公开(公告)号：US5501390A

公开(公告)日：1996-03-26

申请号：US287545

申请日：1994-08-08

申请人： Curtis G. Allen ,  David H. Perrone ,  David M. Rossi

发明人： Curtis G. Allen ,  David H. Perrone ,  David M. Rossi

IPC分类号： B23K35/00 ,  C04B37/02 ,  H01J23/00 ,  H01J23/30 ,  B23K1/19

CPC分类号： C04B37/026 ,  B23K35/007 ,  H01J23/005 ,  H01J23/30 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/125 ,  C04B2237/366 ,  C04B2237/403 ,  C04B2237/54 ,  C04B2237/72 ,  C04B2237/76

摘要： A method for bonding thermally-mismatched elements of a traveling wave tube employs a metallic plate of undulating character. The plate is located at the region of the interface between tube elements formed of materials of materially-differing thermal character such as the ceramic termination piece and an adjacent sever pole piece of copper. Through either a brazing or a sintering process, pluralities of bonds are formed at points of tangency between the plate and the two elements of differing thermal expansion coefficients. As a result, a good heat flow path, accompanied by a more stable r.f. interface, is formed between the materials that is not subject to fracture as are prior art diffusion bonds.

摘要翻译： 用于结合行波管的热失配元件的方法采用波动特性的金属板。 该板位于由具有实质上不同的热特性的材料形成的管元件之间的界面区域，例如陶瓷端接件和相邻的铜极片。 通过钎焊或烧结工艺，在板和不同热膨胀系数的两个元件之间的相切点处形成多个键。 结果，良好的热流路径，伴随着更稳定的r.f. 界面，在现有技术的扩散接合之间形成在不会破裂的材料之间。

公开(公告)号：US5290333A

公开(公告)日：1994-03-01

申请号：US984613

申请日：1992-12-02

申请人： Herman F. Nied ,  Richard L. Mehan

发明人： Herman F. Nied ,  Richard L. Mehan

IPC分类号： B23K20/00 ,  C04B37/02 ,  F28F21/04 ,  F28F21/08 ,  C03C27/00

CPC分类号： C04B37/026 ,  C04B35/62665 ,  C04B37/025 ,  F28F21/04 ,  C04B2237/062 ,  C04B2237/083 ,  C04B2237/10 ,  C04B2237/122 ,  C04B2237/365 ,  C04B2237/368 ,  C04B2237/403 ,  C04B2237/52 ,  C04B2237/54 ,  C04B2237/58 ,  C04B2237/64 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/765 ,  C04B2237/82 ,  C04B2237/84 ,  C04B2237/88 ,  Y10T428/12535 ,  Y10T428/12611 ,  Y10T428/131 ,  Y10T428/1317 ,  Y10T428/249957 ,  Y10T428/249969 ,  Y10T428/24997 ,  Y10T428/24999

摘要： A Si--SiC ceramic layer is bonded to a non-porous SiC substrate with the Si etched from the layer to form a relatively porous surface on the otherwise non-porous high strength SiC substrate. A quartz layer is softened by heating and forced into the pores of the porous layer to form a mechanical bond to the SiC substrate. A refractory metal layer is bonded to the quartz layer to complete the joint. A refractory metal support component is then bonded to the refractory layer whereby the quartz serves as a high strength, high temperature reaction barrier between the metal of the refractory layer and the silicon of the SiC substrate.

摘要翻译： 将Si-SiC陶瓷层与无孔SiC衬底结合，其中从层上蚀刻的Si在另外无孔的高强度SiC衬底上形成相对多孔的表面。 石英层通过加热软化并且被迫进入多孔层的孔隙中以形成与SiC衬底的机械结合。 难熔金属层结合到石英层以完成接头。 然后将耐火金属支撑部件结合到耐火层，由此石英用作耐火层的金属和SiC衬底的硅之间的高强度，高温反应屏障。

公开(公告)号：US5200241A

公开(公告)日：1993-04-06

申请号：US353580

申请日：1989-05-18

申请人： Herman F. Nied ,  Richard L. Mehan

发明人： Herman F. Nied ,  Richard L. Mehan

IPC分类号： B23K20/00 ,  C04B37/02 ,  F28F21/04 ,  F28F21/08

CPC分类号： C04B37/026 ,  C04B35/62665 ,  C04B37/025 ,  F28F21/04 ,  C04B2237/062 ,  C04B2237/083 ,  C04B2237/10 ,  C04B2237/122 ,  C04B2237/365 ,  C04B2237/368 ,  C04B2237/403 ,  C04B2237/52 ,  C04B2237/54 ,  C04B2237/58 ,  C04B2237/64 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/765 ,  C04B2237/82 ,  C04B2237/84 ,  C04B2237/88 ,  Y10T428/12535 ,  Y10T428/12611 ,  Y10T428/131 ,  Y10T428/1317 ,  Y10T428/249957 ,  Y10T428/249969 ,  Y10T428/24997 ,  Y10T428/24999

