公开(公告)号：US07625643B2

公开(公告)日：2009-12-01

申请号：US11893253

申请日：2007-08-14

Applicant: Hisashi Umeda ,  Iwao Okamoto

Inventor： Hisashi Umeda ,  Iwao Okamoto

IPC: G11B5/66 ,  G11B5/673

CPC classification number: G11B5/66 ,  G11B5/09 ,  Y10T428/12882 ,  Y10T428/12937 ,  Y10T428/265

Abstract: A magnetic recording medium is provided with a first magnetic layer, a nonmagnetic coupling layer provided on the first magnetic layer, and a second magnetic layer provided on the nonmagnetic coupling layer. The first and second magnetic layers are exchange-coupled, and have magnetization directions which are mutually parallel in a state where no external magnetic field is applied thereto, and the first magnetic layer switches the magnetization direction thereof before the second magnetic layer in response to a recording magnetic field which switches the magnetization directions of the first and second magnetic layers.

Abstract translation: 磁记录介质设置有第一磁性层，设置在第一磁性层上的非磁性耦合层和设置在非磁性耦合层上的第二磁性层。 第一和第二磁性层是交换耦合的，并且在不施加外部磁场的状态下具有相互平行的磁化方向，并且第一磁性层响应于第二磁性层在第二磁性层之前切换其磁化方向 记录切换第一和第二磁性层的磁化方向的磁场。

公开(公告)号：US07435489B2

公开(公告)日：2008-10-14

申请号：US10798102

申请日：2004-03-11

Applicant: Hisashi Umeda ,  Iwao Okamoto

Inventor： Hisashi Umeda ,  Iwao Okamoto

IPC: G11B5/66

CPC classification number: G11B5/656 ,  G11B5/00 ,  G11B5/012 ,  G11B5/02 ,  G11B5/09 ,  G11B5/66 ,  G11B5/82 ,  G11B2005/001 ,  Y10T428/265

Abstract: A magnetic recording medium is provided with an exchange layer structure, and a magnetic layer provided on the exchange layer structure. The exchange layer structure includes a ferromagnetic layer and a nonmagnetic coupling layer provided on the ferromagnetic layer, where the ferromagnetic layer and the magnetic layer are exchange-coupled and having mutually antiparallel magnetizations. The ferromagnetic layer and the magnetic layer satisfy a relationship Hc1′≧Hc2′, where Hc1′ denotes a dynamic coercivity of the ferromagnetic layer and Hc2′ denotes a dynamic coercivity of the magnetic layer.

Abstract translation: 磁记录介质具有交换层结构，以及设置在交换层结构上的磁性层。 交换层结构包括铁磁层和设置在铁磁层上的非磁耦合层，其中铁磁层和磁层交换耦合并具有相互反平行的磁化。 铁磁层和磁性层满足Hc 1'> = Hc 2'的关系，其中Hc 1'表示铁磁层的动态矫顽力，Hc 2'表示磁性层的动态矫顽力。

公开(公告)号：US20080002296A1

公开(公告)日：2008-01-03

申请号：US11893253

申请日：2007-08-14

Applicant: Hisashi Umeda ,  Iwao Okamoto

Inventor： Hisashi Umeda ,  Iwao Okamoto

IPC: G11B5/66 ,  G11B5/673

CPC classification number: G11B5/66 ,  G11B5/09 ,  Y10T428/12882 ,  Y10T428/12937 ,  Y10T428/265

Abstract: A magnetic recording medium is provided with a first magnetic layer, a nonmagnetic coupling layer provided on the first magnetic layer, and a second magnetic layer provided on the nonmagnetic coupling layer. The first and second magnetic layers are exchange-coupled, and have magnetization directions which are mutually parallel in a state where no external magnetic field is applied thereto, and the first magnetic layer switches the magnetization direction thereof before the second magnetic layer in response to a recording magnetic field which switches the magnetization directions of the first and second magnetic layers.

