公开(公告)号：US09867283B2

公开(公告)日：2018-01-09

申请号：US15197736

申请日：2016-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin-gyu Kim ,  Hyun Lee ,  Dong-han Kim

IPC: H05K1/03 ,  H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H05K3/00

CPC classification number: H05K1/0271 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/49838 ,  H05K1/03 ,  H05K1/0366 ,  H05K3/0011 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/2009

Abstract: A package board includes a stack structure that includes a circuit layer and a fiber layer. The fiber layer includes at least one first fiber that extends in a first direction and is a non-woven fiber. Also, a prepreg includes a first fiber that is a non-woven fiber; a plurality of second fibers that are spaced apart from the first fiber and are woven fibers; and an insulating layer that fills gaps between the first fiber and the plurality of second fibers.