公开(公告)号：US11778719B2

公开(公告)日：2023-10-03

申请号：US16927050

申请日：2020-07-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohyung Kim ,  Seongchul Hong ,  Kyungsik Kang ,  Insung Kim ,  Motoshi Sakai ,  Seulgi Lee ,  Jungchul Lee

IPC: H01S3/23 ,  H05G2/00 ,  G02B26/08 ,  H01S3/00 ,  G02B19/00

CPC classification number: H05G2/008 ,  G02B19/0047 ,  G02B26/0816 ,  G02B26/0875 ,  H01S3/0071 ,  H01S3/2316

Abstract: A laser beam delivery apparatus of an extreme ultra violet light source may include a high power seed module configured to generate a laser beam, a power amplifier configured to amplify the laser beam generated by the high power seed module, a beam transfer module configured to collect and move the laser beam amplified by the power amplifier, a final focusing assembly optical platform configured to adjust focus of the laser beam collected and moved by the beam transfer module, and a focusing unit configured to focus the laser beam with the focus adjusted by the final focusing assembly optical platform to a target droplet. The power amplifier may include a position adjuster configured to adjust a position of the laser beam. The position adjuster may include a refraction plate having a flat surface. The power amplifier may include a pointing adjuster, which may include a mirror.

公开(公告)号：US20220170792A1

公开(公告)日：2022-06-02

申请号：US17365592

申请日：2021-07-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungho Jang ,  Jungchul Lee ,  Jinseob Kim ,  Gwangsik Park ,  Minhwan Seo ,  Janghwi Lee ,  Wondon Joo ,  Jiyoung Chu ,  Daehoon Han

IPC: G01J3/28 ,  G01J3/02 ,  G01J3/04 ,  G01J3/24

Abstract: Provided is a hyperspectral imaging (HSI) apparatus. The HSI apparatus includes: a first slit plate configured to introduce an output beam; a first aspherical mirror configured to reflect the introduced output beam; a first grating having a planar reflective surface, the first grating configured to generate a plurality of first split beams by splitting the output beam after being reflected by the first aspherical mirror; and a first camera configured to detect the plurality of first split beams.

公开(公告)号：US20180358247A1

公开(公告)日：2018-12-13

申请号：US16103071

申请日：2018-08-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yisung Hwang ,  Jungchul Lee ,  Jaehong Kim ,  Taegyeong Chung

IPC: H01L21/67

CPC classification number: H01L21/67144 ,  H01L2924/0002 ,  Y10T156/1744 ,  Y10T156/1746 ,  Y10T156/1761 ,  Y10T156/1776 ,  H01L2924/00

Abstract: An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.

公开(公告)号：US20240251496A1

公开(公告)日：2024-07-25

申请号：US18628152

申请日：2024-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohyung Kim ,  Seongchul Hong ,  Insung Kim ,  Jinhong Park ,  Jungchul Lee

IPC: H05G2/00 ,  G03F7/00 ,  H01L21/268

CPC classification number: H05G2/008 ,  H01L21/268 ,  G03F7/70033

Abstract: Disclosed are semiconductor manufacturing apparatuses and operating methods thereof. The semiconductor manufacturing apparatus includes an oscillation unit that includes a first seed laser, a second seed laser, and a seed module, wherein the first seed laser oscillates a first pulse, and wherein the second seed laser oscillates a second pulse, and an extreme ultraviolet generation unit configured to use the first and second pulses to generate extreme ultraviolet light. The seed module includes a plurality of mirrors configured to allow the first and second pulses to travel along first and second paths, respectively, and a pulse control optical system including a first optical element, a second optical element, and a third optical element. The pulse control optical system is on the second path that does not overlap the first path. The third optical element includes a lens between the first optical element and the second optical element.

