公开(公告)号：US20100326726A1

公开(公告)日：2010-12-30

申请号：US12818542

申请日：2010-06-18

申请人： Hisao Tanaka ,  Satoshi Emoto ,  Kenichi Nashirozawa ,  Nana Matsushima ,  Takumi Masuyama

发明人： Hisao Tanaka ,  Satoshi Emoto ,  Kenichi Nashirozawa ,  Nana Matsushima ,  Takumi Masuyama

IPC分类号： H01R4/02

CPC分类号： H05K3/363 ,  G11B5/4846 ,  H05K3/3452 ,  H05K2201/0373 ,  H05K2201/058 ,  H05K2201/098 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2201/2036

摘要： A solder joint structure include: a first terminal portion including a plurality of first terminal conductors adjacent to each other; a second terminal portion arranged opposite to the first terminal portion and including a plurality of second terminal conductors which are joined to the first terminal conductors; solders electrically connecting the first terminal conductors and the second terminal conductors; and member for suppressing flow of the solders.

摘要翻译： 焊接结构包括：包括彼此相邻的多个第一端子导体的第一端子部分; 第二端子部分，布置成与第一端子部分相对并且包括多个第二端子导体，第二端子导体连接到第一端子导体; 电连接第一端子导体和第二端子导体的焊料; 以及用于抑制焊料流动的部件。

公开(公告)号：US20100276803A1

公开(公告)日：2010-11-04

申请号：US12771507

申请日：2010-04-30

申请人： Takayuki Higuchi ,  Yoshihiro Tomura

发明人： Takayuki Higuchi ,  Yoshihiro Tomura

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/83 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/838 ,  H01L2224/92225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1579 ,  H01L2924/3011 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor element (101) includes an electrode section (102) and a bump (105), a circuit board (103) includes an electrode section (104) and a bump (106), and a conductive filler (108) having a lower melting point than the melting points of the bumps (105, 106) electrically bonds the bumps (105, 106) to each other.

摘要翻译： 半导体元件（101）包括电极部分（102）和凸起（105），电路板（103）包括电极部分（104）和凸块（106），以及具有下部电极部分 熔点高于凸点（105,106）的熔点将凸块（105,106）彼此电连接。

公开(公告)号：US07699210B2

公开(公告)日：2010-04-20

申请号：US12025928

申请日：2008-02-05

申请人： Daewoong Suh

发明人： Daewoong Suh

IPC分类号： B23K31/02 ,  H01L23/02 ,  H01L23/52

CPC分类号： H05K3/3436 ,  H05K3/3463 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147

摘要： In some example embodiments, a method includes engaging a first contact on a motherboard with a second contact on an electronic package. A portion of one of the first and second contacts is covered with an interlayer that has a lower melting temperature than both of the first and second contacts. The method further includes bonding the first contact to the second contact by melting the interlayer to diffuse the interlayer into the first and second contacts. The bonded first and second contacts have a higher melting temperature than the interlayer before melting. In other example embodiments, an electronic assembly includes a motherboard having a first contact that is bonded to a second contact on an electronic package. An interlayer is diffused within the first and second contacts such that they have a higher melting temperature than the interlayer before the interlayer is diffused into the first and second contacts.

摘要翻译： 在一些示例性实施例中，一种方法包括使主板上的第一触点与电子封装上的第二触点接合。 第一和第二触点之一的一部分被中间层覆盖，该中间层具有比第一和第二触点两者更低的熔化温度。 该方法还包括通过熔化中间层将第一接触件接合到第二接触件，以将中间层扩散到第一和第二接触件中。 接合的第一和第二触点在熔融之前具有比中间层更高的熔融温度。 在其他示例性实施例中，电子组件包括具有接合到电子封装上的第二触点的第一触点的母板。 中间层在第一和第二触点内扩散，使得它们在中间层扩散到第一和第二触点之前具有比中间层更高的熔化温度。

公开(公告)号：US07626274B2

公开(公告)日：2009-12-01

申请号：US11346728

申请日：2006-02-03

申请人： Masazumi Amagai

发明人： Masazumi Amagai

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/40

CPC分类号： H01L23/3128 ,  B23K35/262 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13021 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81447 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10992 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01047 ,  H01L2924/01028 ,  H01L2924/01027

摘要： A semiconductor device with an improved solder joint system is described. The solder system includes two copper contact pads connected by a body of solder and the solder is an alloy including tin, silver, and at least one metal from the transition groups IIIA, IVA, VA, VIA, VIIA, and VIIIA of the Periodic Table of the Elements. The solder joint system also includes, between the pads and the solder, layers of intermetallic compounds, which include grains of copper and tin compounds and copper, silver, and tin compounds. The compounds contain the transition metals. The inclusion of the transition metals in the compound grains reduce the compound grains size and prevent grain size increases after the solder joint undergoes repeated solid/liquid/solid cycles.

