公开(公告)号：US5358806A

公开(公告)日：1994-10-25

申请号：US854861

申请日：1992-03-19

Applicant: Satoshi Haraichi ,  Fumikazu Itoh ,  Akira Shimase ,  Hiroshi Yamaguchi ,  Junzou Azuma ,  Yasuhiro Koizumi

Inventor： Satoshi Haraichi ,  Fumikazu Itoh ,  Akira Shimase ,  Hiroshi Yamaguchi ,  Junzou Azuma ,  Yasuhiro Koizumi

IPC: G03F1/26 ,  G03F1/74 ,  G03F9/00

CPC classification number: H01J37/228 ,  G03F1/74 ,  H01J37/3056 ,  G03F1/26 ,  H01J2237/2482 ,  H01J2237/30466

Abstract: A defect of a phase shift mask, which has a phase shifter disposed on a transparent substrate, formed into a predetermined pattern and acting to shift a phase of exposure light transmitted therethrough and an etching stopper disposed between the phase shifter and the transparent substrate, which is resistant to an etching to which the phase shifter is subjected and transparent for exposure light is corrected by selectively etching a defective portion of the phase shifter, having a lacking type defect, with respect to the etching stopper layer along the whole thickness of the phase shifter and by perforating a portion of the etching stopper layer and the transparent substrate positioned under the etched defective portion by a depth which corresponds to a magnitude of an optical path of the phase shifter for the exposure light, the etching being a reactive etching which uses charged particle beam and a reactive gas and, the bottom surface of a portion etched being flattened by utilizing a fact that the phase shifter is selectively etched.

Abstract translation: 具有设置在透明基板上的移相器的相移掩模的缺陷形成为预定图案并且用于移动透过其的曝光光的相位和设置在移相器和透明基板之间的蚀刻阻挡层， 对于移相器经受的蚀刻和曝光的透明度的蚀刻是通过沿相位的整个厚度相对于蚀刻停止层选择性蚀刻缺陷型缺陷的相移器的缺陷部分而被校正的 并且通过将位于蚀刻的缺陷部分下方的蚀刻阻挡层和透明基板的一部分穿孔相当于用于曝光光的移相器的光路的大小的深度，蚀刻是使用的反应性蚀刻 带电粒子束和反应性气体，并且通过利用被蚀刻的部分的底表面变平 移相器被选择性蚀刻的事实。

公开(公告)号：US4990776A

公开(公告)日：1991-02-05

申请号：US227645

申请日：1988-08-03

Applicant: Satoru Fushimi ,  Hiroya Koshishiba

Inventor： Satoru Fushimi ,  Hiroya Koshishiba

IPC: H01J37/141 ,  G01R31/305 ,  H01J37/21 ,  H01J37/22 ,  H01J37/244

CPC classification number: H01J37/21 ,  G01R31/305 ,  H01J37/228 ,  H01J37/28 ,  H01J2237/216 ,  H01J2237/2482

Abstract: An auto-focusing electron microscope used for the observation, measurement and/or checking of a circuit pattern or the like comprises an objective lens capable of changing a focal position of an electron beam, an optical system for projecting a light and shade pattern having a light-permeable portion and a light-shielding portion onto the surface of a specimen through the objective lens, and a detector for detecting the projected pattern while optically reflecting it, whereby focusing can be made while reducing any damage and/or charging of the specimen.

Abstract translation: 用于电路图案等的观察，测量和/或检查的自动聚焦电子显微镜包括能够改变电子束的焦点位置的物镜，用于投影具有 光透射部分和遮光部分通过物镜到样本表面上，以及用于在光学反射的同时检测投影图案的检测器，从而可以在减少样本的损伤和/或充电的同时进行聚焦 。

公开(公告)号：US3800152A

公开(公告)日：1974-03-26

申请号：US20660171

申请日：1971-12-10

Applicant: ONERA (OFF NAT AEROSPATIALE)

Inventor： DAIGNE B ,  GIRARD F

IPC: G01N23/225 ,  H01J37/02 ,  H01J37/20 ,  H01J37/22 ,  H01J37/252 ,  H01J37/28 ,  G01N23/22

CPC classification number: H01J37/244 ,  H01J37/02 ,  H01J37/20 ,  H01J37/228 ,  H01J37/252 ,  H01J37/256 ,  H01J37/28

