公开(公告)号：US09853014B2

公开(公告)日：2017-12-26

申请号：US15275752

申请日：2016-09-26

Applicant: FUJITSU LIMITED

Inventor： Ryo Kikuchi ,  Nobuhiro Imaizumi ,  Hiroshi Onuki

IPC: H01L23/52 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0214 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/0225 ,  H01L2224/02255 ,  H01L2224/0226 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/0239 ,  H01L2224/03001 ,  H01L2224/036 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05005 ,  H01L2224/05014 ,  H01L2224/05022 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/0519 ,  H01L2224/05195 ,  H01L2224/05287 ,  H01L2224/0529 ,  H01L2224/05395 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/12105 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/13014 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/14051 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/03 ,  H01L2224/11 ,  H01L21/304 ,  H01L21/76898 ,  H01L2224/81 ,  H01L2924/0665 ,  H01L2924/00

Abstract: An electronic component includes a substrate configured to include a first portion that first thermal conductivity, and have a first surface and a second surface opposite to the first surface; a second portion configured to be formed inside the first portion, and have second thermal conductivity lower than the first thermal conductivity; a first terminal configured to be formed to correspond to the second portion on a side of the first surface; and a second terminal configured to be formed on a side of the second surface.

公开(公告)号：US20170098631A1

公开(公告)日：2017-04-06

申请号：US15275752

申请日：2016-09-26

Applicant: FUJITSU LIMITED

Inventor： Ryo Kikuchi ,  Nobuhiro IMAIZUMI ,  Hiroshi Onuki

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0214 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/0225 ,  H01L2224/02255 ,  H01L2224/0226 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/0239 ,  H01L2224/03001 ,  H01L2224/036 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05005 ,  H01L2224/05014 ,  H01L2224/05022 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/0519 ,  H01L2224/05195 ,  H01L2224/05287 ,  H01L2224/0529 ,  H01L2224/05395 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/12105 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/13014 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/14051 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/03 ,  H01L2224/11 ,  H01L21/304 ,  H01L21/76898 ,  H01L2224/81 ,  H01L2924/0665 ,  H01L2924/00

Abstract: An electronic component includes a substrate configured to include a first portion that first thermal conductivity, and have a first surface and a second surface opposite to the first surface;a second portion configured to be formed inside the first portion, and have second thermal conductivity lower than the first thermal conductivity;a first terminal configured to be formed to correspond to the second portion on a side of the first surface; and a second terminal configured to be formed on a side of the second surface.

公开(公告)号：US20170250153A1

公开(公告)日：2017-08-31

申请号：US15397314

申请日：2017-01-03

Applicant: FUJITSU LIMITED

Inventor： Ryo Kikuchi ,  TOSHIYA AKAMATSU

IPC: H01L23/00

CPC classification number: H01L24/14 ,  H01L23/3121 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/13007 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/1403 ,  H01L2224/16112 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/85447 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/13091 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/16225 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/013 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01022 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2924/06

Abstract: An electronic part includes a substrate, an insulating film formed over the substrate, a first pillar electrode, a first solder formed over the first pillar electrode, a second pillar electrode, and a second solder formed over the second pillar electrode. The first pillar electrode over which the first solder is formed is formed over a first region of an insulating film including a level difference between a first opening portion and a peripheral portion of the first opening portion. The second pillar electrode over which the second solder is formed is formed over a second region of the insulating film including a second opening portion whose opening area is larger than that of the first opening portion. For example, the second pillar electrode over which the second solder is formed is formed over the second opening portion of the insulating film.