摘要： A Si--SiC ceramic layer is bonded to a non-porous SiC substrate with the Si etched from the layer to form a relatively porous surface on the otherwise non-porous high strength SiC substrate. A quartz layer is softened by heating and forced into the pores of the porous layer to form a mechanical bond to the SiC substrate. A refractory metal layer is bonded to the quartz layer to complete the joint. A refractory metal support component is then bonded to the refractory layer whereby the quartz serves as a high strength, high temperature reaction barrier between the metal of the refractory layer and the silicon of the SiC substrate.

摘要翻译： 将Si-SiC陶瓷层与无孔SiC衬底结合，其中从层上蚀刻的Si在另外无孔的高强度SiC衬底上形成相对多孔的表面。 石英层通过加热软化并且被迫进入多孔层的孔隙中以形成与SiC衬底的机械结合。 难熔金属层结合到石英层以完成接头。 然后将耐火金属支撑部件结合到耐火层，由此石英用作耐火层的金属和SiC衬底的硅之间的高强度，高温反应屏障。

公开(公告)号：US5125971A

公开(公告)日：1992-06-30

申请号：US545599

申请日：1990-06-29

申请人： Tohru Nonami ,  Nobuo Yasui

发明人： Tohru Nonami ,  Nobuo Yasui

IPC分类号： A61C8/00 ,  A61F2/00 ,  A61K6/06 ,  A61L27/10 ,  A61L27/12 ,  A61L27/30 ,  A61L27/32 ,  A61L27/42 ,  A61L27/50 ,  C04B35/195 ,  C04B35/447 ,  C04B35/645 ,  C04B35/80 ,  C04B37/00 ,  C04B37/02

CPC分类号： C04B35/803 ,  A61C8/0012 ,  A61K6/0008 ,  A61K6/0044 ,  A61K6/0215 ,  A61K6/0235 ,  A61K6/024 ,  A61K6/033 ,  A61K6/0612 ,  A61K6/0668 ,  A61K6/0675 ,  A61L27/10 ,  A61L27/12 ,  A61L27/30 ,  A61L27/32 ,  A61L27/425 ,  A61L27/50 ,  C04B35/195 ,  C04B35/447 ,  C04B35/645 ,  C04B35/6455 ,  C04B37/001 ,  C04B37/021 ,  C04B37/025 ,  C04B37/026 ,  A61F2310/00293 ,  A61F2310/00796 ,  C04B2235/5268 ,  C04B2235/6567 ,  C04B2237/06 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/361 ,  C04B2237/365 ,  C04B2237/368 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/408 ,  C04B2237/52 ,  C04B2237/525 ,  C04B2237/54 ,  C04B2237/66 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/76 ,  C04B2237/84

摘要： A living hard tissue replacement is prepared by superplastic forming a ceramic material which contains CaO, SiO.sub.2, and MgO, is substantially free of calcium phosphate, but capable of forming a calcium phosphate base compound upon contact with phosphorus-containing water. A replacement is also prepared by superplastic forming a sintered composite body comprising a calcium phosphate base ceramic matrix and an inorganic filler dispersed therein. Both the replacements are suitable as artificial dental roots and crowns.

公开(公告)号：US4398980A

公开(公告)日：1983-08-16

申请号：US286422

申请日：1981-07-24

申请人： Paul V. Kelsey, Jr. ,  William T. Siegel

发明人： Paul V. Kelsey, Jr. ,  William T. Siegel

IPC分类号： B23K35/38 ,  C04B37/02 ,  G01N27/07 ,  C03B29/00 ,  B23K31/02 ,  C04B33/34

CPC分类号： C04B37/021 ,  B23K35/38 ,  G01N27/07 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/6582 ,  C04B2237/32 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/525 ,  C04B2237/54 ,  Y10S228/903

摘要： A method of fabricating a seal between a ceramic and an alloy comprising the steps of prefiring the alloy in an atmosphere with a very low partial pressure of oxygen, firing the assembled alloy and ceramic in air, and gradually cooling the fired assembly to avoid the formation of thermal stress in the ceramic. The method forms a bond between the alloy and the ceramic capable of withstanding the environment of a pressurized water reactor and suitable for use in an electrical conductivity sensitive liquid level transducer.

