公开(公告)号：US20240055243A1

公开(公告)日：2024-02-15

申请号：US18124954

申请日：2023-03-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taekjin Kim ,  Meehyun Lim ,  Sungyeol Kim ,  Junbum Park ,  Sungyoung Yoon ,  Jinyeong Yun ,  Jungchul Lee ,  Sungyong Lim ,  Sunghwi Cho

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01J37/32972 ,  H01L21/67253 ,  H01L21/67069 ,  H01L21/6833 ,  H01J2237/24495

Abstract: A semiconductor equipment monitoring apparatus including a wafer-type sensor inside a process chamber and configured to sense a plasma state inside the process chamber; a light detector and analyzer configured to detect and analyze light sensed by the wafer-type sensor; and a light coupler between the wafer-type sensor and the light detector and analyzer and configured to transmit the light sensed by the wafer-type sensor to the light detector and analyzer. The wafer-type sensor includes a plurality of sensors each comprising a passive element.

公开(公告)号：US20230417820A1

公开(公告)日：2023-12-28

申请号：US18134731

申请日：2023-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Martin Priwisch ,  Alexander Michalski ,  Michael Nagel ,  Namil Koo ,  Suhwan Park ,  Junbum Park ,  Inkeun Baek ,  Jongmin Yoon ,  Yoonkyung Jang ,  Ikseon Jeon

IPC: G01R31/265 ,  G01R1/07

CPC classification number: G01R31/2656 ,  G01R1/07

Abstract: According to embodiments, a cantilever is provided. The cantilever includes a first conductive line, a second conductive line, and a third conductive line extending on the substrate, a microtip arranged on the substrate, and an emitter antenna arranged on the microtip, connected to the first to third conductive lines, and configured to produce a scattering signal of a terahertz wave band, wherein the emitter antenna includes a first emitter electrode connected to the first conductive line, a second emitter electrode connected to the second conductive line and adjacent to the first emitter electrode, a third emitter electrode connected to the third conductive line and spaced apart from the first emitter electrode with the second emitter electrode in-between, and a scattering part connecting the first and second emitter electrodes with each other.

公开(公告)号：US20220412898A1

公开(公告)日：2022-12-29

申请号：US17719842

申请日：2022-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Martin Priwisch ,  Jongmin Yoon ,  Suhwan Park ,  Junbum Park ,  Inkeun Baek ,  Wonki Lee ,  Ikseon Jeon ,  Kwangrak Kim

IPC: G01N22/02

Abstract: An inspection apparatus includes an inspection signal source configured to irradiate a wafer with an inspection ray having a frequency in a range of 0.1 terahertz (THz) to 10 THz, a curved rail, a probe mount configured to move along the curved rail, and first and second probes coupled to the probe mount, wherein the first probe is configured to detect the inspection ray transmitted through the wafer, and the curved rail has a curved surface convex toward the first and second probes.

公开(公告)号：US20230409495A1

公开(公告)日：2023-12-21

申请号：US18199765

申请日：2023-05-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junbum Park

IPC: G06F13/16 ,  G06F13/18 ,  G06F13/24

CPC classification number: G06F13/1668 ,  G06F13/24 ,  G06F13/18

Abstract: Provided are a storage device, an operation method of the storage device, and an electronic system including the storage device. The storage device includes a non-volatile memory device, and a storage controller configured to control the non-volatile memory device, execute a command from a host, select a location to which a completion entry for the command is to be written from among a memory and at least one cache of the host, and transmit, to the host, an interrupt including an interrupt vector number indicating the location to which the completion entry is to be written.

公开(公告)号：US12165933B2

公开(公告)日：2024-12-10

申请号：US17180343

申请日：2021-02-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inkeun Baek ,  Namil Koo ,  Suhwan Park ,  Junbum Park

IPC: H01L21/66 ,  G01N21/95 ,  G01N21/956 ,  H01L21/683

Abstract: A semiconductor substrate processing apparatus includes: a metastructure layer divided into a plurality of microstructures by grooves, a light-transmitting dielectric substrate that supports the plurality of microstructures and is configured to allow an electromagnetic wave to be transmitted therethrough, and a frame including an exhaust hole configured to receive gas introduced from the grooves such as to provide suction force to the semiconductor substrate, wherein each of the plurality of microstructures has a smaller width than a wavelength of the electromagnetic wave, and each of the grooves has a smaller width than the wavelength of the electromagnetic wave.

