公开(公告)号：US07138706B2

公开(公告)日：2006-11-21

申请号：US10608295

申请日：2003-06-24

申请人： Yoshiyuki Arai ,  Takashi Yui ,  Yoshiaki Takeoka ,  Fumito Itou ,  Kouichi Yamauchi ,  Yasutake Yaguchi

发明人： Yoshiyuki Arai ,  Takashi Yui ,  Yoshiaki Takeoka ,  Fumito Itou ,  Kouichi Yamauchi ,  Yasutake Yaguchi

IPC分类号： H01L21/44

CPC分类号： H01L21/565 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/731 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device with excellent heat dissipation characteristics that can achieve a high reliability when mounted in electronic equipment such as a cellular phone or the like and a method for manufacturing the same are provided. The semiconductor device includes a substrate, a plurality of semiconductor chips mounted on the substrate by stacking one on top of another, and an encapsulation resin layer made of encapsulation resin. Among the plurality of semiconductor chips, a first semiconductor chip as an uppermost semiconductor chip is mounted with a surface thereof on which a circuit is formed facing toward the substrate, and the encapsulation resin layer is formed so that at least a surface of the first semiconductor chip opposite to the surface on which the circuit is formed and a part of side surfaces of the first semiconductor chip are exposed to the outside of the encapsulation resin layer.

摘要翻译： 提供具有优异的散热特性的半导体器件，其在安装在诸如蜂窝电话等的电子设备中时可以实现高可靠性及其制造方法。 半导体器件包括基板，通过在其上顶层叠一个而安装在基板上的多个半导体芯片以及由密封树脂制成的封装树脂层。 在多个半导体芯片中，作为最上半导体芯片的第一半导体芯片的表面安装有面向基板的电路，并且形成密封树脂层，使得至少第一半导体 芯片与形成电路的表面相对，并且第一半导体芯片的一部分侧表面暴露于封装树脂层的外部。

公开(公告)号：US20060091563A1

公开(公告)日：2006-05-04

申请号：US11282726

申请日：2005-11-21

申请人： Yoshiyuki Arai ,  Takashi Yui ,  Yoshiaki Takeoka ,  Fumito Itou ,  Yasutake Yaguchi

发明人： Yoshiyuki Arai ,  Takashi Yui ,  Yoshiaki Takeoka ,  Fumito Itou ,  Yasutake Yaguchi

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/85399 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a substrate having electrode pads, a first semiconductor chip mounted on the substrate with a first adhesion layer interposed therebetween, a second semiconductor chip mounted on the first semiconductor chip with a second adhesion layer interposed therebetween and having electrode pads on the upper surface thereof, wires for bonding the electrode pads of the substrate and the electrode pads of the second semiconductor chip to each other, and a mold resin sealing therein the first and second semiconductor chips and the wires. The peripheral edge portion of the first adhesion layer is protruding outwardly from the first semiconductor chip and the peripheral edge portion of the second semiconductor chip is protruding outwardly beyond the peripheral edge portion of the first semiconductor chip.

公开(公告)号：US06954001B2

公开(公告)日：2005-10-11

申请号：US10919402

申请日：2004-08-17

申请人： Yoshifumi Nakamura ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Kazuyuki Kainou ,  Keiji Miki ,  Kazumi Watase ,  Yasutake Yaguchi

发明人： Yoshifumi Nakamura ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Kazuyuki Kainou ,  Keiji Miki ,  Kazumi Watase ,  Yasutake Yaguchi

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/12 ,  H01L23/482 ,  H01L23/48

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05557 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/013

摘要： The semiconductor device includes a semiconductor element having an electrode formed on a surface thereof, and a metal wiring formed on the surface of the semiconductor element and electrically connected to the electrode. The metal wiring has an external electrode portion functioning as an external electrode. A thickness of the external electrode portion is greater than that of a non-electrode portion of the metal wiring, i.e., a portion of the metal wiring other than the external electrode portion.

