Systems and/or methods for dynamic selection of rules processing mode
    1.
    发明授权
    Systems and/or methods for dynamic selection of rules processing mode 有权
    用于动态选择规则处理模式的系统和/或方法

    公开(公告)号:US08954371B2

    公开(公告)日:2015-02-10

    申请号:US13524360

    申请日:2012-06-15

    IPC分类号: G06F17/00 G06N5/02

    CPC分类号: G06N5/02 G06N5/025

    摘要: Certain example embodiments described herein relate to techniques for dynamically selecting rule processing modes. The processing mode does not need to be specified during rule design/authoring. Two sets of artifacts may be generated to support a desired processing mode. This may occur in the designer's local workspace, e.g., so that rule invocation can be tested locally. Additionally, or alternatively, both sets of artifacts may be installed on the rule engine running on a remote server when the project is deployed. The designer need not be aware that both sets of artifacts are being generated. In certain example embodiments, the designer may have the ability to sequence rules within metaphors (or decision entities such as decision tables), and/or the ability to sequence metaphors within rule sets. During rule invocation, a parameter may be provided to indicate the processing mode (e.g., sequential or inferential) to be used by the rule engine.

    摘要翻译: 这里描述的某些示例实施例涉及用于动态选择规则处理模式的技术。 在规则设计/创作过程中,不需要指定处理模式。 可以生成两组伪影以支持期望的处理模式。 这可能发生在设计人员的本地工作区中,例如,可以在本地测试规则调用。 另外或替代地,当部署项目时,两组工件可以安装在在远程服务器上运行的规则引擎上。 设计者不需要知道正在生成两组工件。 在某些示例性实施例中,设计者可能具有在隐喻(或决策实体,例如决策表)中排序规则的能力,和/或在规则集内对序列隐喻进行排序的能力。 在规则调用期间,可以提供参数以指示要由规则引擎使用的处理模式(例如,顺序或推断)。

    Heated valve manifold for ampoule
    5.
    发明授权
    Heated valve manifold for ampoule 失效
    用于安瓿的加热阀歧管

    公开(公告)号:US08137468B2

    公开(公告)日:2012-03-20

    申请号:US12405692

    申请日:2009-03-17

    IPC分类号: C23C16/00

    CPC分类号: C23C16/4481 C23C16/45561

    摘要: Embodiments of the invention provide an apparatus and a method for generating a gaseous chemical precursor that may be used in a vapor deposition processing system. In one embodiment, the apparatus contains a valve manifold assembly, which includes a valve assembly body having at least one embedded electric heater, an inlet channel passing through the valve assembly body, a first pneumatic valve and a first manual valve coupled to the valve assembly body and positioned to control fluid flow within the inlet channel, an outlet channel passing through the valve assembly body, and a second pneumatic valve and a second manual valve coupled to the valve assembly body and positioned to control fluid flow within the outlet channel. The valve manifold assembly further contains a bypass channel connected to and between the inlet and outlet channels, and containing a bypass valve positioned to control fluid flow within the bypass channel.

    摘要翻译: 本发明的实施方案提供了一种用于产生可用于气相沉积处理系统的气态化学前体的装置和方法。 在一个实施例中,该装置包括阀歧管组件,其包括具有至少一个嵌入式电加热器的阀组件主体,穿过阀组件主体的入口通道,第一气动阀和联接到阀组件的第一手动阀 并且定位成控制入口通道内的流体流动,穿过阀组件本体的出口通道,以及耦合到阀组件主体并定位成控制出口通道内的流体流动的第二气动阀和第二手动阀。 阀歧管组件还包括连接到入口通道和出口通道之间并且在入口通道和出口通道之间的旁通通道,并且包含定位成控制旁通通道内的流体流动的旁通阀。

    Method and apparatus for processing semiconductive wafers
    9.
    发明授权
    Method and apparatus for processing semiconductive wafers 有权
    用于处理半导体晶片的方法和设备

    公开(公告)号:US06300255B1

    公开(公告)日:2001-10-09

    申请号:US09257467

    申请日:1999-02-24

    IPC分类号: H01L2131

    摘要: There are provided a method and apparatus for forming by chemical vapor deposition on large diameter (e.g., 300 mm) semiconductive wafers thin insulating layers of silicon oxide (SiO2) having high uniformity from rim to rim across any diameter through the centers of the wafers. Such high degree of uniformity of the layers is obtained by directing separately a first reactive gas stream and a second reactive gas stream into close proximity to an exposed surface of a wafer to a be coated by the gasses with an insulating layer, the gas streams when mixed together reacting with each other to deposit an insulating layer on a wafer; forming a whirlpool-like swirling mixture of the first and second gas streams to thoroughly mix together the gasses thereof; forming a highly uniform mixture of the reactive gasses; and promptly flowing the mixture of reactive gasses over and upon the surface of the wafer. The apparatus also provides dual wafer processing chamber cavities.

    摘要翻译: 提供了一种用于通过化学气相沉积在大直径(例如,300mm)半导体晶片上形成薄膜绝缘层的氧化硅(SiO 2)的方法和装置,所述氧化硅(SiO 2)的绝缘层从边缘到边缘具有高度均匀性,并通过晶片中心的任何直径。 通过将第一反应性气体流和第二反应气体流分别靠近晶片的暴露表面引导以由具有绝缘层的气体涂覆而获得这些高度的均匀度,气体流 混合在一起反应以在晶片上沉积绝缘层; 形成第一和第二气流的漩涡状旋转混合物以将其气体充分混合在一起; 形成高度均匀的反应性气体混合物; 并迅速将反应性气体的混合物流过晶片表面上和表面。 该设备还提供双晶片处理室腔。