公开(公告)号：US12149991B2

公开(公告)日：2024-11-19

申请号：US17452718

申请日：2021-10-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chihyun Cho ,  Heejung Kim ,  Dongyeob Lee ,  Junho Lee

IPC: H04W4/50 ,  H04W8/20 ,  H04W12/06 ,  H04W28/086 ,  H04W36/00 ,  H04W36/22 ,  H04W56/00 ,  H04W84/02 ,  H04W88/14 ,  H04W92/02 ,  H04W92/24

Abstract: Provided is a method, performed by a source edge data network, of providing a service in a wireless communication system includes identifying a target edge data network and a handover terminal handed over to the target edge data network among a plurality of terminals provided with the service from the source edge data network; transmitting information about the identified target edge data network to a server; synchronizing status information of an application for providing the service with the target edge data network; and synchronizing user information for each of the plurality of terminals with the target edge data network.

公开(公告)号：US20240243104A1

公开(公告)日：2024-07-18

申请号：US18513863

申请日：2023-11-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghoon Yeon ,  Seungryong Oh ,  Junho Lee

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/1357 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438

Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes a plurality of electrode bundles arranged in an array in a first substrate and each having a plurality of through electrodes penetrating the first substrate, a backside insulating layer on a backside surface of the first substrate through which end portions of the through electrodes are exposed, and a plurality of electrode pads respectively provided on the electrode bundles. The backside insulating layer has a first trench formed between the through electrodes of a first electrode bundle. A first electrode pad is disposed on the through electrodes of a first electrode bundle and includes a protruding portion that fills the first trench of the backside insulating layer.

公开(公告)号：US20240105657A1

公开(公告)日：2024-03-28

申请号：US18240273

申请日：2023-08-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hansung Ryu ,  Yongsung Park ,  Jongbeom Park ,  Junho Lee ,  Jihyun Lee

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/16 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13113 ,  H01L2224/13541 ,  H01L2224/13583 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2924/384

Abstract: A semiconductor package includes a first substrate, a first bonding pad on the first substrate, a solder ball on the first bonding pad, and a blocking layer on the solder ball, wherein a thickness of the blocking layer varies in a direction away from the first substrate.

公开(公告)号：US20230291457A1

公开(公告)日：2023-09-14

申请号：US18177372

申请日：2023-03-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hongsik Yoon ,  Jinwoo Oh ,  Junho Lee

IPC: H04B7/06 ,  H04L5/00 ,  H04W52/52

CPC classification number: H04B7/0632 ,  H04L5/0048 ,  H04W52/52 ,  H04B7/0639 ,  H04B7/0617

Abstract: A operating method of a wireless communication device includes transmitting a sounding reference signal (SRS) to a base station; receiving, from the base station, a first reference signal to which a second precoder is applied; generating feedback information including at least one of a rank indicator (RI) and a channel quality indicator (CQI), based on at least one of: (i) a relationship between the second precoder and a first precoder applied to a first physical downlink shared channel (PDSCH) by the base station based on the SRS; and (ii) a channel estimated by using the first reference signal; transmitting the generated feedback information to the base station; and receiving a second PDSCH to which at least one of the first precoder, the RI, and the CQI is applied.

公开(公告)号：USD974374S1

公开(公告)日：2023-01-03

申请号：US29766301

申请日：2021-01-14

Applicant: Samsung Electronics Co., Ltd.

Designer： Sojeong Cha ,  Kyungmin Kim ,  Heungkyo Seo ,  Junho Lee

公开(公告)号：US11528067B2

公开(公告)日：2022-12-13

申请号：US17215144

申请日：2021-03-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joontae Kim ,  Junho Lee ,  Sungyoon Cho

IPC: H04B7/06 ,  H04W16/28 ,  H04B7/0408 ,  H04B7/155

Abstract: Provided is a method of operating a wireless communication device including a phased array including a first antenna group and a second antenna group to form a beam for transmitting and receiving signals polarized in different directions, which includes receiving first signals polarized in a first direction; receiving second signals polarized in a second direction; measuring power of the first signals and power of the second signals; analyzing a relationship between a channel corresponding to the first receiving beam and a channel corresponding to the second receiving beam; estimating power of third signals that are expected to be received through the first antenna group and power of fourth signals that are expected to be received through the second antenna group; and selecting a receiving beam pattern for wireless communication.