摘要翻译： 半导体器件包括在其表面上形成有电极的半导体元件和形成在半导体元件的表面上并与电极电连接的金属布线。 金属布线具有用作外部电极的外部电极部分。 外部电极部分的厚度大于金属布线的非电极部分的厚度，即除了外部电极部分之外的金属布线的一部分。

公开(公告)号：US20050012214A1

公开(公告)日：2005-01-20

申请号：US10919402

申请日：2004-08-17

申请人： Yoshifumi Nakamura ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Kazuyuki Kainou ,  Keiji Miki ,  Kazumi Watase ,  Yasutake Yaguchi

发明人： Yoshifumi Nakamura ,  Ryuichi Sahara ,  Nozomi Shimoishizaka ,  Kazuyuki Kainou ,  Keiji Miki ,  Kazumi Watase ,  Yasutake Yaguchi

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/12 ,  H01L23/482 ,  H01L21/4763 ,  H01L29/40

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05557 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/013

摘要： The semiconductor device includes a semiconductor element having an electrode formed on a surface thereof, and a metal wiring formed on the surface of the semiconductor element and electrically connected to the electrode. The metal wiring has an external electrode portion functioning as an external electrode. A thickness of the external electrode portion is greater than that of a non-electrode portion of the metal wiring, i.e., a portion of the metal wiring other than the external electrode portion.

摘要翻译： 半导体器件包括在其表面上形成有电极的半导体元件和形成在半导体元件的表面上并与电极电连接的金属布线。 金属布线具有用作外部电极的外部电极部分。 外部电极部分的厚度大于金属布线的非电极部分的厚度，即除了外部电极部分之外的金属布线的一部分。

公开(公告)号：US20050003580A1

公开(公告)日：2005-01-06

申请号：US10881044

申请日：2004-06-30

申请人： Yoshiyuki Arai ,  Takashi Yui ,  Fumito Itou ,  Yasutake Yaguchi ,  Toshitaka Akahoshi

发明人： Yoshiyuki Arai ,  Takashi Yui ,  Fumito Itou ,  Yasutake Yaguchi ,  Toshitaka Akahoshi

IPC分类号： H01L25/18 ,  H01L21/60 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/0657 ,  H01L23/3121 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A stacked chip semiconductor device including: a substrate having electrode pads; a first semiconductor chip that is flip-chip-packaged on the substrate via a first adhesive layer; a second semiconductor chip that is mounted on an upper part of the first semiconductor chip and that has electrode pads; wires for electrically connecting the electrode pads of the second semiconductor chip and the electrode pads of the substrate; and a molded resin for encapsulating the first semiconductor chip, the second semiconductor chip and the wires, the first adhesive layer forming a fillet at the periphery of the first semiconductor chip. The first semiconductor chip is disposed with its central axis being offset from a central axis of the substrate, the offset being provided so that the first semiconductor chip is shifted toward a side opposite to a side where the fillet has a maximum length from the periphery of the first semiconductor chip. Thereby, influences of the fillet made of the adhesive are suppressed, allowing miniaturization of the device and improvement in the mass-productivity.

摘要翻译： 一种堆叠式芯片半导体器件，包括：具有电极焊盘的衬底; 第一半导体芯片，其经由第一粘合剂层倒装芯片封装在所述基板上; 第二半导体芯片，其安装在所述第一半导体芯片的上部并且具有电极焊盘; 用于电连接第二半导体芯片的电极焊盘和基板的电极焊盘的导线; 以及用于封装第一半导体芯片，第二半导体芯片和电线的模制树脂，第一粘合剂层在第一半导体芯片的周围形成圆角。 第一半导体芯片以其中心轴偏离基板的中心轴线的方式设置，偏移被设置成使得第一半导体芯片朝向与圆角的边缘的最大长度相反的一侧偏移 第一个半导体芯片。 由此，抑制了由粘合剂制成的圆角的影响，从而使装置小型化并提高了批量生产率。

公开(公告)号：US20090091013A1

公开(公告)日：2009-04-09

申请号：US12210312

申请日：2008-09-15

申请人： Toshiyuki Fukuda ,  Yoshihiro Tomita ,  Hisashi Umeda ,  Yasutake Yaguchi

发明人： Toshiyuki Fukuda ,  Yoshihiro Tomita ,  Hisashi Umeda ,  Yasutake Yaguchi

IPC分类号： H01L23/495 ,  H05K7/18 ,  H01R43/00

CPC分类号： H01L23/49548 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49117 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/00012

摘要： A lead frame of the present invention includes: a die pad on which a device is mounted; a first connection terminal which is provided around the die pad, and the lower surface of which serves as an external terminal; a second connection terminal which is provided around the die pad and electrically independent of the die pad, and the upper surface of which serves as an external terminal; a bent part provided between the first and the second connection terminals and connecting the first and the second connection terminals; and an outer frame. The bent part is bending-processed in a direction perpendicular to a face of the die pad. Within the outer frame, electronic component regions are formed adjoining each other and each including a die pad, and the first and the second connection terminals. The adjoining electronic components are connected through the first or the second connection terminal.

