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    Tamper detection at enclosure-to-board interface
    2.
    发明授权
    Tamper detection at enclosure-to-board interface 有权

    公开(公告)号：US10595401B1

    公开(公告)日：2020-03-17

    申请号：US16424874

    申请日：2019-05-29

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： James A. Busby ,  Arthur J. Higby ,  David C. Long ,  Michael J. Fisher ,  Russell A. Budd ,  Michel Turgeon ,  Sylvain Tetreault

    IPC分类号： H05K1/02 ,  H05K5/02 ,  H05K1/18 ,  H05K3/06 ,  H05K3/00 ,  H05K3/46

    摘要： Tamper-respondent assemblies are provided which include an enclosure assembly mounted to a circuit board and enclosing an electronic component(s) within a secure volume. The enclosure assembly includes an enclosure with an edge surface coupled to the circuit board, and a tamper-respondent sensor. The tamper-respondent sensor covers the edge surface and an inner surface of the enclosure. The sensor includes multiple layers, and at least one tamper-detect circuit. The tamper-detect circuit(s) includes a conductive trace(s) in a tamper-detect pattern covered, at least in part, by at least one layer of the multiple layers. The at least one layer is partially removed to provide exposed regions and unexposed regions of the conductive trace(s) at the edge surface of the enclosure. The conductive trace(s) is contacted where exposed by an adhesive securing the sensor to the circuit board. A monitor circuit monitors the tamper-detect circuit(s) for a tamper event.

    Tamper-respondent assembly with vent structure
    5.
    发明授权
    Tamper-respondent assembly with vent structure 有权

    公开(公告)号：US09913389B2

    公开(公告)日：2018-03-06

    申请号：US14955283

    申请日：2015-12-01

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  Robert Weiss ,  Thomas Weiss ,  James E. Tersigni

    IPC分类号： H05K7/00 ,  H05K5/02 ,  G06F21/00 ,  G06F21/86

    CPC分类号： H05K5/0208 ,  G06F21/00 ,  G06F21/86

    摘要： Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.

    Tamper-respondent assemblies with bond protection
    6.
    发明授权
    Tamper-respondent assemblies with bond protection 有权

    公开(公告)号：US10264665B2

    公开(公告)日：2019-04-16

    申请号：US15835557

    申请日：2017-12-08

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： William L. Brodsky ,  James A. Busby ,  Zachary T. Dreiss ,  Michael J. Fisher ,  David C. Long ,  William Santiago-Fernandez ,  Thomas Weiss

    IPC分类号： H05K1/02 ,  H05K5/02 ,  G06F21/87 ,  H05K1/18

    摘要： Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).

    Applying pressure to adhesive using CTE mismatch between components
    8.
    发明授权
    Applying pressure to adhesive using CTE mismatch between components 有权
    使用组分之间的CTE不匹配对粘合剂施加压力

    公开(公告)号：US09555606B1

    公开(公告)日：2017-01-31

    申请号：US14963681

    申请日：2015-12-09

    申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

    发明人： Michael J. Fisher ,  David C. Long ,  Donald Merte ,  Robert Weiss ,  Thomas Weiss

    IPC分类号： B32B37/10 ,  B32B37/12

    CPC分类号： H05K3/284 ,  F16B11/006

    摘要： Assembly apparatuses and processes are provided which include a pressure cure fixture. The pressure cure fixture is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container. When heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container.

    摘要翻译： 提供了包括压力固化夹具的组装装置和工艺。 压力固化夹具的尺寸设置成容纳在诸如电子外壳的容器内，并且有助于将压力施加到设置在容器的内表面上的粘合剂。 压力固化夹具由具有比容器更高的热膨胀系数（CTE）的材料形成，并且其尺寸设计成至少部分地对应于容器的内部空间，同时允许粘合剂和表面 - 安装元件设置在压力固化夹具和容器的内表面之间。 当加热时，压力固化夹具比容器膨胀得更大，并将压力赋予表面安装元件和粘合剂，以便于将表面安装元件固定到容器的内表面。