摘要翻译： 描述了具有改进的焊点系统的半导体器件。 焊料系统包括通过焊料体连接的两个铜接触焊盘，焊料是包含锡，银以及来自周期表的过渡族IIIA，IVA，VA，VIA，VIIA和VIIIA中的至少一种金属的合金 的元素。 焊点系统还在焊盘和焊料之间包括金属间化合物层，其包括铜和锡化合物的晶粒以及铜，银和锡化合物。 化合物含有过渡金属。 过渡金属在复合晶粒中的包含减少了复合晶粒尺寸，并防止了焊点经历重复的固/液/固体循环之后的晶粒尺寸增加。

公开(公告)号：US07523852B2

公开(公告)日：2009-04-28

申请号：US11005557

申请日：2004-12-05

申请人： Stephen L. Buchwalter ,  Claudius Feger ,  Peter A. Gruber ,  Sung K. Kang ,  Paul A. Lauro ,  Da-Yuan Shih

发明人： Stephen L. Buchwalter ,  Claudius Feger ,  Peter A. Gruber ,  Sung K. Kang ,  Paul A. Lauro ,  Da-Yuan Shih

IPC分类号： B23K35/12

CPC分类号： H05K3/3436 ,  B23K35/26 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13176 ,  H01L2224/13181 ,  H01L2224/13184 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2201/10287 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0415 ,  H05K2203/128 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have filler particles or reinforcing conductors therein. In the interconnect structures produced, the cost and time of a subsequent underfill step is reduced or avoided. The problem of incompatibility with optical interconnects between chips because underfills require high loading of silica fillers which scatter light, is solved, thus allowing flip chips to incorporate optical interconnects.

摘要翻译： 改进的互连通过注射成型的焊料生产，该焊料用熔融焊料填充模具阵列，使得形成具有大于1的高宽比宽高比的柱而不是传统的倒装芯片凸块。 该列可以在其中具有填料颗粒或增强导体。 在所生产的互连结构中，减少或避免了后续底部填充步骤的成本和时间。 与芯片之间的光学互连不兼容的问题，因为底部填充物需要高散射光的二氧化硅填料的高负载，因此可以使倒装芯片结合光学互连。

公开(公告)号：US20080224328A1

公开(公告)日：2008-09-18

申请号：US12123554

申请日：2008-05-20

申请人： Mukta Ghate Farooq ,  Thomas J. Fleischman

发明人： Mukta Ghate Farooq ,  Thomas J. Fleischman

IPC分类号： H01L23/12

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/98 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/3463 ,  H05K2201/10992 ,  H05K2203/0113 ,  Y02P70/613 ,  H01L2924/00

摘要： An improved method for performing an improved Temporary Chip Attach utilizing an Injection Molded Solder (IMS) process to allow efficient testing of die for creating a Known Good Die Bank. The IMS is applied to the testing substrate to form a column on the substrate. The die to be tested can then be attached to the IMS column with C4 solder. A slight reflow is then applied to the die, allowing some of the C4 to melt, and form an electrical connection with the corresponding IMS column. After testing, the die can be removed along with the C4 from the IMS column or permanently attached the substrate by performing a full reflow of the C4.

摘要翻译： 一种用于使用注射成型焊料（IMS）工艺执行改进的临时芯片连接的改进方法，以允许有效测试模具以创建已知的良好模具库。 将IMS应用于测试基板以在基板上形成柱。 待测试的模具然后可以用C4焊料连接到IMS柱。 然后将稍微的回流施加到管芯，使得一些C4熔化，并与相应的IMS柱形成电连接。 经过测试，模具可以与来自IMS柱的C4一起被去除，也可以通过C4的完全回流来永久地附着基板。

公开(公告)号：US20080128160A1

公开(公告)日：2008-06-05

申请号：US12025928

申请日：2008-02-05

申请人： Daewoong Suh

发明人： Daewoong Suh

IPC分类号： H05K1/16

CPC分类号： H05K3/3436 ,  H05K3/3463 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147

摘要： In some example embodiments, a method includes engaging a first contact on a motherboard with a second contact on an electronic package. A portion of one of the first and second contacts is covered with an interlayer that has a lower melting temperature than both of the first and second contacts. The method further includes bonding the first contact to the second contact by melting the interlayer to diffuse the interlayer into the first and second contacts. The bonded first and second contacts have a higher melting temperature than the interlayer before melting. In other example embodiments, an electronic assembly includes a motherboard having a first contact that is bonded to a second contact on an electronic package. An interlayer is diffused within the first and second contacts such that they have a higher melting temperature than the interlayer before the interlayer is diffused into the first and second contacts.

