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公开(公告)号:US12132456B2
公开(公告)日:2024-10-29
申请号:US18357989
申请日:2023-07-24
发明人: Bei-Shing Lien , Jaw-Juinn Horng
CPC分类号: H03F3/45179 , H03F3/193 , H03F3/211 , H03F3/45475 , H03F2200/171 , H03F2200/372
摘要: A noise detecting circuit including an amplifier circuit amplifying an input signal indicating a noise level of a circuit to be detected and output an amplified signal; a filtering circuit receiving and filtering the amplified signal and output a filtered signal; and a comparing circuit receiving and compare the filtered signal to a reference voltage and output an output signal; wherein the filtering circuit includes: an output terminal; and a first filter selectively coupled to the output terminal, including: a sub-output terminal; a switch selectively coupling the sub-output terminal to the output terminal; a resistor, wherein a terminal of the resistor is coupled to the amplifier circuit and another terminal of the resistor is coupled to the sub-output terminal; and a capacitor, wherein a terminal of the capacitor is coupled to the sub-output terminal and another terminal of the capacitor is coupled to a reference voltage source.
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公开(公告)号:US12131992B2
公开(公告)日:2024-10-29
申请号:US18489864
申请日:2023-10-19
发明人: Chun-Wei Chang , Hsuan-Ming Huang , Jian-Hong Lin , Ming-Hong Hsieh , Mingni Chang , Ming-Yih Wang
IPC分类号: H01L23/522 , H01L21/66 , H01L21/768 , H01L23/532
CPC分类号: H01L23/5226 , H01L21/76843 , H01L22/14 , H01L23/53209
摘要: A semiconductor structure and method of manufacturing a semiconductor structure are provided. The semiconductor structure includes a package structure. The package structure includes a passivation layer formed over an interconnect structure; an electrically-conductive structure formed on the passivation layer and extending through the passivation layer to electrically contact the interconnect structure; a dielectric structure formed over the passivation layer and surrounding the electrically-conductive structure to expose at least a portion of a top surface of the electrically-conductive structure; and a metallic protection structure formed on the top surface of the electrically-conductive structure exposed from the dielectric structure. The top surface of the metallic protection structure is aligned with or lower than a top surface of the dielectric structure.
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公开(公告)号:US12125934B2
公开(公告)日:2024-10-22
申请号:US17213961
申请日:2021-03-26
发明人: Yi-Shin Chu , Hsiang-Lin Chen , Yin-Kai Liao , Sin-Yi Jiang , Kuan-Chieh Huang
CPC分类号: H01L31/1812 , H01L31/02016 , H01L31/1864 , H01L31/1868
摘要: A method of manufacturing a semiconductor structure includes: forming a light-absorption layer in a substrate; forming a first doped region of a first conductivity type and a second doped region of a second conductivity type in the light-absorption layer adjacent to the first doped region; depositing a first patterned mask layer over the light-absorption layer, wherein the first patterned mask layer includes an opening exposing the second doped region and covers the first doped region; forming a first silicide layer in the opening on the second doped region; depositing a barrier layer over the first doped region; and annealing the barrier layer to form a second silicide layer on the first doped region.
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公开(公告)号:US12112796B2
公开(公告)日:2024-10-08
申请号:US17674139
申请日:2022-02-17
发明人: Zhi-Hao Chang , Wei-Jer Hsieh
IPC分类号: G11C11/418 , G11C11/408 , G11C11/413 , G11C11/4096
CPC分类号: G11C11/418 , G11C11/4085 , G11C11/413 , G11C11/4096
摘要: The present disclosure provides a memory circuit. The memory circuit includes: a plurality of word lines, a word line driver, and a first conductive line. The word line driver is electrically connected to the word lines. The word line driver includes: a plurality of first electronic components and a plurality of second electronic components. The plurality of first electronic components each electrically connected to the corresponding word line. The plurality of second electronic components each having a first terminal and a second terminal. The first terminal is electrically connected to the corresponding word line and the corresponding first electronic component. The first conductive line is electrically connected to the second terminal of the second electronic components. The first conductive line has a length proportional to the number of the word lines.
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公开(公告)号:US12100627B2
公开(公告)日:2024-09-24
申请号:US18180139
申请日:2023-03-08
发明人: Tung-Huang Chen , Yen-Yu Chen , Po-An Chen , Soon-Kang Huang
IPC分类号: H01L21/8238 , H01L21/28 , H01L21/321 , H01L23/535 , H01L27/092 , H01L29/423 , H01L29/49 , H01L29/66
CPC分类号: H01L21/82385 , H01L21/28088 , H01L21/28114 , H01L21/28123 , H01L21/3212 , H01L21/823842 , H01L23/535 , H01L27/092 , H01L29/42376 , H01L29/4966 , H01L29/66545
摘要: A method of manufacturing a semiconductor device having metal gates and the semiconductor device are disclosed. The method comprises providing a first sacrificial gate associated with a first conductive type transistor and a second sacrificial gate associated with a second conductive type transistor disposed over the substrate, wherein the first conductive type and the second conductive type are complementary; replacing the first sacrificial gate with a first metal gate structure; forming a patterned dielectric layer and/or a patterned photoresist layer to cover the first metal gate structure; and replacing the second sacrificial gate with a second metal gate structure. The method can improve gate height uniformity during twice metal gate chemical mechanical polish processes.