公开(公告)号：US20240118072A1

公开(公告)日：2024-04-11

申请号：US18215437

申请日：2023-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungho Jang ,  Sangwoo Bae ,  Minhwan Seo ,  Jangwoon Sung ,  Akinori Okubo ,  Seungwoo Lee ,  Jungchul Lee ,  Jaehwang Jung ,  Sangjoon Hong

IPC: G01B11/06 ,  G01B9/02

CPC classification number: G01B11/0608 ,  G01B9/02041 ,  G01B2290/70

Abstract: Provided are a level sensor configured to detect a height level of a substrate, and a substrate processing apparatus including the level sensor. The level sensor includes a measurement light source configured to radiate measurement light toward the substrate, a prism configured to split reflected light of the measurement light into first polarized light and second polarized light and generate a first optical path length difference between the first polarized light and the second polarized light, an optical path length modulator configured to keep constant an optical path length of the first polarized light and periodically change an optical path length of the second polarized light, and a detector configured to detect the first optical path length difference based on an interference signal between the first polarized light and the second polarized light.

公开(公告)号：US11946809B2

公开(公告)日：2024-04-02

申请号：US17740529

申请日：2022-05-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ingi Kim ,  Minhwan Seo ,  Sangwoo Bae ,  Akinori Okubo ,  Jungchul Lee ,  Eunhee Jeang

IPC: G01J4/02 ,  G01J4/04

CPC classification number: G01J4/02 ,  G01J4/04

Abstract: Provided is a polarization measuring device including a stage on which a measurement target is provided, a light source assembly configured to emit incident light, a first polarimeter configured to polarize the incident light, a second polarimeter configured to polarize reflected light reflected from the measurement target that is irradiated by the incident light, a filter assembly configured to remove noise from the reflected light, and a detector configured to receive the reflected light and measure an intensity of the reflected light and a phase of the reflected light.

公开(公告)号：US20240055243A1

公开(公告)日：2024-02-15

申请号：US18124954

申请日：2023-03-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taekjin Kim ,  Meehyun Lim ,  Sungyeol Kim ,  Junbum Park ,  Sungyoung Yoon ,  Jinyeong Yun ,  Jungchul Lee ,  Sungyong Lim ,  Sunghwi Cho

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01J37/32972 ,  H01L21/67253 ,  H01L21/67069 ,  H01L21/6833 ,  H01J2237/24495

Abstract: A semiconductor equipment monitoring apparatus including a wafer-type sensor inside a process chamber and configured to sense a plasma state inside the process chamber; a light detector and analyzer configured to detect and analyze light sensed by the wafer-type sensor; and a light coupler between the wafer-type sensor and the light detector and analyzer and configured to transmit the light sensed by the wafer-type sensor to the light detector and analyzer. The wafer-type sensor includes a plurality of sensors each comprising a passive element.

公开(公告)号：US20220068681A1

公开(公告)日：2022-03-03

申请号：US17229197

申请日：2021-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghun Han ,  Ingi Kim ,  Sangwoo Bae ,  Jungchul Lee ,  Minhwan Seo ,  Myeongock Ko ,  Youngjoo Lee ,  Taehyun Kim ,  Seulgi Lee

IPC: H01L21/67 ,  G02B7/02 ,  G06T5/20 ,  G06T7/00 ,  G01N21/65 ,  G01N21/41 ,  G01N21/95

Abstract: A wafer inspection apparatus includes: an objective lens on an optical path of first and second input beams; and an image sensor configured to generate an image of the wafer based on scattered light according to a nonlinear optical phenomenon based on the first and second input beams, wherein the first input beam passing through the objective lens is obliquely incident on the wafer at a first incident angle with respect to a vertical line that is normal to an upper surface of the wafer, the second input beam passing through the objective lens is incident on the wafer at a second incident angle oblique to the vertical line that is normal to the upper surface of the wafer, and the first and second incident angles are different from each other.

公开(公告)号：US10083846B2

公开(公告)日：2018-09-25

申请号：US15624066

申请日：2017-06-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yisung Hwang ,  Jungchul Lee ,  Jaehong Kim ,  Taegyeong Chung

IPC: H01L21/46 ,  H01L21/58 ,  H01L21/67

CPC classification number: H01L21/67144 ,  H01L2924/0002 ,  Y10T156/1744 ,  Y10T156/1746 ,  Y10T156/1761 ,  Y10T156/1776 ,  H01L2924/00

Abstract: An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.