公开(公告)号：US11093069B2

公开(公告)日：2021-08-17

申请号：US16222167

申请日：2018-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyesoon Jeong ,  Kyuchul Kong ,  Daesik Hwang ,  Hoondo Heo ,  Cheonkum You ,  Junho Lee ,  Hyunsuk Choi

IPC: G06F3/041 ,  G06F3/0488 ,  G06F1/16 ,  G06F3/044

Abstract: Methods and apparatuses for touch event processing are provided. A touch input is received in a designated region of a touchscreen display of the electronic device. The touch input is stored in a memory of the electronic device without providing the touch input as input to an application of the electronic device, upon reception of the touch input in the designated region. A drag input is received on the touch screen display as a continuation of the touch input. A processor of the electronic device determines the touch input and the drag input as input for the application upon the drag input exceeding a threshold.

公开(公告)号：US10998375B2

公开(公告)日：2021-05-04

申请号：US16512850

申请日：2019-07-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junho Lee ,  Namhyeok Kwak ,  Gunduk Kim ,  Seungwoo Lee ,  Do-Hun Kim ,  Heedong Kim

IPC: H01L33/50 ,  H01L27/15 ,  F21S41/13 ,  F21S41/153 ,  H01L25/075 ,  H01L33/58 ,  H01L33/08

Abstract: Disclosed are light emitting modules and automobile illumination devices including the same. The light emitting module comprises a module substrate, a light emitting device on the module substrate, and a light guide structure apart from the module substrate and in plan view surrounding the light emitting device. The light emitting device comprises a first pixel and a second pixel each including a light emitting diode (LED) chip that emits light whose wavelength falls within a range of blue color or ultraviolet ray, and a wavelength conversion material on a top surface of at least one of the first and second pixels.

公开(公告)号：US09553069B2

公开(公告)日：2017-01-24

申请号：US14852825

申请日：2015-09-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung Han ,  Kyoungran Kim ,  Donggil Shim ,  Geunsik Oh ,  Youngjoo Lee ,  Junho Lee ,  Sukwon Lee

IPC: B23K37/04 ,  H01L23/00 ,  B23K3/08

CPC classification number: H01L24/75 ,  B23K3/087 ,  B23K37/04 ,  H01L2224/75252 ,  H01L2224/75704 ,  H01L2224/75705 ,  H01L2224/7598

Abstract: A bonding apparatus of substrate manufacturing equipment includes an upper stage, a lower stage facing the upper stage and which is configure and dedicated to support a processed substrate on which semiconductor chips are stacked (set), and an elevating mechanism for raising the lower stage relative to the upper stage to provide pressure for pressing the substrate and chips towards each other.

Abstract translation: 基板制造装置的接合装置包括上层，与上层相对的下层，其构造为专用于支撑半导体芯片堆叠的被处理基板（设置），以及用于升高下层相对的升降机构 以提供将基板和芯片彼此挤压的压力。

公开(公告)号：US09525941B2

公开(公告)日：2016-12-20

申请号：US14519875

申请日：2014-10-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeyoun Kwon ,  Myunggeun Koh ,  Junho Lee

IPC: H04R21/02 ,  H04R3/02 ,  H04R1/10

CPC classification number: H04R3/02 ,  H04R1/1091

Abstract: An ear jack for preventing the generation of popup noise, and an electronic device including the same are provided. The ear jack includes a body including a passage into which an earphone is inserted. On an inside of the passage is disposed a microphone terminal to which a capacitor is connected, the microphone terminal for receiving microphone bias power when the earphone is connected to the ear jack, a ground terminal, a right sound terminal for outputting right sounds, a left sound terminal for outputting left sounds, and a detection terminal for detecting insertion of the earphone. The ground terminal includes a first ground terminal, according to a standard of the ear jack; and a second ground terminal for discharging an electric power of the capacitor, which is charged by the microphone bias power when the earphone is removed.

Abstract translation: 提供一种用于防止产生弹出噪声的耳塞，以及包括该耳塞的电子装置。 耳塞包括具有插入耳机的通道的本体。 在通道的内侧设置有连接有电容器的麦克风端子，当耳机连接到耳塞时，用于接收麦克风偏置功率的麦克风端子，接地端子，用于输出正确声音的右声音端子， 用于输出左声音的左声音终端和用于检测耳机插入的检测端子。 接地端子包括根据耳塞的标准的第一接地端子; 以及用于放电电容器的电力的第二接地端子，其在去除耳机时由麦克风偏置功率充电。