes of a printed circuit board (PCB). The method comprises detecting, by a secondary integrated circuit (IC), a noise signal on a shared plane of a PCB that includes the secondary IC. The noise signal may be analyzed to determine the characteristics of the noise signal. A masking signal may be generated based on the characteristics. The masking signal may then be injected onto the shared plane.
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