摘要翻译： 在一些示例性实施例中，一种方法包括使主板上的第一触点与电子封装上的第二触点接合。 第一和第二触点之一的一部分被中间层覆盖，该中间层具有比第一和第二触点两者更低的熔化温度。 该方法还包括通过熔化中间层将第一接触件接合到第二接触件，以将中间层扩散到第一和第二接触件中。 接合的第一和第二触点在熔融之前具有比中间层更高的熔融温度。 在其他示例性实施例中，电子组件包括具有接合到电子封装上的第二触点的第一触点的母板。 中间层在第一和第二触点内扩散，使得它们在中间层扩散到第一和第二触点之前具有比中间层更高的熔化温度。

公开(公告)号：US20080048009A1

公开(公告)日：2008-02-28

申请号：US10585729

申请日：2005-10-27

申请人： Tadashi Maeda ,  Tadahiko Sakai

发明人： Tadashi Maeda ,  Tadahiko Sakai

IPC分类号： B23K1/20 ,  B23K35/22

CPC分类号： H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/3613 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10992 ,  Y02P70/613

摘要： It provides metal-powder-contained flux disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprises a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.

摘要翻译： 当通过焊接安装电子部件时，它提供设置在凸块和电路电极之间的金属粉末含量的金属，金属粉末包括由诸如锡和锌的金属形成的芯金属和由贵金属形成的芯金属的表面金属覆盖表面 金属如金和银。 因此，金属粉末不会残留在回流处理后容易引起迁移的残留物，并且可以确保焊接效果和绝缘效果。

公开(公告)号：US07293692B2

公开(公告)日：2007-11-13

申请号：US10865474

申请日：2004-06-10

申请人： Hiroshi Akamatsu ,  Yukinori Kawamura ,  Hiroshi Kai ,  Osamu Kuramoto ,  Shigeru Iwasaki ,  Kenji Asai ,  Minoru Hibino

发明人： Hiroshi Akamatsu ,  Yukinori Kawamura ,  Hiroshi Kai ,  Osamu Kuramoto ,  Shigeru Iwasaki ,  Kenji Asai ,  Minoru Hibino

IPC分类号： B23K31/02

CPC分类号： H05K3/3415 ,  B23K3/0638 ,  B23K2101/42 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10992 ,  H05K2203/0545 ,  H05K2203/111 ,  H05K2203/1121 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T428/12493

摘要： A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.

摘要翻译： 公开了由具有优异特性的锌基无铅焊料形成的焊点结构的结构。 在第一无铅焊料层和焊盘之间形成以下层：形成在焊盘上的锡 - 铜合金层; 由主要成分为锡和银的第二无铅层形成的第一合金层; 以及形成在第一合金层和第一无铅焊料之间的第二合金层。 这种结构允许形成由具有高接合强度的锌基无铅焊料形成的焊点结构。

公开(公告)号：US20070178688A1

公开(公告)日：2007-08-02

申请号：US11341302

申请日：2006-01-27

申请人： Hei Shiu ,  On Chau ,  Gor Lai

发明人： Hei Shiu ,  On Chau ,  Gor Lai

IPC分类号： H01L21/44

CPC分类号： H05K3/3484 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0381 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/114 ,  H01L2224/11552 ,  H01L2224/116 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/81011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/19043 ,  H05K3/3463 ,  H05K2201/10992 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/0485 ,  H05K2203/1476 ,  H01L2924/00014

摘要： A method for forming multi-layer bumps on a substrate includes depositing an adhesive or a flux on the substrate, depositing a first metal powder on the adhesive, and melting or reflowing the adhesive and first metal powder to form first bumps. An adhesive or a flux and a second metal powder are then deposited on the first bumps, and melted to form second bumps on the first bumps to form multi-layer bumps. The multi-layer bumps are formed without the need for any wet chemicals.

摘要翻译： 在基板上形成多层凸块的方法包括在基板上沉积粘合剂或助熔剂，在粘合剂上沉积第一金属粉末，熔化或回流粘合剂和第一金属粉末以形成第一凸块。 然后将粘合剂或助熔剂和第二金属粉末沉积在第一凸块上，并熔化以在第一凸块上形成第二凸块以形成多层凸块。 形成多层凸块，而不需要任何湿化学品。