Abstract translation: 磁记录介质设置有第一磁性层，设置在第一磁性层上的非磁性耦合层和设置在非磁性耦合层上的第二磁性层。 第一和第二磁性层是交换耦合的，并且在不施加外部磁场的状态下具有相互平行的磁化方向，并且第一磁性层响应于第二磁性层在第二磁性层之前切换其磁化方向 记录切换第一和第二磁性层的磁化方向的磁场。

公开(公告)号：US07271984B2

公开(公告)日：2007-09-18

申请号：US10850988

申请日：2004-05-21

Applicant: Hisashi Umeda ,  Iwao Okamoto

Inventor： Hisashi Umeda ,  Iwao Okamoto

IPC: G11B5/66 ,  G11B5/673

CPC classification number: G11B5/66 ,  G11B5/09 ,  Y10T428/12882 ,  Y10T428/12937 ,  Y10T428/265

Abstract: A magnetic recording medium is provided with a first magnetic layer, a nonmagnetic coupling layer provided on the first magnetic layer, and a second magnetic layer provided on the nonmagnetic coupling layer. The first and second magnetic layers are exchange-coupled, and have magnetization directions which are mutually parallel in a state where no external magnetic field is applied thereto, and the first magnetic layer switches the magnetization direction thereof before the second magnetic layer in response to a recording magnetic field which switches the magnetization directions of the first and second magnetic layers.

Abstract translation: 磁记录介质设置有第一磁性层，设置在第一磁性层上的非磁性耦合层和设置在非磁性耦合层上的第二磁性层。 第一和第二磁性层是交换耦合的，并且在不施加外部磁场的状态下具有相互平行的磁化方向，并且第一磁性层响应于第二磁性层在第二磁性层之前切换其磁化方向 记录切换第一和第二磁性层的磁化方向的磁场。

公开(公告)号：US20050014028A1

公开(公告)日：2005-01-20

申请号：US10798102

申请日：2004-03-11

Applicant: Hisashi Umeda ,  Iwao Okamoto

Inventor： Hisashi Umeda ,  Iwao Okamoto

IPC: G11B5/00 ,  G11B5/012 ,  G11B5/02 ,  G11B5/09 ,  G11B5/64 ,  G11B5/65 ,  G11B5/66 ,  G11B5/738 ,  G11B5/82 ,  H01F10/16 ,  H01F10/32 ,  G11B5/72

CPC classification number: G11B5/656 ,  G11B5/00 ,  G11B5/012 ,  G11B5/02 ,  G11B5/09 ,  G11B5/66 ,  G11B5/82 ,  G11B2005/001 ,  Y10T428/265

Abstract: A magnetic recording medium is provided with an exchange layer structure, and a magnetic layer provided on the exchange layer structure. The exchange layer structure includes a ferromagnetic layer and a nonmagnetic coupling layer provided on the ferromagnetic layer, where the ferromagnetic layer and the magnetic layer are exchange-coupled and having mutually antiparallel magnetizations. The ferromagnetic layer and the magnetic layer satisfy a relationship Hc1′≧Hc2′, where Hc1′ denotes a dynamic coercivity of the ferromagnetic layer and Hc2′ denotes a dynamic coercivity of the magnetic layer.

Abstract translation: 磁记录介质具有交换层结构，以及设置在交换层结构上的磁性层。 交换层结构包括铁磁层和设置在铁磁层上的非磁耦合层，其中铁磁层和磁层交换耦合并具有相互反平行的磁化。 铁磁层和磁性层满足Hc1'> = Hc2'的关系，其中Hc1'表示铁磁层的动态矫顽力，Hc2'表示磁性层的动态矫顽力。

公开(公告)号：US20110291253A1

公开(公告)日：2011-12-01

申请号：US13204102

申请日：2011-08-05

Applicant: Toshiyuki FUKUDA ,  Yoshihiro TOMITA ,  Hisashi UMEDA ,  Yasutake YAGUCHI

Inventor： Toshiyuki FUKUDA ,  Yoshihiro TOMITA ,  Hisashi UMEDA ,  Yasutake YAGUCHI