摘要翻译： 本发明的引线框架包括：安装有器件的管芯焊盘; 第一连接端子，其设置在所述管芯焊盘的周围，并且其下表面用作外部端子; 第二连接端子，设置在所述管芯焊盘的周围，并且与所述管芯焊盘电气独立，并且其上表面用作外部端子; 弯曲部，设置在第一连接端子和第二连接端子之间，并连接第一和第二连接端子; 和外框。 弯曲部分在垂直于芯片焊盘的表面的方向上进行弯曲加工。 在外框内，电子部件区域彼此相邻地形成，每个包括管芯焊盘以及第一和第二连接端子。 相邻的电子部件通过第一或第二连接端子连接。

公开(公告)号：US20070187811A1

公开(公告)日：2007-08-16

申请号：US11717953

申请日：2007-03-14

申请人： Yoshiyuki Arai ,  Takashi Yui ,  Fumito Itou ,  Yasutake Yaguchi ,  Toshitaka Akahoshi

发明人： Yoshiyuki Arai ,  Takashi Yui ,  Fumito Itou ,  Yasutake Yaguchi ,  Toshitaka Akahoshi

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/3121 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49173 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A stacked chip semiconductor device including: a substrate having electrode pads; a first semiconductor chip that is flip-chip-packaged on the substrate via a first adhesive layer; a second semiconductor chip that is mounted on an upper part of the first semiconductor chip and that has electrode pads; wires for electrically connecting the electrode pads of the second semiconductor chip and the electrode pads of the substrate; and a molded resin for encapsulating the first semiconductor chip, the second semiconductor chip and the wires, the first adhesive layer forming a fillet at the periphery of the first semiconductor chip. The first semiconductor chip is disposed with its central axis being offset from a central axis of the substrate, the offset being provided so that the first semiconductor chip is shifted toward a side opposite to a side where the fillet has a maximum length from the periphery of the first semiconductor chip. Thereby, influences of the fillet made of the adhesive are suppressed, allowing miniaturization of the device and improvement in the mass-productivity.

摘要翻译： 一种堆叠式芯片半导体器件，包括：具有电极焊盘的衬底; 第一半导体芯片，其经由第一粘合剂层倒装芯片封装在所述基板上; 第二半导体芯片，其安装在所述第一半导体芯片的上部并且具有电极焊盘; 用于电连接第二半导体芯片的电极焊盘和基板的电极焊盘的导线; 以及用于封装第一半导体芯片，第二半导体芯片和电线的模制树脂，第一粘合剂层在第一半导体芯片的周围形成圆角。 第一半导体芯片以其中心轴偏离基板的中心轴线的方式设置，偏移被设置成使得第一半导体芯片朝向与圆角的边缘的最大长度相反的一侧偏移 第一个半导体芯片。 由此，抑制了由粘合剂制成的圆角的影响，从而使装置小型化并提高了批量生产率。

公开(公告)号：US20110291253A1

公开(公告)日：2011-12-01

申请号：US13204102

申请日：2011-08-05

申请人： Toshiyuki FUKUDA ,  Yoshihiro TOMITA ,  Hisashi UMEDA ,  Yasutake YAGUCHI

发明人： Toshiyuki FUKUDA ,  Yoshihiro TOMITA ,  Hisashi UMEDA ,  Yasutake YAGUCHI

IPC分类号： H01L23/495 ,  H01R43/00 ,  H05K1/11

CPC分类号： H01L23/49548 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49117 ,  Y10T29/49121 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/00012 ,  H01L2924/206

摘要： A lead frame of the present invention includes: a die pad on which a device is mounted; a first connection terminal which is provided around the die pad, and the lower surface of which serves as an external terminal; a second connection terminal which is provided around the die pad and electrically independent of the die pad, and the upper surface of which serves as an external terminal; a bent part provided between the first and the second connection terminals and connecting the first and the second connection terminals; and an outer frame. The bent part is bending-processed in a direction perpendicular to a face of the die pad. Within the outer frame, electronic component regions are formed adjoining each other and each including a die pad, and the first and the second connection terminals. The adjoining electronic components are connected through the first or the second connection terminal.

