公开(公告)号：US20140069989A1

公开(公告)日：2014-03-13

申请号：US14024803

申请日：2013-09-12

申请人： Texas Instruments Incorporated

发明人： Mutsumi Masumoto

IPC分类号： H01L21/50

CPC分类号： H01L21/50 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/13144 ,  H01L2224/75303 ,  H01L2224/75317 ,  H01L2224/75745 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2924/10253 ,  Y10T156/1168 ,  H01L2924/00 ,  H01L2924/00014

摘要： The embodiments of the invention provide a semiconductor chip mounting methods to prevent the occurrence of particles created while mounting a thin semiconductor chip onto a substrate. A semiconductor chip having conductive bumps on its main surface is held by its back via an elastic film using a suction tool having a plurality of suction holes, the semiconductor chip is positioned against a substrate provided with connection wires corresponding to said conductive bumps, and the semiconductor chip is mounted onto the substrate in such a manner that the conductive bumps connect to said connection wires, and uniform pressure is applied from the oversized bonding tool suction to the semiconductor chip via said film while said semiconductor chip is being pressed against said substrate by oversized bonding tool to keep constant pressure in order to bond said conductive bumps with said connection wires. The film assisted bonding tool has a film cooling system to assist in making vacuum holes and a through-hole tool movable relative to the bonding head to create a plurality of holes in said assist film with a plurality of needles.

摘要翻译： 本发明的实施例提供一种半导体芯片安装方法，以防止在将薄半导体芯片安装到基板上时产生的颗粒的出现。 在其主表面上具有导电凸块的半导体芯片通过使用具有多个吸孔的抽吸工具通过弹性膜由其背面保持，半导体芯片位于与设置有与所述导电凸块相对应的连接线的基板上， 将半导体芯片以这样的方式安装到基板上，使得导电凸块连接到所述连接线，并且通过所述薄膜将超大的焊接工具抽吸均匀地施加到半导体芯片上，同时所述半导体芯片被所述衬底压靠在所述衬底上 超大的焊接工具以保持恒定的压力，以便将所述导电凸块与所述连接线接合。 薄膜辅助粘结工具具有薄膜冷却系统，以帮助制造真空孔，并且通孔工具相对于粘合头可移动，以在多个针中在所述辅助薄膜中产生多个孔。

公开(公告)号：US08601658B2

公开(公告)日：2013-12-10

申请号：US13248901

申请日：2011-09-29

申请人： Vladimir Bulovic ,  Corinne Evelyn Packard ,  Jennifer Jong-Hua Yu ,  Apoorva Murarka ,  LeeAnn Kim

发明人： Vladimir Bulovic ,  Corinne Evelyn Packard ,  Jennifer Jong-Hua Yu ,  Apoorva Murarka ,  LeeAnn Kim

IPC分类号： H01G7/00

CPC分类号： B81C1/0046 ,  B81B2201/042 ,  B81C2201/0185 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49105 ,  Y10T156/1168

摘要： The embodiments disclosed herein are directed to fabrication methods useful for creating MEMS via microcontact printing by using small organic molecule release layers. The disclose method enables transfer of a continuous metal film onto a discontinuous platform to form a variable capacitor array. The variable capacitor array can produce mechanical motion under the application of a voltage. The methods disclosed herein eliminate masking and other traditional MEMS fabrication methodology. The methods disclosed herein can be used to form a substantially transparent MEMS having a PDMS layer interposed between an electrode and a graphene diaphragm.

摘要翻译： 本文公开的实施例涉及通过使用小的有机分子释放层通过微接触印刷创建MEMS的制造方法。 公开的方法能够将连续金属膜转移到不连续平台上以形成可变电容器阵列。 可变电容器阵列可以在施加电压的情况下产生机械运动。 本文公开的方法消除掩蔽和其它传统的MEMS制造方法。 本文公开的方法可以用于形成基本上透明的MEMS，其具有介于电极和石墨烯隔膜之间的PDMS层。

