公开(公告)号：US20030103337A1

公开(公告)日：2003-06-05

申请号：US10004693

申请日：2001-12-05

Applicant: Intel Corporation

Inventor： Scott Dixon ,  George Hsieh ,  Terrance J. Dishongh

IPC: H05K005/06 ,  H05K005/00 ,  H05K005/04

CPC classification number: H05K3/301 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An assembly includes a substrate with mounting apertures. A frame is disposed through the apertures, optionally in a non-core area of the substrate, where a chassis at least partially encompasses a portion of the substrate. A component is coupled with the frame, and the frame is coupled with the chassis.

Abstract translation: 组件包括具有安装孔的基板。 一个框架设置成穿过该孔，可选地位于基底的非芯区域中，其中底架至少部分地包围基底的一部分。 组件与框架相连，框架与底盘相连。

公开(公告)号：US20040131824A1

公开(公告)日：2004-07-08

申请号：US10742024

申请日：2003-12-17

Applicant: Intel Corporation

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Scott Dixon

IPC: B32B005/12

CPC classification number: B29C70/083 ,  B32B5/12 ,  B32B27/04 ,  H05K1/0271 ,  H05K1/0366 ,  H05K2201/0287 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T428/24058 ,  Y10T428/24074 ,  Y10T428/24091 ,  Y10T428/24099 ,  Y10T428/24116 ,  Y10T428/24124

Abstract: Apparatus and methods are presented for reinforcing and stiffening a printed circuit board (PCB) in selected locations by utilizing preferentially oriented fibers. Selected fibers within the polymeric material matrix of the PCB fiber-matrix layer are removed and replaced with a similar quantity of fibers in a preferential orientation. Various combinations of layering of modified fiber-matrix layer material with conventional fiber-matrix layer material are presented to achieve the desired PCB stiffening. Printed circuit boards, under the weight of heavy attached electronic components, may deflect or flex along an axis, defined as the characteristic fold. This flexing is exasperated with manufacturing and handling loading, particularly when mounted in a chassis. Preferentially orientated fibers laid transverse to the characteristic fold reinforces the area to resist flexure within the area surrounding the characteristic fold. Reducing PCB flexure is particularly important in locations of the PCB containing surface mount technology (SMT) components, such as ball grid array electronic components. The lead attachment for BGA components is particularly susceptible to PCB flexure resulting in lead fatigue, fracture and failure. The presented methods and apparatus provide PCB stiffening without the addition of external PCB stiffeners and without effecting the PCB overall thickness, fiber to matrix ratio, uniform properties, or dielectric properties.

Abstract translation: 提出了通过利用优先取向的纤维来增强和加强选定位置的印刷电路板（PCB）的装置和方法。 在PCB纤维基质层的聚合材料基质中选择的纤维被去除，并以优先取向的相似量的纤维代替。 提出了改进的纤维基质层材料与常规纤维基质层材料的层叠的各种组合以实现期望的PCB加强。 印刷电路板在重型附着电子元件的重量下可能会沿着一个轴线偏转或弯曲，定义为特征折叠。 这种弯曲在制造和处理负载方面令人厌烦，特别是当安装在底盘中时。 横向于特征折叠铺设的优先定向纤维加强了区域以抵抗围绕特征折叠的区域内的挠曲。 减少PCB弯曲在含有PCB的表面贴装技术（SMT）部件（例如球栅阵列电子部件）的位置中尤其重要。 BGA组件的导线附件特别易受PCB弯曲影响，导致铅疲劳，断裂和故障。 所提出的方法和装置提供PCB加强，而不需要增加外部PCB加强件，而不影响PCB的整体厚度，纤维与基体之比，均匀的性能或介电性能。

公开(公告)号：US20020076522A1

公开(公告)日：2002-06-20

申请号：US09737213

申请日：2000-12-14

Applicant: Intel Corporation

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Scott Dixon

IPC: B32B005/12 ,  B29B007/00

CPC classification number: B29C70/083 ,  B32B5/12 ,  B32B27/04 ,  H05K1/0271 ,  H05K1/0366 ,  H05K2201/0287 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T428/24058 ,  Y10T428/24074 ,  Y10T428/24091 ,  Y10T428/24099 ,  Y10T428/24116 ,  Y10T428/24124

Abstract: Apparatus and methods are presented for reinforcing and stiffening a printed circuit board (PCB) in selected locations by utilizing preferentially oriented fibers. Selected fibers within the polymeric material matrix of the PCB fiber-matrix layer are removed and replaced with a similar quantity of fibers in a preferential orientation. Various combinations of layering of modified fiber-matrix layer material with conventional fiber-matrix layer material are presented to achieve the desired PCB stiffening. Printed circuit boards, under the weight of heavy attached electronic components, may deflect or flex along an axis, defined as the characteristic fold. This flexing is exasperated with manufacturing and handling loading, particularly when mounted in a chassis. Preferentially orientated fibers laid transverse to the characteristic fold reinforces the area to resist flexure within the area surrounding the characteristic fold. Reducing PCB flexure is particularly important in locations of the PCB containing surface mount technology (SMT) components, such as ball grid array electronic components. The lead attachment for BGA components is particularly susceptible to PCB flexure resulting in lead fatigue, fracture and failure. The presented methods and apparatus provide PCB stiffening without the addition of external PCB stiffeners and without effecting the PCB overall thickness, fiber to matrix ratio, uniform properties, or dielectric properties.

Abstract translation: 提出了通过利用优先取向的纤维来增强和加强选定位置的印刷电路板（PCB）的装置和方法。 在PCB纤维基质层的聚合材料基质中选择的纤维被去除，并以优先取向的相似量的纤维代替。 提出了改进的纤维基质层材料与常规纤维基质层材料的层叠的各种组合以实现期望的PCB加强。 印刷电路板在重型附着电子元件的重量下可能会沿着一个轴线偏转或弯曲，定义为特征折叠。 这种弯曲在制造和处理负载方面令人厌烦，特别是当安装在底盘中时。 横向于特征折叠铺设的优先定向纤维加强了区域以抵抗围绕特征折叠的区域内的挠曲。 减少PCB弯曲在含有PCB的表面贴装技术（SMT）部件（例如球栅阵列电子部件）的位置中是特别重要的。 BGA组件的导线附件特别易受PCB弯曲影响，导致铅疲劳，断裂和故障。 所提出的方法和装置提供PCB加强，而不需要增加外部PCB加强件，而不影响PCB的整体厚度，纤维与基体之比，均匀的性能或介电性能。