公开(公告)号：US10068878B2

公开(公告)日：2018-09-04

申请号：US15215583

申请日：2016-07-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-gyu Kim ,  Ji-sun Hong ,  Su-jung Hyung ,  Hyun-ki Kim ,  Hyun Lee

IPC: H01L29/40 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L21/56 ,  H01L25/10 ,  H01L23/31

Abstract: Provided are a printed circuit board (PCB) capable of blocking introduction of impurities during a molding process so as to reduce damage on a semiconductor package, a method of manufacturing the PCB, and a method of manufacturing a semiconductor package by using the PCB. An embodiment includes an apparatus comprising: a substrate body comprising an active area and a dummy area on an outer portion of the active area, the substrate body extending lengthwise in a first direction; a plurality of semiconductor units mounted on the active area; and a barrier formed on the dummy area, wherein the barrier extends in the first direction.

公开(公告)号：US09867283B2

公开(公告)日：2018-01-09

申请号：US15197736

申请日：2016-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-gyu Kim ,  Hyun Lee ,  Dong-han Kim

IPC: H05K1/03 ,  H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H05K3/00

CPC classification number: H05K1/0271 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/49838 ,  H05K1/03 ,  H05K1/0366 ,  H05K3/0011 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/2009

Abstract: A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.