Abstract: To enable visual observation and X-ray analysis of a sample irradiated by an electron beam, a heat-protective assembly overlying a sample-supporting surface includes an enclosure with a central window for the electron beam, a surrounding annular window for light rays and a pair of lateral windows for X-rays emanating from the sample. An inner shield has a frustoconical body, with generatrices converging toward the supporting surface, which gives passage to both the light rays and the electron beam while screening an area surrounding the annular lighttransmissive window of the enclosure without, however, blocking the passage of the X-rays. A set of deflecting plates for the electron beam is mounted on the inner shield, between its frustoconical body and a diaphragm forming the central window, in a zone between the paths of the light rays and the electron beam.

Abstract translation: 为了对由电子束照射的样品进行目视观察和X射线分析，覆盖样品支撑表面的保温组件包括具有用于电子束的中心窗口的外壳，用于光线的周围环形窗口和 一对用于从样品发出的X射线的侧窗。 内屏蔽件具有截头圆锥体，母线朝向支撑表面会聚，该通孔同时屏蔽外壳的环形透光窗周围的区域，同时通过光线和电子束，而不会阻塞 X光片。 一组用于电子束的偏转板安装在内屏蔽件之间，在它的截头圆锥体和形成中心窗口的光阑之间，在光线和电子束的路径之间的区域中。

公开(公告)号：US12014896B2

公开(公告)日：2024-06-18

申请号：US17579309

申请日：2022-01-19

Applicant: ATTOLIGHT AG

Inventor： Matthew J. Davies

IPC: H01J37/244 ,  H01J37/22

CPC classification number: H01J37/244 ,  H01J37/228

Abstract: A wafer having μLEDs is inspected using cathodoluminescence microscopes. A fast scan is enabled by splitting the CL beam into several beams and sensing the beams with point detectors. Optical filters are inserted in the optical path upstream of the detectors, such that each detector senses a different frequency band. The signals are ratioed and the ratios are compared to expected reference. Regions of extreme value are identified and, if desired, a high resolution scan is performed on the regions or a sample of the regions. Viability score is calculated for each identified region.

公开(公告)号：US20230298855A1

公开(公告)日：2023-09-21

申请号：US18016057

申请日：2021-07-13

Applicant: DELMIC IP B.V.

Inventor： Andries Pieter Johan EFFTING ,  Sander Vincent DEN HOEDT

IPC: H01J37/305 ,  H01J37/20 ,  G01N1/28 ,  H01J37/22

CPC classification number: H01J37/3056 ,  H01J37/20 ,  G01N1/286 ,  H01J37/228 ,  H01J2237/31745 ,  H01J2237/31749 ,  G01N2001/2873 ,  H01J2237/208

Abstract: An apparatus and a method for micromachining samples is provided. The apparatus includes an integral combination of a sample holder, a focused ion beam exposure system for projecting a FIB onto a first position on the sample, and a light optical microscope. The LM is configured for imaging or monitoring said first position. The method includes the steps of capturing LM images of the sample, determining a position and physical dimensions of a region of interest in the sample based on the LM images, establishing from the LM images settings of the sample holder and/or the FIB exposure system, for micromachining the sample to bring the region of interest more closer to the surface, and moving the sample or the trajectory of the FIB to locate the first position on the sample accordingly, and activating the FIB for micromachining the sample.

公开(公告)号：US20180358199A1

公开(公告)日：2018-12-13

申请号：US15780064

申请日：2016-11-29

Applicant: Matsusada Precision, Inc.

Inventor： Kazuya Kumamoto ,  Sadayoshi Matsuda

IPC: H01J37/10 ,  H01J37/22 ,  H01J37/244 ,  H01J37/28

CPC classification number: H01J37/10 ,  H01J37/141 ,  H01J37/22 ,  H01J37/228 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/2445 ,  H01J2237/24475 ,  H01J2237/2448

Abstract: A charged particle beam device includes: a charged particle source configured to emit a charged particle beam; an acceleration electric power source connected to the charged particle source and configured to accelerate the charged particle beam; a second objective lens configured to focus the charged particle beam onto a sample; and a second detector. The second objective lens is positioned on the opposite side of the sample from where the charged particle beam is incident on the sample. The second detector is configured to receive at least one of: an electromagnetic wave that the sample emits upon receiving the charged particle beam, and an electromagnetic wave that the sample reflects upon receiving the charged particle beam. The second detector carries out a detection of the received electromagnetic wave(s).