IPC: H01L23/495 ,  H01R43/00 ,  H05K1/11

CPC classification number: H01L23/49548 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49117 ,  Y10T29/49121 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/00012 ,  H01L2924/206

Abstract: A lead frame of the present invention includes: a die pad on which a device is mounted; a first connection terminal which is provided around the die pad, and the lower surface of which serves as an external terminal; a second connection terminal which is provided around the die pad and electrically independent of the die pad, and the upper surface of which serves as an external terminal; a bent part provided between the first and the second connection terminals and connecting the first and the second connection terminals; and an outer frame. The bent part is bending-processed in a direction perpendicular to a face of the die pad. Within the outer frame, electronic component regions are formed adjoining each other and each including a die pad, and the first and the second connection terminals. The adjoining electronic components are connected through the first or the second connection terminal.

Abstract translation: 本发明的引线框架包括：安装有器件的管芯焊盘; 第一连接端子，其设置在所述管芯焊盘的周围，并且其下表面用作外部端子; 第二连接端子，设置在所述管芯焊盘的周围，并且与所述管芯焊盘电气独立，并且其上表面用作外部端子; 弯曲部，设置在第一连接端子和第二连接端子之间，并连接第一和第二连接端子; 和外框。 弯曲部分在垂直于芯片焊盘的表面的方向上进行弯曲加工。 在外框内，电子部件区域彼此相邻地形成，每个包括管芯焊盘以及第一和第二连接端子。 相邻的电子部件通过第一或第二连接端子连接。

公开(公告)号：US07993980B2

公开(公告)日：2011-08-09

申请号：US12210312

申请日：2008-09-15

Applicant: Toshiyuki Fukuda ,  Yoshihiro Tomita ,  Hisashi Umeda ,  Yasutake Yaguchi

Inventor： Toshiyuki Fukuda ,  Yoshihiro Tomita ,  Hisashi Umeda ,  Yasutake Yaguchi

IPC: H01L21/00 ,  H01L23/495

CPC classification number: H01L23/49548 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49117 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/00012

Abstract: A lead frame of the present invention includes: a die pad on which a device is mounted; a first connection terminal which is provided around the die pad, and the lower surface of which serves as an external terminal; a second connection terminal which is provided around the die pad and electrically independent of the die pad, and the upper surface of which serves as an external terminal; a bent part provided between the first and the second connection terminals and connecting the first and the second connection terminals; and an outer frame. The bent part is bending-processed in a direction perpendicular to a face of the die pad. Within the outer frame, electronic component regions are formed adjoining each other and each including a die pad, and the first and the second connection terminals. The adjoining electronic components are connected through the first or the second connection terminal.

Abstract translation: 本发明的引线框架包括：安装有器件的管芯焊盘; 第一连接端子，其设置在所述管芯焊盘的周围，并且其下表面用作外部端子; 第二连接端子，设置在所述管芯焊盘的周围，并且与所述管芯焊盘电气独立，并且其上表面用作外部端子; 弯曲部，设置在所述第一连接端子和所述第二连接端子之间，并且连接所述第一连接端子和所述第二连接端子; 和外框。 弯曲部分在垂直于芯片焊盘的表面的方向上进行弯曲加工。 在外框内，电子部件区域彼此相邻地形成，并且每个包括管芯焊盘以及第一和第二连接端子。 相邻的电子部件通过第一或第二连接端子连接。

公开(公告)号：US20050136291A1

公开(公告)日：2005-06-23

申请号：US10975936

申请日：2004-10-28

Applicant: Iwao Okamoto ,  Hisashi Umeda

Inventor： Iwao Okamoto ,  Hisashi Umeda

IPC: G11B5/64 ,  G11B5/65 ,  G11B5/66 ,  G11B5/738 ,  G11B5/72

CPC classification number: G11B5/66 ,  G11B5/656

Abstract: A magnetic recording medium is provided with first and second ferromagnetic layers which are exchange-coupled via a first nonmagnetic coupling layer and have mutually parallel magnetizations. The second ferromagnetic layer and a magnetic layer are exchange-coupled via a second nonmagnetic coupling layer and have magnetizations which are mutually antiparallel. The first and second ferromagnetic layers and the magnetic layer respectively have dynamic coercivities Hc1′, Hc2′ and Hc3′ which satisfy a relationship Hc1′