公开(公告)号：US20130255889A1

公开(公告)日：2013-10-03

申请号：US13839586

申请日：2013-03-15

申请人： BESI SWITZERLAND AG

发明人： Ernst Barmettler ,  Fabian Hurschler ,  Brian Pulis

IPC分类号： H01L21/67

CPC分类号： H01L21/67005 ,  H01L21/00 ,  H01L21/02 ,  H01L21/67 ,  H01L21/67132 ,  H01L21/67739 ,  Y10S156/931 ,  Y10S156/932 ,  Y10S156/943 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/1983

摘要： A method for detaching a semiconductor chip from a foil uses a die ejector comprising plates having a straight supporting edge and an L-shaped supporting edge comprises: lifting of the plates to a height H1 above the surface of a cover plate; lowering of a first pair of plates with L-shaped supporting edge; optionally, lowering of a second pair of plates with L-shaped supporting edge; lifting of the plates that have not yet been lowered to a height H2>H1; staggered lowering of plates that have not yet been lowered, with at least one or several plates not being lowered; optionally, lowering of the plates that have not yet been lowered to a height H3

摘要翻译： 用于从箔片上分离半导体芯片的方法使用包括具有直的支撑边缘和L形支撑边缘的板的模具顶出器包括：将板件提升到盖板表面上方的高度H1; 降低具有L形支撑边缘的第一对板; 可选地，降低具有L形支撑边缘的第二对板; 提升尚未降低到H2> H1高度的板材; 至少有一个或几个板材不被降低，板材的交错降低尚未降低; 可选地，将尚未降低的板降低到高度H3

公开(公告)号：US20130248119A1

公开(公告)日：2013-09-26

申请号：US13427724

申请日：2012-03-22

申请人： Chien Ling HWANG ,  Lin-Wei WANG ,  Chung-Shi LIU

发明人： Chien Ling HWANG ,  Lin-Wei WANG ,  Chung-Shi LIU

IPC分类号： B29C71/02

CPC分类号： H01L21/6836 ,  B32B37/0046 ,  B32B37/06 ,  B32B37/16 ,  B32B38/10 ,  B32B38/18 ,  B32B38/1858 ,  B32B39/00 ,  B32B41/00 ,  B32B43/006 ,  B32B2038/1891 ,  B32B2041/04 ,  B32B2307/202 ,  B32B2309/02 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67109 ,  H01L21/67132 ,  H01L21/68 ,  H01L21/6831 ,  H01L21/6835 ,  H01L21/6838 ,  H01L21/68764 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2223/54493 ,  H01L2924/0002 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/12 ,  Y10T156/14 ,  Y10T156/15 ,  Y10T156/1911 ,  Y10T156/1944 ,  Y10T156/1978 ,  H01L2924/00

摘要： A method of separating a wafer from a carrier includes placing a wafer assembly on a platform. The wafer assembly includes the wafer, the carrier, and a layer of wax between the wafer and the carrier. A wafer frame is mounted on the wafer of the wafer assembly. The layer of wax is softened. The wafer and the wafer frame mounted thereon are separated, by a first robot arm, from the carrier.

摘要翻译： 从载体分离晶片的方法包括将晶片组件放置在平台上。 晶片组件包括晶片，载体和在晶片和载体之间的一层蜡。 晶片框架安装在晶片组件的晶片上。 蜡层软化。 安装在其上的晶片和晶片框架由第一机器人臂从载体分离。

公开(公告)号：US08507066B2

公开(公告)日：2013-08-13

申请号：US12362521

申请日：2009-01-30

申请人： John E. Schnoebelen, Jr.

发明人： John E. Schnoebelen, Jr.

IPC分类号： B32B3/06

CPC分类号： B32B29/005 ,  B05B12/24 ,  B32B1/04 ,  B32B7/12 ,  B32B7/14 ,  B32B33/00 ,  C09J7/20 ,  C09J2203/31 ,  Y10S156/929 ,  Y10T156/10 ,  Y10T156/1168 ,  Y10T428/14 ,  Y10T428/1495 ,  Y10T428/24793 ,  Y10T428/28

摘要： A paint mask particularly adapted for masking corner areas of a demarcation zone to facilitate painting of an area of a workpiece disposed on the other side of the demarcation zone is formed of a thin, flexible sheet having opposite faces. The paint mask includes a first leg and a second leg that are generally rectangular in shape, and the legs intersect to form a right angle adapted for masking a corner and adjacent area. The bottom side of the paint mask which contacts the surface to be masked includes an adhesive for adhering the mask to the workpiece. The top side has release means for releasing stacked paint masks from each other.