公开(公告)号：US20180019098A1

公开(公告)日：2018-01-18

申请号：US15648757

申请日：2017-07-13

Applicant: FEI Company

Inventor： Eric Gerardus Theodoor Bosch ,  Bart Jozef Janssen

IPC: H01J37/22 ,  H01J37/20 ,  H01J37/244

CPC classification number: H01J37/222 ,  H01J37/20 ,  H01J37/228 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/226 ,  H01J2237/2614

Abstract: A method of imaging a specimen using ptychography includes directing a charged-particle beam from a source through an illuminator so as to traverse the specimen and land upon a detector, detecting a flux of radiation emanating from the specimen with the detector, calculating at least one property of a charged-particle wavefront exiting the specimen based on using an output of the detector in combination with applying a mathematical reconstruction technique, wherein the at least one property comprises a phase of the wavefront, and wherein applying the mathematical construction technique comprises directly reconstructing the phase of the wavefront to determine a reconstructed phase of the wavefront. An associated apparatus is also described.

公开(公告)号：US20170205363A1

公开(公告)日：2017-07-20

申请号：US15314141

申请日：2015-06-18

Applicant: LEIBNIZ-INSTITUT FUER NEUE MATERIALIEN GEMEINNUETZIGE GESELLSCHAFT MIT BESCHRAENKTER HAFT

Inventor： Niels DE JONGE ,  Diana B. PECKYS

IPC: G01N23/225 ,  H01J37/20

CPC classification number: G01N23/2251 ,  G01N2223/307 ,  G01N2223/418 ,  G01N2223/612 ,  H01J37/20 ,  H01J37/228 ,  H01J2237/2004 ,  H01J2237/24455 ,  H01J2237/2802

Abstract: The present invention relates to a device and a method for the stoichiometric analysis of samples.In order to study the spatial distribution of different proteins in the plasma membrane of a complete cell within a short time frame, a device and a method are proposed for the stoichiometric analysis of samples.The object is established by means of a device for the stoichiometric analysis of samples, said device comprising a) a sample processing device comprising a sample holder for holding the sample, means for setting the temperature, means for adding and removing fluids (including gases) and at least one fluid reservoir, b) an electron microscope with a detector, and c) a computer-controlled process control system for controlling the means for setting the temperature and the means for adding and removing fluids (including gases), a computer-controlled and automated imaging device that captures images by means of the electron microscope, a unit that stores the captured images and an image analysis unit controlled by the computer.

公开(公告)号：US09466464B1

公开(公告)日：2016-10-11

申请号：US14694710

申请日：2015-04-23

Applicant: Multibeam Corporation

Inventor： David K. Lam ,  Kevin M. Monahan ,  Michael C. Smayling ,  Theodore A. Prescop

IPC: H01J37/30 ,  H01J37/305 ,  H01J37/22 ,  H01J37/05 ,  H01J37/304 ,  H01J37/317

CPC classification number: H01L21/3065 ,  B81C1/00373 ,  B81C2201/0143 ,  B81C2201/0188 ,  C23C14/48 ,  C23C16/047 ,  C23C16/48 ,  C23C16/486 ,  C23C16/487 ,  H01J37/05 ,  H01J37/06 ,  H01J37/08 ,  H01J37/228 ,  H01J37/244 ,  H01J37/30 ,  H01J37/304 ,  H01J37/305 ,  H01J37/3053 ,  H01J37/3056 ,  H01J37/3172 ,  H01J37/3174 ,  H01J37/3177 ,  H01J37/3178 ,  H01J2237/004 ,  H01J2237/0635 ,  H01J2237/1501 ,  H01J2237/24592 ,  H01J2237/30466 ,  H01J2237/30472 ,  H01J2237/31708 ,  H01J2237/31732 ,  H01J2237/31735 ,  H01J2237/31737 ,  H01J2237/3174 ,  H01J2237/31749 ,  H01L21/0228 ,  H01L21/0262 ,  H01L21/26 ,  H01L21/308 ,  H01L21/3085 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Methods, devices and systems for patterning of substrates using charged particle beams without photomasks and without a resist layer. Material can be removed from a substrate, as directed by a design layout database, localized to positions targeted by multiple, matched charged particle beams. Reducing the number of process steps, and eliminating lithography steps, in localized material removal has the dual benefit of reducing manufacturing cycle time and increasing yield by lowering the probability of defect introduction. Furthermore, highly localized, precision material removal allows for controlled variation of removal rate and enables creation of 3D structures or profiles. Local gas injectors and detectors, and local photon injectors and detectors, are local to corresponding ones of the columns, and can be used to facilitate rapid, accurate, targeted substrate processing.

