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公开(公告)号：US20250052559A1
公开(公告)日：2025-02-13
申请号：US18620802
申请日：2024-03-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Minhwan Seo , Jiyoung Chu , Hyungjin Kim , Sangwoo Bae , Seungyeol Oh
IPC: G01B9/02015 , G01B9/02001 , G01B11/27 , G02B27/28
Abstract: A parallelism measurement optical system module includes a polarization beam splitter, a mirror positioned on a first surface of the polarization beam splitter, a first quarter wave plate positioned on a second surface of the polarization beam splitter that is perpendicular to the first surface, and a second quarter wave plate positioned on a third surface of the polarization beam splitter that is perpendicular to the first surface and parallel to the second surface.
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公开(公告)号：US11898912B2
公开(公告)日：2024-02-13
申请号：US17365592
申请日：2021-07-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungho Jang , Jungchul Lee , Jinseob Kim , Gwangsik Park , Minhwan Seo , Janghwi Lee , Wondon Joo , Jiyoung Chu , Daehoon Han
CPC classification number: G01J3/2823 , G01J3/021 , G01J3/04 , G01J3/24 , G01J2003/2826
Abstract: Provided is a hyperspectral imaging (HSI) apparatus. The HSI apparatus includes: a first slit plate configured to introduce an output beam; a first aspherical mirror configured to reflect the introduced output beam; a first grating having a planar reflective surface, the first grating configured to generate a plurality of first split beams by splitting the output beam after being reflected by the first aspherical mirror; and a first camera configured to detect the plurality of first split beams.
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公开(公告)号：US20220170792A1
公开(公告)日：2022-06-02
申请号：US17365592
申请日：2021-07-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungho Jang , Jungchul Lee , Jinseob Kim , Gwangsik Park , Minhwan Seo , Janghwi Lee , Wondon Joo , Jiyoung Chu , Daehoon Han
Abstract: Provided is a hyperspectral imaging (HSI) apparatus. The HSI apparatus includes: a first slit plate configured to introduce an output beam; a first aspherical mirror configured to reflect the introduced output beam; a first grating having a planar reflective surface, the first grating configured to generate a plurality of first split beams by splitting the output beam after being reflected by the first aspherical mirror; and a first camera configured to detect the plurality of first split beams.
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公开(公告)号：US20230392925A1
公开(公告)日：2023-12-07
申请号：US18123788
申请日：2023-03-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jiyoung Chu , Hyungjin Kim , Minhwan Seo , Wondon Joo , Dongyoon Koo , Sangwoo Bae , Sungmin Ahn , Jungyu Lee , Yunpyo Hong
CPC classification number: G01B11/272 , G02B27/283 , G02B27/286 , G02B5/0808
Abstract: A method of bonding a die to a wafer using a die bonding system measures, using an obtained image showing interference fringes, a parallelism between the die and the wafer. In some embodiments, parallelism and die deformation are detected using interference fringes produced by an optical apparatus of the die bonding system. A parallelism measurement optical apparatus includes a light source, an optical assembly configured to control polarization of a reference light and a measurement light. In some embodiments, the measurement light is sequentially incident on and reflected from a first measurement surface and a second measurement surface that are spaced apart along a vertical direction to face each other, and is emitted to have information on parallelism between the first and second measurement surfaces. In some embodiments, a first polarizer is configured to interfere the reference light and the measurement light emitted from the optical assembly with each other. A light detector is configured to detect an interference signal of lights including the interference fringes.
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