公开(公告)号：US20130095613A1

公开(公告)日：2013-04-18

申请号：US13650267

申请日：2012-10-12

申请人： Yoko TANAKA

发明人： Yoko TANAKA

IPC分类号： H01L21/78

CPC分类号： H01L21/67132 ,  B25B11/005 ,  H01L21/67144 ,  H01L21/6838 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/12 ,  Y10T156/1944

摘要： In aspects of the invention, a holding stage of a pick up system can include a first stage on which a semiconductor chip is mounted with an adhesive sheet put in between, a second stage supporting the first stage, and an evacuation pipe. The first stage can be provided with a plurality of grooves, projections each being formed with side walls of adjacent grooves, and air holes connected to the grooves. The semiconductor chip can be mounted on the first stage so that the whole end portion of the semiconductor chip does not position on one groove. Then, a closed space surrounded by the adhesive sheet and the first and second stages and can be evacuated to make the semiconductor chip held on the projections. Thereafter, the semiconductor chip can be picked up by a collet.

摘要翻译： 在本发明的方面中，拾取系统的保持阶段可以包括第一阶段，半导体芯片上安装有粘合片，第二阶段和第一阶段之间的排气管。 第一阶段可以设置有多个凹槽，每个凹槽都形成有相邻凹槽的侧壁，以及连接到凹槽的气孔。 半导体芯片可以安装在第一平台上，使得半导体芯片的整个端部不位于一个凹槽上。 然后，由粘合片和第一和第二级围绕的封闭空间，并且可以被抽真空以使半导体芯片保持在突起上。 此后，半导体芯片可以被夹头拾起。

公开(公告)号：US08407871B2

公开(公告)日：2013-04-02

申请号：US12498025

申请日：2009-07-06

申请人： Ralph S. Taylor ,  John D. Myers ,  William J. Baney

发明人： Ralph S. Taylor ,  John D. Myers ,  William J. Baney

IPC分类号： H01G4/018 ,  H05K3/10

CPC分类号： H01G2/18 ,  H01G4/015 ,  H01G4/1218 ,  H01G4/308 ,  H01G13/00 ,  Y02T10/7022 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T156/1168

摘要： A method that employs a novel combination of conventional fabrication techniques provides a ceramic short-resistant capacitor that is bendable and/or shapeable to provide a multiple layer capacitor that is extremely compact and amenable to desirable geometries. The method allows thinner and more flexible ceramic capacitors to be made. The method includes forming a first thin metal layer on a substrate; depositing a thin, ceramic dielectric layer over the metal layer; depositing a second thin metal layer over the dielectric layer to form a capacitor exhibiting a benign failure mode; and separating the capacitor from the substrate. The method may also include bending the resulting capacitor into a serpentine arrangement with gaps between the layers that allow venting of evaporated electrode material in the event of a benign failure.

摘要翻译： 使用常规制造技术的新颖组合的方法提供了可弯曲和/或可成形的陶瓷短路电容器，以提供非常紧凑和适合所需几何形状的多层电容器。 该方法允许制造更薄和更柔性的陶瓷电容器。 该方法包括在衬底上形成第一薄金属层; 在所述金属层上沉积薄的陶瓷介电层; 在所述介​​电层上沉积第二薄金属层以形成呈现良性故障模式的电容器; 并将电容器与衬底分离。 该方法还可以包括将所得到的电容器弯曲成蛇形布置，其中层之间的间隙允许在良性故障的情况下排出蒸发的电极材料。