摘要翻译： 本发明的引线框架包括：安装有器件的管芯焊盘; 第一连接端子，其设置在所述管芯焊盘的周围，并且其下表面用作外部端子; 第二连接端子，设置在所述管芯焊盘的周围，并且与所述管芯焊盘电气独立，并且其上表面用作外部端子; 弯曲部，设置在第一连接端子和第二连接端子之间，并连接第一和第二连接端子; 和外框。 弯曲部分在垂直于芯片焊盘的表面的方向上进行弯曲加工。 在外框内，电子部件区域彼此相邻地形成，每个包括管芯焊盘以及第一和第二连接端子。 相邻的电子部件通过第一或第二连接端子连接。

公开(公告)号：US07993980B2

公开(公告)日：2011-08-09

申请号：US12210312

申请日：2008-09-15

申请人： Toshiyuki Fukuda ,  Yoshihiro Tomita ,  Hisashi Umeda ,  Yasutake Yaguchi

发明人： Toshiyuki Fukuda ,  Yoshihiro Tomita ,  Hisashi Umeda ,  Yasutake Yaguchi

IPC分类号： H01L21/00 ,  H01L23/495

CPC分类号： H01L23/49548 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49117 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/00012

摘要： A lead frame of the present invention includes: a die pad on which a device is mounted; a first connection terminal which is provided around the die pad, and the lower surface of which serves as an external terminal; a second connection terminal which is provided around the die pad and electrically independent of the die pad, and the upper surface of which serves as an external terminal; a bent part provided between the first and the second connection terminals and connecting the first and the second connection terminals; and an outer frame. The bent part is bending-processed in a direction perpendicular to a face of the die pad. Within the outer frame, electronic component regions are formed adjoining each other and each including a die pad, and the first and the second connection terminals. The adjoining electronic components are connected through the first or the second connection terminal.

摘要翻译： 本发明的引线框架包括：安装有器件的管芯焊盘; 第一连接端子，其设置在所述管芯焊盘的周围，并且其下表面用作外部端子; 第二连接端子，设置在所述管芯焊盘的周围，并且与所述管芯焊盘电气独立，并且其上表面用作外部端子; 弯曲部，设置在所述第一连接端子和所述第二连接端子之间，并且连接所述第一连接端子和所述第二连接端子; 和外框。 弯曲部分在垂直于芯片焊盘的表面的方向上进行弯曲加工。 在外框内，电子部件区域彼此相邻地形成，并且每个包括管芯焊盘以及第一和第二连接端子。 相邻的电子部件通过第一或第二连接端子连接。

公开(公告)号：US20110080928A1

公开(公告)日：2011-04-07

申请号：US12887932

申请日：2010-09-22

申请人： Noriyuki YOSHIKAWA ,  Yasutake YAGUCHI

发明人： Noriyuki YOSHIKAWA ,  Yasutake YAGUCHI

IPC分类号： H01S5/02

CPC分类号： H01S5/02244 ,  H01L2224/48247 ,  H01S5/02216 ,  H01S5/02268

摘要： To provide a laser device having high strength against mechanical stress. The laser device includes: a laser element; a plate-like lead frame including through-holes, and on whose front plane the laser element is mounted; lead terminals; trenches provided between an end of the lead frame in a laser emission direction of the laser element and the through-holes; and a resin dam formed on the front plane of the lead frame using a molding resin to protrude in an area surrounding the laser element including positions of the through-holes, and having an open part in the laser emission direction. The molding resin further fills the through-holes and the trenches, and bonds the lead frame and the resin dam by sealing together a part of each of the lead terminals and a part of the front plane and the back plane of the lead frame, in a vicinity of the lead terminals.

摘要翻译： 提供对机械应力具有高强度的激光装置。 激光装置包括：激光元件; 包括通孔的板状引线框架，其前面安装有激光元件; 引线端子; 设置在激光元件的激光发射方向的引线框架的端部与通孔之间的沟槽; 以及树脂坝，其使用模制树脂在引线框架的前平面上形成，以在包括通孔的位置的激光元件周围的区域内突出，并且在激光发射方向上具有开口部分。 模制树脂还填充通孔和沟槽，并且通过将引线框架的每个引线端子的一部分和引线框架的前平面和后平面的一部分密封在一起而将引线框架和树脂坝接合在一起 引线端子附近。