公开(公告)号：US20190332913A1

公开(公告)日：2019-10-31

申请号：US16366446

申请日：2019-03-27

Applicant: FUJITSU LIMITED ,  FUJITSU FRONTECH LIMITED

Inventor： Hiroshi Onuki ,  Shunji Baba ,  Yoshiyasu Sugimura ,  Tsuyoshi Niwata ,  Hideo Miyazawa ,  Mimpei Miura ,  Akihiko Saito

IPC: G06K19/077 ,  H01Q1/22

Abstract: An RFID tag includes an antenna extending in a longitudinal direction and a reinforcing member extending such that the center thereof projects to opposite sides in a transverse direction. The reinforcing member includes first and second crossover edge portions crossing with the antenna at one and the other side in the longitudinal direction, a first inclination edge portion inclined so as to approach the antenna from the center side toward one side in the longitudinal direction, a second inclination edge portion inclined so as to approach the antenna from the center side toward the other side in the longitudinal direction, a third inclination edge portion inclined so as to approach the antenna from the center side toward one side in the longitudinal direction, and a fourth inclination edge portion inclined so as to approach the antenna from the center side toward the other side in the longitudinal direction.

公开(公告)号：US20160366793A1

公开(公告)日：2016-12-15

申请号：US15156375

申请日：2016-05-17

Applicant: FUJITSU LIMITED

Inventor： Shunichi Kikuchi ,  Yoshihisa IWAKIRI ,  Naoaki Nakamura ,  Hiroshi Onuki

IPC: H05K7/20 ,  F28F9/02 ,  F28D15/00

CPC classification number: H05K7/20781 ,  F28D15/00 ,  F28D2021/0028 ,  F28F3/12 ,  F28F9/0204 ,  F28F9/026 ,  F28F13/00 ,  F28F2270/00 ,  H05K7/20736

Abstract: A channel distribution type cooling plate where a space between a first coolant storage part for inflow of coolant and a second cooling storage part for outflow of coolant formed at the two ends of an upper space of a main body provided with a lower space for removing heat of a heat generating member is partitioned by a meandering type partition wall to form coolant distribution paths connected to the first coolant storage part and coolant collection paths connected to the second coolant storage part, the bottom of the coolant distribution paths and the coolant collection paths are communicated by a plurality of through holes with the lower space, and side surfaces of the partition wall at the coolant distribution path sides are formed with subchannels for running coolant from the first coolant storage part, in order to improve the cooling efficiency at the coolant outlet side.

Abstract translation: 一种通道分配型冷却板，其特征在于，在冷却剂流入的第一冷却剂储存部和形成在主体的上部空间的两端的冷却剂的第二冷却储存部之间的空间设置有用于除热的下部空间 的发热构件被蜿蜒型分隔壁隔开以形成连接到第一冷却剂储存部分的冷却剂分配路径和连接到第二冷却剂储存部分的冷却剂收集路径，冷却剂分配路径的底部和冷却剂收集路径是 由具有较低空间的多个通孔连通，并且在冷却剂分配路径侧的分隔壁的侧表面形成有用于从第一冷却剂储存部分运行冷却剂的子通道，以便提高冷却剂出口处的冷却效率 侧。

公开(公告)号：US20210375771A1

公开(公告)日：2021-12-02

申请号：US17177247

申请日：2021-02-17

Applicant: FUJITSU LIMITED

Inventor： KENJI FUKUZONO ,  MANABU WATANABE ,  Yuki Hoshino ,  Hiroshi Onuki

IPC: H01L23/538 ,  H01L25/18

Abstract: An electronic device includes a bus bar that includes a first terminal and a second terminal and extends between the first terminal and the second terminal on a side of a first surface of a substrate; first solder configured to pass through the substrate in a thickness direction and connect a first through terminal connected to a first electronic component that is disposed on a second surface side of the substrate and the first terminal; and second solder configured to pass through the substrate in the thickness direction and connect a second through terminal connected to a second electronic component disposed on the second surface side of the substrate and the second terminal.

