公开(公告)号：US20020076522A1

公开(公告)日：2002-06-20

申请号：US09737213

申请日：2000-12-14

Applicant: Intel Corporation

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Scott Dixon

IPC: B32B005/12 ,  B29B007/00

CPC classification number: B29C70/083 ,  B32B5/12 ,  B32B27/04 ,  H05K1/0271 ,  H05K1/0366 ,  H05K2201/0287 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T428/24058 ,  Y10T428/24074 ,  Y10T428/24091 ,  Y10T428/24099 ,  Y10T428/24116 ,  Y10T428/24124

Abstract: Apparatus and methods are presented for reinforcing and stiffening a printed circuit board (PCB) in selected locations by utilizing preferentially oriented fibers. Selected fibers within the polymeric material matrix of the PCB fiber-matrix layer are removed and replaced with a similar quantity of fibers in a preferential orientation. Various combinations of layering of modified fiber-matrix layer material with conventional fiber-matrix layer material are presented to achieve the desired PCB stiffening. Printed circuit boards, under the weight of heavy attached electronic components, may deflect or flex along an axis, defined as the characteristic fold. This flexing is exasperated with manufacturing and handling loading, particularly when mounted in a chassis. Preferentially orientated fibers laid transverse to the characteristic fold reinforces the area to resist flexure within the area surrounding the characteristic fold. Reducing PCB flexure is particularly important in locations of the PCB containing surface mount technology (SMT) components, such as ball grid array electronic components. The lead attachment for BGA components is particularly susceptible to PCB flexure resulting in lead fatigue, fracture and failure. The presented methods and apparatus provide PCB stiffening without the addition of external PCB stiffeners and without effecting the PCB overall thickness, fiber to matrix ratio, uniform properties, or dielectric properties.

Abstract translation: 提出了通过利用优先取向的纤维来增强和加强选定位置的印刷电路板（PCB）的装置和方法。 在PCB纤维基质层的聚合材料基质中选择的纤维被去除，并以优先取向的相似量的纤维代替。 提出了改进的纤维基质层材料与常规纤维基质层材料的层叠的各种组合以实现期望的PCB加强。 印刷电路板在重型附着电子元件的重量下可能会沿着一个轴线偏转或弯曲，定义为特征折叠。 这种弯曲在制造和处理负载方面令人厌烦，特别是当安装在底盘中时。 横向于特征折叠铺设的优先定向纤维加强了区域以抵抗围绕特征折叠的区域内的挠曲。 减少PCB弯曲在含有PCB的表面贴装技术（SMT）部件（例如球栅阵列电子部件）的位置中是特别重要的。 BGA组件的导线附件特别易受PCB弯曲影响，导致铅疲劳，断裂和故障。 所提出的方法和装置提供PCB加强，而不需要增加外部PCB加强件，而不影响PCB的整体厚度，纤维与基体之比，均匀的性能或介电性能。

公开(公告)号：US5807793A

公开(公告)日：1998-09-15

申请号：US755630

申请日：1996-11-25

Applicant: Diego Armando Scari ,  Marco Scari

Inventor： Diego Armando Scari ,  Marco Scari

IPC: B29B11/16 ,  B29C70/10 ,  B29K105/06 ,  B32B5/12 ,  B32B5/28 ,  D03D15/00 ,  D03D15/12 ,  D03D19/00 ,  H05K1/03 ,  B29C67/14 ,  B29C53/80 ,  H05K1/00

CPC classification number: D03D13/006 ,  D03D15/0011 ,  D03D19/00 ,  H05K1/0366 ,  H05K2201/0287 ,  H05K2201/029 ,  Y10S428/901 ,  Y10S428/902 ,  Y10T442/2008 ,  Y10T442/3179 ,  Y10T442/322

Abstract: A description is provided of laminates for printed circuits using unidirectional glass fabric produced with continuous yarn which is twisted, has a low number of twists or zero twisting turns with different gramme weights, interlaced warpwise with a leno interwoven binding using glass yarns of 5.5 to 22 Tex at a spacing of up to 20 cm. The application of these laminates to the manufacture of printed circuits offers advantages in terms of surface roughness and waviness, dimensional stability, evenness and perforability.

