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公开(公告)号：US20220365058A1
公开(公告)日：2022-11-17
申请号：US17659695
申请日：2022-04-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jiyun Lim , Eunju Park , Yeontae Kim , Jinho Kim
Abstract: A real-time wastewater treatment and water quality monitoring system includes a plurality of wastewater treatment facilities configured to purify wastewater generated from semiconductor manufacturing lines, a plurality of contaminant analysis apparatuses configured to obtain and analyze a sample from effluent water discharged through discharge pipes of the wastewater treatment facilities respectively, discharge rate sensors installed in the discharge pipes respectively, and an integrated monitoring apparatus configured to receive measurement result values from the contaminant analysis apparatuses and the discharge rate sensors and monitor in real time concentration of a contaminant in an entirety of the effluent water that is purified and discharged from the wastewater generated in the semiconductor manufacturing lines.
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Patent Agency Ranking
公开(公告)号：US20240264194A1
公开(公告)日：2024-08-08
申请号：US18432494
申请日：2024-02-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yeontae Kim , Jinhee Park , Joengseok Kim , Jinseop Lee , Bongkyun Jin , Eunju Park , Eungsun Lee , Hyekyoung Moon , Hyangbong Lee , Hyunyul Park , Seoungkyo Yoo
CPC classification number: G01N35/1095 , G01N33/1813 , G01N35/085 , G01N35/1016
Abstract: Provided is a contaminant analysis apparatus including a pretreatment sampler configured to collect and filter an effluent discharged through a discharge pipe to provide an analysis target sample, a sample introduction unit configured to receive the analysis target sample from the pretreatment sampler, a sample injection unit configured to selectively supply the analysis target sample supplied from the sample introduction unit, a sample analysis unit including an integrated analyzer configured to analyze ion components and heavy metal components of the analysis target sample which is supplied from the sample injection unit, and an analysis controller configured to control the sample introduction unit, the sample injection unit, and the sample analysis unit, wherein the sample introduction unit includes a first sample introduction unit including two or more first sample introduction unit syringe pumps and a second sample introduction unit including one or more second sample introduction unit syringe pumps.
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公开(公告)号：US20250011932A1
公开(公告)日：2025-01-09
申请号：US18535442
申请日：2023-12-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junho Lee , Yeontae Kim , Yihwan Kim , Youngbok Lee , Sangchul Han
IPC: C23C16/455
Abstract: A showerhead includes a showerhead body positioned at an upper surface of a reaction chamber and configured to inject a reaction gas toward a substrate in the reaction chamber and at least one groove in a lower surface of the showerhead body, where the showerhead body is oriented toward the substrate and the lower surface of the showerhead body includes a slanted structure.
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公开(公告)号：US20240218561A1
公开(公告)日：2024-07-04
申请号：US18515664
申请日：2023-11-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Janghwi Lee , Yeontae Kim , Junbum Park , Hunyong Park , Suhwan Park , Sangwoo Bae , Motoshi Sakai , Wondon Joo , Jaeho Jin
Abstract: A thin-film deposition apparatus includes: a housing; a chamber located within the housing and providing an internal space; a platform disposed within the chamber and configured to support a substrate; a reflector disposed within the housing and disposed outside the chamber; a light source disposed between opposing walls of the reflector and configured to radiate light onto the substrate; a light receiver disposed within the housing, spaced apart from the light source with a portion of the reflector therebetween, and having a hole through which light emitted from the substrate is introduced; an optical cable connected to the light receiver and extending to the outside of the housing; and a sensor disposed outside the housing, connected to the optical cable, and configured to measure a temperature of the substrate by analyzing light transmitted from the optical cable.
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5.发明授权公开(公告)号：US10381461B2
公开(公告)日：2019-08-13
申请号：US15649996
申请日：2017-07-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Namjin Cho , Yeontae Kim , Keesoo Park , Eunsok Choi , Kyuhee Han
IPC: C23C16/455 , H01L29/66
Abstract: A method of forming a semiconductor device includes: loading a wafer onto a susceptor, wherein the susceptor is disposed inside a chamber; heating the inside of the chamber; and rotating the susceptor, and first forming a film on the wafer by outputting a reactive gas and a carrier gas from an injector disposed at a sidewall of the chamber to form a semiconductor device having a first layer, wherein the first layer is manufactured under a first condition, wherein the injector includes a first outlet exposed within the chamber to discharge the carrier gas directly into the chamber and a second outlet exposed within the chamber to discharge the reactive gas directly into the chamber, wherein the first outlet is disposed below the second outlet.
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公开(公告)号：US20170317188A1
公开(公告)日：2017-11-02
申请号：US15649996
申请日：2017-07-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： NAMJIN CHO , Yeontae Kim , Keesoo Park , Eunsok Choi , Kyuhee Han
IPC: H01L29/66 , C23C16/455
CPC classification number: H01L29/66742 , C23C16/455 , C23C16/45519 , C23C16/45563 , C23C16/45574
Abstract: A thin film forming apparatus includes: an injector, the injector including: a distributor including a first distribution portion connected to a first gas inlet, and a second distribution portion connected to a second gas inlet; and a guide connected to the distributor, the guide including a first outlet connected to the first distribution portion, and a second outlet connected to the second distribution portion, wherein the second outlet is disposed above the first outlet.
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