摘要翻译： 一种在陶瓷和合金之间制造密封的方法，包括以下步骤：在具有非常低的氧分压的气氛中预烧合金，在空气中烧结组合的合金和陶瓷，并逐渐冷却烧制的组件以避免形成 的陶瓷中的热应力。 该方法在合金和能够耐受压水反应器的环境的陶瓷之间形成粘结，并适用于导电敏感液位传感器。

公开(公告)号：US3920172A

公开(公告)日：1975-11-18

申请号：US51185474

申请日：1974-10-03

申请人： BENDIX CORP

发明人： RHEE SEONG K

IPC分类号： C03C27/04 ,  C04B37/02 ,  G01N27/407 ,  C03C27/02

CPC分类号： G01N27/4075 ,  C04B37/025 ,  C04B2235/6582 ,  C04B2237/10 ,  C04B2237/348 ,  C04B2237/406 ,  C04B2237/52 ,  C04B2237/54 ,  C04B2237/708 ,  C04B2237/765 ,  C04B2237/84 ,  G01N27/407 ,  G01N27/4078 ,  Y10T29/4921

摘要： This invention relates to an improved ceramic to metal conductive glass seal and to a process of forming an oxidation and corrosion resistant conductive glass seal between a ceramic and metal member.

摘要翻译： 本发明涉及一种改进的陶瓷与金属导电玻璃密封件以及在陶瓷和金属构件之间形成耐氧化和耐腐蚀的导电玻璃密封件的方法。

公开(公告)号：US20190202743A1

公开(公告)日：2019-07-04

申请号：US16232851

申请日：2018-12-26

申请人： TYK Corporation

发明人： Kenji Yanagi

IPC分类号： C04B35/565 ,  C04B41/00 ,  C04B41/50 ,  C04B41/87

CPC分类号： C04B35/565 ,  C04B41/009 ,  C04B41/5035 ,  C04B41/87 ,  C04B2237/54 ,  C04B41/4529 ,  C04B41/4556

摘要： A silicon carbide-natured refractory block includes a fire-resistant block body, and a calcination coated layer.The fire-resistant block body includes a silicon carbide-natured refractory having a predetermined configuration. The calcination coated layer includes silicon oxide made by heating an outer superficial portion of the fire-resistant block body to oxidize at least some of silicon carbide therein to turn the silicon carbide into the silicon oxide. The silicon oxide sinters the calcination coated layer to increase the corrosion resistance.

公开(公告)号：US10000423B1

公开(公告)日：2018-06-19

申请号：US15088088

申请日：2016-03-31

申请人： IXYS Corporation

发明人： Thomas Spann

IPC分类号： C04B37/00 ,  B23K1/20 ,  C04B37/02

CPC分类号： C04B37/021 ,  B23K1/20 ,  C04B37/026 ,  C04B2235/6584 ,  C04B2235/945 ,  C04B2237/086 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/407 ,  C04B2237/54 ,  C04B2237/592 ,  C04B2237/64 ,  C04B2237/704

摘要： Top and bottom metal plates of a DMB panel stack are simultaneously direct-bonded to the central ceramic sheet in a single high-temperature step. During this step, the DMB panel rests on an array of very small upwardly projecting ceramic contacts of a ceramic carrier. An amount of unoxidized carbon (e.g., a layer of graphite) is disposed on each contact projection such that an amount of carbon is disposed between the top of the contact projection and the metal oxide skin of the bottom metal plate. The carbon bonds with oxygen from the metal oxide skin, thereby preventing connection or direct-bonding of the ceramic contact projection to the second metal plate. This reduces imperfections in the metal of the bottom plate and reduces the amount of ceramic particles bonded to metal at contact sites. As a result, less post-bonding processing is required to make a high quality DMB substrate.

公开(公告)号：US20160304405A1

公开(公告)日：2016-10-20

申请号：US15102951

申请日：2014-11-28

申请人： ROGERS GERMANY GMBH

发明人： Andreas Meyer ,  Fabian Hierstetter

IPC分类号： C04B35/645 ,  H01L23/498 ,  H01L21/48 ,  C04B37/02 ,  H01L23/373

CPC分类号： C04B35/6455 ,  C04B37/021 ,  C04B37/025 ,  C04B37/026 ,  C04B2237/064 ,  C04B2237/068 ,  C04B2237/08 ,  C04B2237/083 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/54 ,  C04B2237/592 ,  C04B2237/595 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/72 ,  C04B2237/84 ,  C04B2237/86 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/022 ,  H05K3/388 ,  H05K2203/04 ,  H01L2924/00