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公开(公告)号:US12095904B2
公开(公告)日:2024-09-17
申请号:US18062586
申请日:2022-12-07
发明人: Mei-Chien Liu
CPC分类号: H04L9/0825 , H04L9/0866 , H04L9/0894 , H04L9/3242 , H04L9/3278 , H04L63/0442
摘要: A method includes encrypting a first message that contains a first public key of a first peer, by using a second public key of a second peer; and decrypting a second message sent from the second peer by using a first private key paired with the first public key. The second message may be encrypted at the second peer by using the first public key, and may contain an encrypted data encrypted by the second peer using the second public key and hashed by using a secret key of the first peer. The first public key, the second public key, the first private key and the secret key may be physically unclonable function (PUF)-based keys.
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公开(公告)号:US12088307B2
公开(公告)日:2024-09-10
申请号:US18356218
申请日:2023-07-21
发明人: Mao-Ruei Li , Ming Hsien Tsai , Ruey-Bin Sheen
IPC分类号: H03K7/08 , G04F10/00 , G04F10/04 , G06F30/20 , G06F30/337 , G11C16/32 , H03K3/017 , H03K5/156 , H03L7/06 , H03L7/085
CPC分类号: H03K7/08 , G04F10/005 , G04F10/04 , G06F30/20 , G06F30/337 , G11C16/32 , H03K3/017 , H03K5/1565 , H03L7/06 , H03L7/085
摘要: A circuit includes a period calculator and a pulse width calculator. The period calculator is configured for receiving a first predetermined digital code and a second predetermined digital code, and for calculating a first calculated period value according to the first predetermined digital code, and calculating a second calculated period value according to the second predetermined digital code. The first predetermined digital code has a first predetermined period value, and the second predetermined digital code has a second predetermined period value. The pulse width calculator is configured for receiving a predetermined pulse width, and calculating a first pulse width code corresponding to the predetermined pulse width according to the first predetermined period value, the second predetermined period value, the first calculated period value, the second calculated period value and the predetermined pulse width.
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公开(公告)号:US12070433B2
公开(公告)日:2024-08-27
申请号:US16904562
申请日:2020-06-18
发明人: Ming-Chang Teng , Kuan-Chun Sun , Yi-Jeng Tsai
CPC分类号: A61H3/00 , A61H2003/007 , A61H2201/1642 , A61H2201/165 , A61H2201/5061 , A61H2205/102 , A61H2205/108
摘要: The present disclosure provides an assistive device and a control method thereof. The assistive device is adjustable for fitting different user. The control method of the assistive device is used for aiding user with moving and training.
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公开(公告)号:US12068597B2
公开(公告)日:2024-08-20
申请号:US17810602
申请日:2022-07-03
发明人: Pin-Hsin Chang , Hsin-Yu Chen , Tzu-Heng Chang
CPC分类号: H02H9/005 , H03K5/13 , H03K2005/00195
摘要: The present disclosure provides a power clamp device. The power clamp device includes a delay element, a first transistor, a second transistor, and a gate control circuit. The delay element has an input terminal and an output terminal. The first transistor has a gate electrically connected to the output terminal of the delay element. The second transistor has a source electrically connected to a drain of the first transistor. The gate control circuit has a first terminal electrically connected to the input terminal of the delay element, a second terminal electrically connected to the output terminal of the delay element, and a third terminal electrically connected to a gate of the second transistor.
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公开(公告)号:US12063785B2
公开(公告)日:2024-08-13
申请号:US17462663
申请日:2021-08-31
发明人: Kuo-Pin Chang , Chien Hung Liu , Chih-Wei Hung
摘要: A memory cell, an integrated circuit and method of manufacturing the same are provided. The memory device includes a substrate, gate layers and insulating layers, an isolation column, a channel layer, a first conductive feature, a second conductive feature, a storage layer and a pair of isolation structures. The isolation column extends through the gate layers and the insulating layers along a first direction. The channel layer laterally covers the isolation column. The first conductive feature and second conductive feature extend along the first direction and adjacent to the isolation column. The storage layer is disposed between the gate layers and the channel layer. The pair of isolation structures extends along the first direction. The pair of isolation structures includes a first isolation structure disposed between the first conductive feature and the gate layers, and a second isolation structure disposed between the second conductive feature and the gate layers.
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