公开(公告)号：US20240019362A1

公开(公告)日：2024-01-18

申请号：US18220672

申请日：2023-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junbum Park ,  Namil Koo ,  Jaeho Kim ,  Jongsu Kim ,  Suhwan Park ,  Sangwoo Bae ,  Inkeun Baek ,  Ikseon Jeon ,  Martin Priwisch

IPC: G01N21/3581 ,  G01N21/956

CPC classification number: G01N21/3581 ,  G01N21/956 ,  G01N2021/95676

Abstract: An inspection apparatus is provided. The inspection apparatus includes a substrate extending in a first direction and a second direction perpendicular to the first direction, a receiver antenna arranged on the substrate and including first and second antenna electrodes, a first waveguide on the substrate, and a second waveguide on the substrate, wherein the first antenna electrode overlaps the first waveguide in a third direction that is perpendicular to the first direction and the second direction, and the second antenna electrode overlaps the second waveguide in the third direction.

公开(公告)号：US11579167B2

公开(公告)日：2023-02-14

申请号：US17333924

申请日：2021-05-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongmin Yoon ,  Namil Koo ,  Nagel Michael ,  Suhwan Park ,  Junbum Park ,  Inkeun Baek ,  Sion Lee

IPC: G01Q60/22 ,  G01N21/68 ,  H05K9/00

Abstract: A near-field detection system includes include an electric field generator configured to apply an electric field to an analysis sample, a probe configured to detect a near field that has passed through the analysis sample, a current detector connected to the probe, and a laser system irradiating a laser to each of the electric field generator and the probe. The probe includes a cantilever substrate, an antenna electrode on the cantilever substrate, an electromagnetic wave blocking layer exposing a sensing region of the cantilever substrate, the electromagnetic wave blocking layer including a conductive material, and an insulating layer interposed between the cantilever substrate and the electromagnetic wave blocking layer such that the insulating layer is between the antenna electrode and the electromagnetic wave blocking layer.

公开(公告)号：US11946881B2

公开(公告)日：2024-04-02

申请号：US17719842

申请日：2022-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Martin Priwisch ,  Jongmin Yoon ,  Suhwan Park ,  Junbum Park ,  Inkeun Baek ,  Wonki Lee ,  Ikseon Jeon ,  Kwangrak Kim

IPC: G01N22/02 ,  G01R1/067 ,  H01L21/66

CPC classification number: G01N22/02 ,  H01L22/12

Abstract: An inspection apparatus includes an inspection signal source configured to irradiate a wafer with an inspection ray having a frequency in a range of 0.1 terahertz (THz) to 10 THz, a curved rail, a probe mount configured to move along the curved rail, and first and second probes coupled to the probe mount, wherein the first probe is configured to detect the inspection ray transmitted through the wafer, and the curved rail has a curved surface convex toward the first and second probes.

公开(公告)号：US11579168B2

公开(公告)日：2023-02-14

申请号：US17488657

申请日：2021-09-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ikseon Jeon ,  Namil Koo ,  Junbum Park ,  Inkeun Baek

IPC: G01Q60/22 ,  G01Q20/02

Abstract: Provided is a probe configured to detect a near field, the probe including a probe substrate having a tip region at an end portion of the probe substrate, a width of the tip region being less than a width of a remaining region of the probe substrate, a first electrode and a second electrode disposed on a surface of the probe substrate, the first electrode and the second electrode being spaced apart from each other and extending from the tip region along the probe substrate, an emitter and a detector disposed between the first electrode and the second electrode, the emitter and the detector being spaced apart from each other in a direction in which the probe substrate extends, and being configured to be photo switched, and a reflector disposed above the emitter and the detector in the direction in which the probe substrate extends opposite to the tip region, and configured to reflect an electromagnetic wave emitted from the emitter.

公开(公告)号：US20240218561A1

公开(公告)日：2024-07-04

申请号：US18515664

申请日：2023-11-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Janghwi Lee ,  Yeontae Kim ,  Junbum Park ,  Hunyong Park ,  Suhwan Park ,  Sangwoo Bae ,  Motoshi Sakai ,  Wondon Joo ,  Jaeho Jin

IPC: C30B25/16 ,  C30B25/12

CPC classification number: C30B25/16 ,  C30B25/12

Abstract: A thin-film deposition apparatus includes: a housing; a chamber located within the housing and providing an internal space; a platform disposed within the chamber and configured to support a substrate; a reflector disposed within the housing and disposed outside the chamber; a light source disposed between opposing walls of the reflector and configured to radiate light onto the substrate; a light receiver disposed within the housing, spaced apart from the light source with a portion of the reflector therebetween, and having a hole through which light emitted from the substrate is introduced; an optical cable connected to the light receiver and extending to the outside of the housing; and a sensor disposed outside the housing, connected to the optical cable, and configured to measure a temperature of the substrate by analyzing light transmitted from the optical cable.