摘要： The invention relates to a method for producing a metal-ceramic substrate including first and second metallizations and at least one ceramic layer incorporated between the first and second metallizations. Advantageously, first and second metal layers and the at least one ceramic layer are stacked superposed, and in such a way that the free edge sections, of the first and second metal layers respectively, project beyond the edges of the at least one ceramic layer and the first and second metal layers are deformed toward each other in the region of the projecting free edge sections and directly connected to each other in order to form a gas-tight, sealed metal container enclosing a container interior for receiving the at least one ceramic layer. Subsequently, the metal layers forming the metal container with the at least one ceramic layer received in the container interior are hot isostatically pressed together in a treatment chamber at a gas pressure between 500 and 2000 bar and at a process temperature between 300° C. and the melting temperature of the metal layers for producing a preferably flat connection of at least one of the metal layers and the at least one ceramic layer, and at least the projecting free edge sections, which are connected to each other, of the metal layers for forming the first and second metallization are subsequently removed.

摘要翻译： 本发明涉及一种用于制造包括第一和第二金属化的金属陶瓷衬底的方法以及结合在第一和第二金属化之间的至少一个陶瓷层。 有利的是，第一和第二金属层和至少一个陶瓷层被叠置在一起，并且使得第一和第二金属层的自由边缘部分分别突出超过至少一个陶瓷层的边缘，并且 第一和第二金属层在突出的自由边缘部分的区域中彼此变形并且彼此直接连接，以形成封闭容器内部的气密密封的金属容器，用于容纳至少一个陶瓷层 。 随后，形成具有容纳在容器内部中的至少一个陶瓷层的金属容器的金属层在500-2000巴之间的气体压力和在300℃和200℃之间的过程温度下被热等静压在处理室中 金属层的熔融温度，用于产生金属层和至少一个陶瓷层中的至少一个的优选平坦连接，以及至少彼此连接的突出的自由边缘部分，用于 随后除去形成第一和第二金属化。

公开(公告)号：US09023453B2

公开(公告)日：2015-05-05

申请号：US13022544

申请日：2011-02-07

申请人： Takahiko Ido ,  Yoshihiro Koga ,  Takumi Asanuma ,  Takashi Ito

发明人： Takahiko Ido ,  Yoshihiro Koga ,  Takumi Asanuma ,  Takashi Ito

IPC分类号： C04B35/565 ,  B01D46/24 ,  C04B41/50 ,  B01J35/04 ,  C04B38/00 ,  F01N3/20 ,  F01N3/28 ,  C04B35/634 ,  C04B35/636 ,  C04B37/00

CPC分类号： C04B35/565 ,  B01D46/2425 ,  B01D2046/2433 ,  B01J35/04 ,  C04B35/63416 ,  C04B35/6365 ,  C04B37/005 ,  C04B38/0009 ,  C04B38/0019 ,  C04B38/0074 ,  C04B41/5071 ,  C04B41/5096 ,  C04B2235/3873 ,  C04B2235/3891 ,  C04B2235/428 ,  C04B2235/483 ,  C04B2235/522 ,  C04B2235/5224 ,  C04B2235/5228 ,  C04B2235/5232 ,  C04B2235/5244 ,  C04B2235/616 ,  C04B2235/656 ,  C04B2235/66 ,  C04B2235/663 ,  C04B2237/083 ,  C04B2237/09 ,  C04B2237/54 ,  C04B2237/68 ,  C04B2237/708 ,  F01N3/2026 ,  F01N3/2828 ,  F01N2330/60 ,  F01N2370/04 ,  F01N2450/28 ,  Y02T10/26 ,  Y10T428/131 ,  Y10T428/24149 ,  C04B26/285 ,  C04B28/001 ,  C04B28/005

摘要： A honeycomb structure includes at least one pillar-shaped honeycomb unit and a pair of electrodes. The pillar-shaped honeycomb unit includes an outer peripheral wall and cell walls. The cell walls extend along a longitudinal direction of the honeycomb unit to define cells. The cell walls are composed of a ceramic aggregate having pores. The cell walls contain a substance having an electrical resistivity lower than an electrical resistivity of ceramic forming the ceramic aggregate. The pair of electrodes is arranged at the cell walls and/or the outer peripheral wall.

摘要翻译： 蜂窝结构体包括至少一个柱状蜂窝单元和一对电极。 柱状蜂窝单元包括外周壁和单元壁。 细胞壁沿着蜂窝单元的纵向方向延伸以限定细胞。 细胞壁由具有孔的陶瓷骨料组成。 细胞壁含有电阻率低于形成陶瓷骨料的陶瓷的电阻率的物质。 一对电极布置在细胞壁和/或外周壁处。