公开(公告)号：US20170084581A1

公开(公告)日：2017-03-23

申请号：US15252454

申请日：2016-08-31

Applicant: FUJITSU LIMITED

Inventor： Shunichi Kikuchi ,  Hiroshi Onuki ,  Naoaki Nakamura ,  Yoshihisa IWAKIRI

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L23/544

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/29007 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29078 ,  H01L2224/29287 ,  H01L2224/2929 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/33181 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8109 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8309 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/3301 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/0549 ,  H01L2924/0531 ,  H01L2924/01001 ,  H01L2924/0532 ,  H01L2924/01012 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/05032 ,  H01L2224/33051

Abstract: A laminated chip includes: semiconductor chips that are laminated; and multiple types of adhesive insulating resin films that include mutually different characteristics and that are filled between the semiconductor chips, wherein the multiple types of the adhesive insulating resin films are arranged in a chip plane direction, depending on a demand characteristic for each region in a chip plane.

公开(公告)号：US09853014B2

公开(公告)日：2017-12-26

申请号：US15275752

申请日：2016-09-26

Applicant: FUJITSU LIMITED

Inventor： Ryo Kikuchi ,  Nobuhiro Imaizumi ,  Hiroshi Onuki

IPC: H01L23/52 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0214 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/0225 ,  H01L2224/02255 ,  H01L2224/0226 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/0239 ,  H01L2224/03001 ,  H01L2224/036 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05005 ,  H01L2224/05014 ,  H01L2224/05022 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/0519 ,  H01L2224/05195 ,  H01L2224/05287 ,  H01L2224/0529 ,  H01L2224/05395 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/12105 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/13014 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/14051 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/03 ,  H01L2224/11 ,  H01L21/304 ,  H01L21/76898 ,  H01L2224/81 ,  H01L2924/0665 ,  H01L2924/00

Abstract: An electronic component includes a substrate configured to include a first portion that first thermal conductivity, and have a first surface and a second surface opposite to the first surface; a second portion configured to be formed inside the first portion, and have second thermal conductivity lower than the first thermal conductivity; a first terminal configured to be formed to correspond to the second portion on a side of the first surface; and a second terminal configured to be formed on a side of the second surface.

公开(公告)号：US20170098631A1

公开(公告)日：2017-04-06

申请号：US15275752

申请日：2016-09-26

Applicant: FUJITSU LIMITED

Inventor： Ryo Kikuchi ,  Nobuhiro IMAIZUMI ,  Hiroshi Onuki

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0214 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/0225 ,  H01L2224/02255 ,  H01L2224/0226 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/0239 ,  H01L2224/03001 ,  H01L2224/036 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05005 ,  H01L2224/05014 ,  H01L2224/05022 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/0519 ,  H01L2224/05195 ,  H01L2224/05287 ,  H01L2224/0529 ,  H01L2224/05395 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/12105 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/13014 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/14051 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/03 ,  H01L2224/11 ,  H01L21/304 ,  H01L21/76898 ,  H01L2224/81 ,  H01L2924/0665 ,  H01L2924/00

Abstract: An electronic component includes a substrate configured to include a first portion that first thermal conductivity, and have a first surface and a second surface opposite to the first surface;a second portion configured to be formed inside the first portion, and have second thermal conductivity lower than the first thermal conductivity;a first terminal configured to be formed to correspond to the second portion on a side of the first surface; and a second terminal configured to be formed on a side of the second surface.

公开(公告)号：US09642287B2

公开(公告)日：2017-05-02

申请号：US15156375

申请日：2016-05-17

Applicant: FUJITSU LIMITED

Inventor： Shunichi Kikuchi ,  Yoshihisa Iwakiri ,  Naoaki Nakamura ,  Hiroshi Onuki

IPC: H05K7/20 ,  F25D15/00 ,  F28F9/02 ,  F28D21/00 ,  F28D15/00

CPC classification number: H05K7/20781 ,  F28D15/00 ,  F28D2021/0028 ,  F28F3/12 ,  F28F9/0204 ,  F28F9/026 ,  F28F13/00 ,  F28F2270/00 ,  H05K7/20736

Abstract: A channel distribution type cooling plate where a space between a first coolant storage part for inflow of coolant and a second cooling storage part for outflow of coolant formed at the two ends of an upper space of a main body provided with a lower space for removing heat of a heat generating member is partitioned by a meandering type partition wall to form coolant distribution paths connected to the first coolant storage part and coolant collection paths connected to the second coolant storage part, the bottom of the coolant distribution paths and the coolant collection paths are communicated by a plurality of through holes with the lower space, and side surfaces of the partition wall at the coolant distribution path sides are formed with subchannels for running coolant from the first coolant storage part, in order to improve the cooling efficiency at the coolant outlet side.