Abstract translation: 提供了使用单向玻璃织物的印刷电路板的描述，所述单向玻璃织物是用连续的纱线制成的，连续纱线是扭曲的，具有不同的克重重量的低捻数或零扭转匝数，使用5.5至22的玻璃纱与纬纱交织结合 Tex的间距可达20厘米。 这些层压板在制造印刷电路中的应用在表面粗糙度和波纹度，尺寸稳定性，均匀性和穿孔性方面具有优势。

公开(公告)号：US5037691A

公开(公告)日：1991-08-06

申请号：US398128

申请日：1989-08-23

Applicant: Jonas Medney ,  Fred E. Klimpl

Inventor： Jonas Medney ,  Fred E. Klimpl

IPC: B29B15/10 ,  B29C53/56 ,  B29C53/76 ,  B29C53/80 ,  B29C70/20 ,  B29C70/34 ,  H05K1/03 ,  H05K3/00

CPC classification number: B29C53/564 ,  B29C53/76 ,  B29C53/8016 ,  B29C70/202 ,  B29C70/347 ,  H05K1/0366 ,  B29L2031/3425 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2203/085 ,  H05K2203/1327 ,  H05K3/0047 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/30 ,  Y10T428/31721

Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.

Abstract translation: 通过在第一组横向缠绕第二组股线的情况下围绕扁平心轴缠绕第一组股线或细丝来生产无翘曲层压体。 两组可以相互垂直。 将长丝保持在可控制的张力下，同时用树脂浸渍并在随后的树脂固化期间。 为了允许形成无翘曲的产品，卷绕图案使得其形成关于中性轴或对称平面的镜像。 卷绕图案可以被选择成以预定图案提供间隙，允许冲孔或高速钻孔用于随后的印刷电路应用。

公开(公告)号：US4980217A

公开(公告)日：1990-12-25

申请号：US226013

申请日：1988-07-29

Applicant: Michael A. Grundfest ,  Joseph A. Grundfest

Inventor： Michael A. Grundfest ,  Joseph A. Grundfest

IPC: B29C70/20 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00

CPC classification number: B29C70/202 ,  H05K1/0366 ,  H05K1/115 ,  B29C2793/0045 ,  B29L2031/3425 ,  H05K2201/0287 ,  H05K2201/0296 ,  H05K2201/09854 ,  H05K3/0047 ,  H05K3/005 ,  Y10S428/901 ,  Y10T428/24124 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/249924

Abstract: The reinforcing fibers in a printed circuit board laminate are arranged in an ordered manner to leave fiber-free zones for the formation of holes. The holes may be oblong to enhance the connection to electrical leads of components mounted on the printed circuit board. The holes may be oriented with their long dimensions transverse to the side of an electrical component, and the electrical component may have its leads correspondingly oriented, to improve wiring flexibility and allow more direct wiring paths.

Abstract translation: 印刷电路板层叠体中的增强纤维以有序的方式布置以留下用于形成孔的无纤维区域。 孔可以是长圆形的，以增强与安装在印刷电路板上的部件的电引线的连接。 孔可以以其横向于电气部件的侧面的长尺寸定向，并且电气部件可以使其引线相应地定向，以提高布线灵活性并允许更直接的布线路径。

公开(公告)号：US4012267A

公开(公告)日：1977-03-15

申请号：US594580

申请日：1975-07-10

Applicant: Theodore Harold Klein

Inventor： Theodore Harold Klein

IPC: B32B15/04 ,  B29C70/02 ,  B29C70/52 ,  B32B5/02 ,  B32B15/08 ,  H05K1/03 ,  H05K3/02 ,  B29G7/00 ,  B32B15/14

CPC classification number: B32B5/02 ,  B29C70/028 ,  B29C70/521 ,  H05K1/0366 ,  H05K3/022 ,  B29K2067/06 ,  B29K2705/10 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2203/068 ,  H05K2203/0783 ,  H05K2203/1545

Abstract: A method of continuously producing clad composites is disclosed. The cladding is combined with a resin-wet reinforcement and pultruded through a forming and curing die in a single processing step.