公开(公告)号：US20130048224A1

公开(公告)日：2013-02-28

申请号：US13662307

申请日：2012-10-26

申请人： Gregory George ,  Christopher Rosenthal

发明人： Gregory George ,  Christopher Rosenthal

IPC分类号： B32B38/10

CPC分类号： H01L21/6835 ,  B32B38/10 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/00 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/67282 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68728 ,  H01L2221/683 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2221/6839 ,  Y10T156/11 ,  Y10T156/1142 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/1184 ,  Y10T156/19 ,  Y10T156/1911 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1978

摘要： Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

公开(公告)号：US08317972B2

公开(公告)日：2012-11-27

申请号：US11983023

申请日：2007-11-06

申请人： Steven Akin Dunwoody ,  Oscar Palmer

发明人： Steven Akin Dunwoody ,  Oscar Palmer

IPC分类号： B32B38/10

CPC分类号： G02B6/245 ,  Y10T156/1137 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/1911 ,  Y10T156/1939 ,  Y10T156/1972

摘要： A method for removing a protective coating material from a portion of an optical fiber including a glass optical fiber having an outer surface surrounded by said protective coating material, said method comprising the steps of: (i) providing a fiber collection and support device having: (a) a coarse conical fiber collector having an input port and (b) a fine fiber centering collector including a fiber tube having an output port, said input port is larger then said output port; (ii) providing the fiber threaded through the course conical collector into the fiber collection tube of the fine fiber centering collector; (iii) contacting the fiber, as it exits from the output port of the fiber collection tube of the fiber collection and support device, with a stream of hot gas; and (iv) directing a stream of a hot gas onto the protective coating material that is to be removed.

摘要翻译： 一种用于从包括由所述保护涂层材料包围的外表面的玻璃光纤的光纤的一部分去除保护涂层材料的方法，所述方法包括以下步骤：（i）提供纤维收集和支撑装置，其具有： （a）具有输入端口的粗锥形光纤收集器和（b）包括具有输出端口的光纤管的细纤维定心收集器，所述输入端口大于所述输出端口; （ii）将经过锥形收集器螺纹的纤维提供到细纤维定心收集器的纤维收集管中; （iii）当纤维从纤维收集和支持装置的纤维收集管的输出端口离开时，与热气流接触; 和（iv）将热气流引导到待除去的保护涂层材料上。

公开(公告)号：US08267143B2

公开(公告)日：2012-09-18

申请号：US12761014

申请日：2010-04-15

申请人： Gregory George ,  Hale Johnson ,  Patrick Gorun ,  James Hermanowski ,  Matthew Stiles

发明人： Gregory George ,  Hale Johnson ,  Patrick Gorun ,  James Hermanowski ,  Matthew Stiles

IPC分类号： B32B38/10

CPC分类号： H01L21/6835 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/673 ,  H01L2221/68318 ,  H01L2221/68327 ,  Y10S156/93 ,  Y10S156/932 ,  Y10S156/941 ,  Y10S156/942 ,  Y10S156/943 ,  Y10T29/49817 ,  Y10T29/53274 ,  Y10T156/1132 ,  Y10T156/1153 ,  Y10T156/1158 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/1911 ,  Y10T156/1917 ,  Y10T156/1944 ,  Y10T156/1972 ,  Y10T156/1978 ,  Y10T279/18 ,  Y10T279/21 ,  Y10T279/26 ,  Y10T279/29

摘要： An apparatus for debonding two temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge arranged adjacent to a first edge of the chuck and connected to a hinge. The flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor moves the contact roller vertical to the plane of the chuck top surface.

摘要翻译： 用于剥离两个临时粘合晶片的装置包括卡盘组件，柔性板组件和接触辊。 卡盘组件包括卡盘和第一晶片保持器，以保持晶片与卡盘的顶表面接触。 柔性板组件包括柔性板和第二晶片保持器，第二晶片保持器被构造成保持与柔性板的第一表面接触的晶片。 柔性板包括与卡盘的第一边缘相邻并且连接到铰链的第一边缘。 柔性板被构造成围绕铰链摆动并且被放置在卡盘的顶表面之上。 接触辊被布置成与卡盘的与其第一边缘径向相对的第二边缘相邻。 脱粘驱动电机使接触辊垂直于卡盘顶面的平面移动。