公开(公告)号：US11823961B2

公开(公告)日：2023-11-21

申请号：US17021087

申请日：2020-09-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunhee Jeang ,  Boris Afinogenov ,  Sangwoo Bae ,  Wondon Joo ,  Maksim Riabko ,  Anton Medvedev ,  Aleksandr Shorokhov ,  Anton Sofronov ,  Ingi Kim ,  Taehyun Kim ,  Minhwan Seo ,  Sangmin Lee ,  Seulgi Lee

IPC: H01L21/66 ,  H01L21/67 ,  G01N21/95 ,  G01N21/64

CPC classification number: H01L22/12 ,  G01N21/648 ,  G01N21/9505 ,  H01L21/67288 ,  G01N2201/06113

Abstract: A substrate inspection apparatus includes a light source unit, a pulsed beam matching unit, a substrate support unit, an incidence angle adjusting unit, and a detecting unit. The light source unit emits a first laser beam having a first wavelength and a second laser beam having a second wavelength. The pulsed beam matching unit matches the first laser beam and the second laser beam to superimpose a pulse of the first laser beam on a pulse of the second laser beam in time and space. The substrate support unit supports a substrate to be inspected. The incidence angle adjusting unit adjusts angles of incidence of the matched first laser beam and second laser beams to irradiate the first laser beam and the second laser beam on the substrate, and mixes the first laser beam and the second laser beam to generate an evanescent wave on the substrate. The evanescent wave generates scattered light due to a defect of the substrate. The detecting unit detects the scattered light generated due to the defect of the substrate.

公开(公告)号：US20220170792A1

公开(公告)日：2022-06-02

申请号：US17365592

申请日：2021-07-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungho Jang ,  Jungchul Lee ,  Jinseob Kim ,  Gwangsik Park ,  Minhwan Seo ,  Janghwi Lee ,  Wondon Joo ,  Jiyoung Chu ,  Daehoon Han

IPC: G01J3/28 ,  G01J3/02 ,  G01J3/04 ,  G01J3/24

Abstract: Provided is a hyperspectral imaging (HSI) apparatus. The HSI apparatus includes: a first slit plate configured to introduce an output beam; a first aspherical mirror configured to reflect the introduced output beam; a first grating having a planar reflective surface, the first grating configured to generate a plurality of first split beams by splitting the output beam after being reflected by the first aspherical mirror; and a first camera configured to detect the plurality of first split beams.

公开(公告)号：US20230392925A1

公开(公告)日：2023-12-07

申请号：US18123788

申请日：2023-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jiyoung Chu ,  Hyungjin Kim ,  Minhwan Seo ,  Wondon Joo ,  Dongyoon Koo ,  Sangwoo Bae ,  Sungmin Ahn ,  Jungyu Lee ,  Yunpyo Hong

IPC: G01B11/27 ,  G02B27/28 ,  G02B5/08

CPC classification number: G01B11/272 ,  G02B27/283 ,  G02B27/286 ,  G02B5/0808

Abstract: A method of bonding a die to a wafer using a die bonding system measures, using an obtained image showing interference fringes, a parallelism between the die and the wafer. In some embodiments, parallelism and die deformation are detected using interference fringes produced by an optical apparatus of the die bonding system. A parallelism measurement optical apparatus includes a light source, an optical assembly configured to control polarization of a reference light and a measurement light. In some embodiments, the measurement light is sequentially incident on and reflected from a first measurement surface and a second measurement surface that are spaced apart along a vertical direction to face each other, and is emitted to have information on parallelism between the first and second measurement surfaces. In some embodiments, a first polarizer is configured to interfere the reference light and the measurement light emitted from the optical assembly with each other. A light detector is configured to detect an interference signal of lights including the interference fringes.

公开(公告)号：US20240218561A1

公开(公告)日：2024-07-04

申请号：US18515664

申请日：2023-11-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Janghwi Lee ,  Yeontae Kim ,  Junbum Park ,  Hunyong Park ,  Suhwan Park ,  Sangwoo Bae ,  Motoshi Sakai ,  Wondon Joo ,  Jaeho Jin

IPC: C30B25/16 ,  C30B25/12

CPC classification number: C30B25/16 ,  C30B25/12

Abstract: A thin-film deposition apparatus includes: a housing; a chamber located within the housing and providing an internal space; a platform disposed within the chamber and configured to support a substrate; a reflector disposed within the housing and disposed outside the chamber; a light source disposed between opposing walls of the reflector and configured to radiate light onto the substrate; a light receiver disposed within the housing, spaced apart from the light source with a portion of the reflector therebetween, and having a hole through which light emitted from the substrate is introduced; an optical cable connected to the light receiver and extending to the outside of the housing; and a sensor disposed outside the housing, connected to the optical cable, and configured to measure a temperature of the substrate by analyzing light transmitted from the optical cable.

公开(公告)号：US11898912B2

公开(公告)日：2024-02-13

申请号：US17365592

申请日：2021-07-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungho Jang ,  Jungchul Lee ,  Jinseob Kim ,  Gwangsik Park ,  Minhwan Seo ,  Janghwi Lee ,  Wondon Joo ,  Jiyoung Chu ,  Daehoon Han

IPC: G01J3/28 ,  G01J3/02 ,  G01J3/24 ,  G01J3/04

CPC classification number: G01J3/2823 ,  G01J3/021 ,  G01J3/04 ,  G01J3/24 ,  G01J2003/2826

Abstract: Provided is a hyperspectral imaging (HSI) apparatus. The HSI apparatus includes: a first slit plate configured to introduce an output beam; a first aspherical mirror configured to reflect the introduced output beam; a first grating having a planar reflective surface, the first grating configured to generate a plurality of first split beams by splitting the output beam after being reflected by the first aspherical mirror; and a first camera configured to detect the plurality of first split beams.