Abstract translation: 磁记录介质设置有第一和第二铁磁层，其经由第一非磁性耦合层交换耦合并且具有相互平行的磁化。 第二铁磁层和磁性层通过第二非磁性耦合层进行交换耦合，并具有相互反平行的磁化。 第一和第二铁磁层和磁性层分别具有在记录磁场的切换时间区域中满足关系Hc 1'

公开(公告)号：US06645646B1

公开(公告)日：2003-11-11

申请号：US09587842

申请日：2000-06-06

Applicant: Hisashi Umeda ,  E. Noel Abarra ,  Iwao Okamoto ,  Yoshifumi Mizoshita

Inventor： Hisashi Umeda ,  E. Noel Abarra ,  Iwao Okamoto ,  Yoshifumi Mizoshita

IPC: G11B566

CPC classification number: G11B5/66 ,  G11B5/74 ,  G11B5/82 ,  G11B2005/0002 ,  Y10S428/90 ,  Y10T428/12465 ,  Y10T428/12861 ,  Y10T428/2495 ,  Y10T428/265

Abstract: A magnetic recording medium is constructed to include at least one exchange layer structure and a magnetic layer provided on the exchange layer structure, where the exchange layer structure includes a ferromagnetic layer and a non-magnetic coupling layer provided on the ferromagnetic layer, and a magnetic bonding layer provided between the ferromagnetic layer and the non-magnetic coupling layer and/or between the non-magnetic coupling layer and the magnetic layer, wherein the magnetic bonding layer has a magnetization direction parallel to the ferromagnetic layer and the magnetic layer.

Abstract translation: 磁记录介质被构造成包括至少一个交换层结构和设置在交换层结构上的磁性层，其中交换层结构包括强磁性层和设置在铁磁层上的非磁性耦合层，以及磁性层 粘结层设置在铁磁层和非磁性耦合层之间和/或非磁性耦合层与磁性层之间，其中磁性结合层具有平行于铁磁性层和磁性层的磁化方向。

公开(公告)号：US20090091013A1

公开(公告)日：2009-04-09

申请号：US12210312

申请日：2008-09-15

Applicant: Toshiyuki Fukuda ,  Yoshihiro Tomita ,  Hisashi Umeda ,  Yasutake Yaguchi

Inventor： Toshiyuki Fukuda ,  Yoshihiro Tomita ,  Hisashi Umeda ,  Yasutake Yaguchi

IPC: H01L23/495 ,  H05K7/18 ,  H01R43/00

CPC classification number: H01L23/49548 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49117 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/00012

Abstract: A lead frame of the present invention includes: a die pad on which a device is mounted; a first connection terminal which is provided around the die pad, and the lower surface of which serves as an external terminal; a second connection terminal which is provided around the die pad and electrically independent of the die pad, and the upper surface of which serves as an external terminal; a bent part provided between the first and the second connection terminals and connecting the first and the second connection terminals; and an outer frame. The bent part is bending-processed in a direction perpendicular to a face of the die pad. Within the outer frame, electronic component regions are formed adjoining each other and each including a die pad, and the first and the second connection terminals. The adjoining electronic components are connected through the first or the second connection terminal.

Abstract translation: 本发明的引线框架包括：安装有器件的管芯焊盘; 第一连接端子，其设置在所述管芯焊盘的周围，并且其下表面用作外部端子; 第二连接端子，设置在所述管芯焊盘的周围，并且与所述管芯焊盘电气独立，并且其上表面用作外部端子; 弯曲部，设置在第一连接端子和第二连接端子之间，并连接第一和第二连接端子; 和外框。 弯曲部分在垂直于芯片焊盘的表面的方向上进行弯曲加工。 在外框内，电子部件区域彼此相邻地形成，每个包括管芯焊盘以及第一和第二连接端子。 相邻的电子部件通过第一或第二连接端子连接。