Abstract translation: 公开了一种连续生产复合材料的方法。 将包层与树脂湿润增强合并，并通过成形和固化模头在单一加工步骤中拉挤。

公开(公告)号：US10003087B1

公开(公告)日：2018-06-19

申请号：US14563885

申请日：2014-12-08

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Dick Tak Shing Pang ,  Anwar Mohammed ,  Murad Kurwa

IPC: H01M6/10 ,  H01M6/40 ,  H01M10/04 ,  H01M6/12 ,  H01M2/08

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: A stretchable battery and the method of manufacturing the same. The stretchable battery can be manufactured by using a printing process. The construction of the stretchable battery can comprise a first layer of an elastomer film, a first current collector layer, a layer of cathode, a separating layer, a layer of anode, and a second current collector layer. Metal traces can be used to couple with the first and/or the second current collector layers.

公开(公告)号：US09867283B2

公开(公告)日：2018-01-09

申请号：US15197736

申请日：2016-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-gyu Kim ,  Hyun Lee ,  Dong-han Kim

IPC: H05K1/03 ,  H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H05K3/00

CPC classification number: H05K1/0271 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/49838 ,  H05K1/03 ,  H05K1/0366 ,  H05K3/0011 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/2009

Abstract: A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.

公开(公告)号：US09839125B1

公开(公告)日：2017-12-05

申请号：US14266723

申请日：2014-04-30

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/02 ,  H01R43/02 ,  H01R43/00

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes multiple electronic components coupled to a fabric. Each of the multiple electronic components includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. One of the electrically conductive wire braids interconnects two electronic components, thereby providing an electrical connection between the two electronic components. The electrically conductive wire braid can be attached to the fabric by an adhesive, a stitched thread, which can be either electrically insulated or electrically conductive, or both adhesive and stitched thread. The fabric can be a wearable fabric, such as a shirt or pants, or other form to be worn by a user, such as an armband, waistband, hat or shoes.

公开(公告)号：US09398714B1

公开(公告)日：2016-07-19

申请号：US14229671

申请日：2014-03-28

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed

IPC: H05K1/11 ,  H05K1/18 ,  H05K7/02 ,  H05K13/04 ,  H05K3/40 ,  H05K3/42

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: A wearable electronics assembly includes one or more electronic modules coupled to a wearable electronics fabric. Each of the one or more electronic modules includes one or more metal foils, each metal foil electrically coupled at one end to an electrical connection point of the electrical module and at another end to an electrically conductive wire. The electrically conductive wire is stitched to the metal foil and to a fabric onto which the electronic module is attached. The electronic module can include one or more electronic components coupled to a printed circuit board. The metal foils can be formed from interconnects on the printed circuit board or the metal foils can be separate elements coupled to the printed circuit board.

Abstract translation: 可穿戴电子组件包括耦合到可穿戴电子织物的一个或多个电子模块。 所述一个或多个电子模块中的每一个包括一个或多个金属箔，每个金属箔在一端电连接到电气模块的电连接点，另一端电连接到导电线。 导电线被缝合到金属箔和连接到电子模块的织物上。 电子模块可以包括耦合到印刷电路板的一个或多个电子部件。 金属箔可以由印刷电路板上的互连形成，或者金属箔可以是与印刷电路板耦合的分离元件。

公开(公告)号：US20100319969A1

公开(公告)日：2010-12-23

申请号：US12708459

申请日：2010-02-18

Applicant: Kalu K. Vasoya ,  Bharat M. Mangrolia ,  William E. Davis ,  Richard A. Bohner

Inventor： Kalu K. Vasoya ,  Bharat M. Mangrolia ,  William E. Davis ,  Richard A. Bohner

IPC: H05K1/03 ,  H05K1/00 ,  H05K3/00

CPC classification number: B32B27/12 ,  B32B5/26 ,  B32B27/04 ,  B32B2260/021 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/00 ,  C08K3/38 ,  C08K9/08 ,  C08K2003/385 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/0323 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249942 ,  Y10T428/249945 ,  Y10T428/249946 ,  Y10T428/249947 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/292 ,  Y10T428/31504 ,  Y10T442/117 ,  Y10T442/2418

Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

Abstract translation: 预浸料，层压板，印刷线路板结构以及用于构造材料和印刷线路板的工艺，其能够构造具有改善的热性能的印刷线路板。 在一个实施例中，预浸料包括浸渍有导电和导热树脂的基材。 在其它实施例中，预浸料坯具有包括碳的基底材料。 在其它实施方案中，预浸料包括浸渍有导热树脂的基材。 在其他实施例中，印刷线路板结构包括可以用作接地和/或电源平面的导电和导热的层压板。