Abstract translation: 用于使用没有光掩模并且没有抗蚀剂层的带电粒子束来图案化衬底的方法，装置和系统。 材料可以从设计布局数据库指导的基板上移除，该设计布局数据库被定位到由多个匹配的带电粒子束瞄准的位置。 在局部材料去除中减少工艺步骤的数量和消除光刻步骤具有减少制造周期时间并通过降低缺陷引入概率来提高产量的双重优点。 此外，高度局部化的精密材料去除允许控制的去除速率的变化，并且能够创建3D结构或轮廓。 本地气体注入器和检测器以及本地光子注入器和检测器对应于相应的列是局部的，并且可以用于促进快速，准确的靶向基板处理。

公开(公告)号：US09453281B1

公开(公告)日：2016-09-27

申请号：US14745463

申请日：2015-06-21

Applicant: Multibeam Corporation

Inventor： Theodore A. Prescop ,  Kevin M. Monahan ,  David K. Lam ,  Michael C. Smayling

IPC: C23C16/48 ,  H01J37/08 ,  H01J37/30 ,  H01J37/244 ,  H01J37/06

CPC classification number: H01L21/3065 ,  B81C1/00373 ,  B81C2201/0143 ,  B81C2201/0188 ,  C23C14/48 ,  C23C16/047 ,  C23C16/48 ,  C23C16/486 ,  C23C16/487 ,  H01J37/05 ,  H01J37/06 ,  H01J37/08 ,  H01J37/228 ,  H01J37/244 ,  H01J37/30 ,  H01J37/304 ,  H01J37/305 ,  H01J37/3053 ,  H01J37/3056 ,  H01J37/3172 ,  H01J37/3174 ,  H01J37/3177 ,  H01J37/3178 ,  H01J2237/004 ,  H01J2237/0635 ,  H01J2237/1501 ,  H01J2237/24592 ,  H01J2237/30466 ,  H01J2237/30472 ,  H01J2237/31708 ,  H01J2237/31732 ,  H01J2237/31735 ,  H01J2237/31737 ,  H01J2237/3174 ,  H01J2237/31749 ,  H01L21/0228 ,  H01L21/0262 ,  H01L21/26 ,  H01L21/308 ,  H01L21/3085 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26

Abstract: Methods, devices and systems for patterning of substrates using charged particle beams without photomasks and without a resist layer. Material can be deposited onto a substrate, as directed by a design layout database, localized to positions targeted by multiple, matched charged particle beam columns. Reducing the number of process steps, and eliminating lithography steps, in localized material addition has the dual benefit of reducing manufacturing cycle time and increasing yield by lowering the probability of defect introduction. Furthermore, highly localized, precision material deposition allows for controlled variation of deposition rate and enables creation of 3D structures. Local gas injectors and detectors, and local photon injectors and detectors, are local to corresponding ones of the columns, and can be used to facilitate rapid, accurate, targeted, highly configurable substrate processing, advantageously using large arrays of said beam columns.

Abstract translation: 用于使用没有光掩模并且没有抗蚀剂层的带电粒子束来图案化衬底的方法，装置和系统。 材料可以沉积到衬底上，如设计布局数据库所指示的那样，被定位到由多个匹配的带电粒子束柱靶向的位置上。 减少工艺步骤的数量和消除光刻步骤在局部化材料添加中具有减少制造周期时间并通过降低缺陷引入概率来提高产量的双重优点。 此外，高度局部化的精密材料沉积允许沉积速率的受控变化并且能够创建3D结构。 局部气体注入器和检测器以及本地光子注入器和检测器对于相应的列是局部的，并且可以用于促进快速，准确，有针对性的高度可配置的衬底处理，有利地使用所述束柱的大阵列。