公开(公告)号：US20240230528A1

公开(公告)日：2024-07-11

申请号：US18389028

申请日：2023-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunhong Jun ,  Inkeun Baek ,  Wontae Kim ,  Namil Koo ,  Ingi Kim ,  Sungyoon Ryu ,  Younghoon Sohn ,  Yusin Yang ,  Ikseon Jeon ,  Eunhyuk Choi

IPC: G01N21/3581 ,  G01N21/95 ,  H01L21/66

CPC classification number: G01N21/3581 ,  G01N21/9501 ,  H01L22/12

Abstract: A measuring apparatus includes a stage including a transmissive wafer chuck on which a sample wafer is provided, where the sample wafer includes a silicon substrate and at least one material layer on the silicon substrate, a light source unit including a light source configured to generate and output a femtosecond laser beam, and a confocal laser-induced terahertz (THz) emission microscopy (LTEM) unit configured to generate multi-photon excitation by splitting the femtosecond laser beam into four sub-laser beams and causing three sub-laser beams among the four sub-laser beams to be incident in an overlapping manner on a measurement position of the sample wafer, where the confocal LTEM unit is configured to generate the multi-photon excitation based on the three sub-laser beams being incident on a lower surface of the silicon substrate.

公开(公告)号：US11946881B2

公开(公告)日：2024-04-02

申请号：US17719842

申请日：2022-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Martin Priwisch ,  Jongmin Yoon ,  Suhwan Park ,  Junbum Park ,  Inkeun Baek ,  Wonki Lee ,  Ikseon Jeon ,  Kwangrak Kim

IPC: G01N22/02 ,  G01R1/067 ,  H01L21/66

CPC classification number: G01N22/02 ,  H01L22/12

Abstract: An inspection apparatus includes an inspection signal source configured to irradiate a wafer with an inspection ray having a frequency in a range of 0.1 terahertz (THz) to 10 THz, a curved rail, a probe mount configured to move along the curved rail, and first and second probes coupled to the probe mount, wherein the first probe is configured to detect the inspection ray transmitted through the wafer, and the curved rail has a curved surface convex toward the first and second probes.

公开(公告)号：US11579168B2

公开(公告)日：2023-02-14

申请号：US17488657

申请日：2021-09-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ikseon Jeon ,  Namil Koo ,  Junbum Park ,  Inkeun Baek

IPC: G01Q60/22 ,  G01Q20/02

Abstract: Provided is a probe configured to detect a near field, the probe including a probe substrate having a tip region at an end portion of the probe substrate, a width of the tip region being less than a width of a remaining region of the probe substrate, a first electrode and a second electrode disposed on a surface of the probe substrate, the first electrode and the second electrode being spaced apart from each other and extending from the tip region along the probe substrate, an emitter and a detector disposed between the first electrode and the second electrode, the emitter and the detector being spaced apart from each other in a direction in which the probe substrate extends, and being configured to be photo switched, and a reflector disposed above the emitter and the detector in the direction in which the probe substrate extends opposite to the tip region, and configured to reflect an electromagnetic wave emitted from the emitter.

公开(公告)号：US12196669B2

公开(公告)日：2025-01-14

申请号：US17882673

申请日：2022-08-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Martin Priwisch ,  Jongmin Yoon ,  Suhwan Park ,  Inkeun Baek

IPC: G01N21/3581 ,  G01N21/95 ,  G01Q60/22 ,  G01R31/311

Abstract: An inspection apparatus includes: a first probe including a receiver antenna configured to detect the terahertz wave emitted by an inspection signal source and that has passed through the wafer, wherein the first probe includes: a first probe tip in which the receiver antenna is embedded, the receiver antenna including a first photoconductive switch; a first printed circuit board on which the first probe tip is mounted; a first optical bracket coupled to the first printed circuit board; a first optical connector configured to transmit a first laser beam into the first probe, and coupled to the first optical bracket, wherein the first laser beam is configured to excite the first photoconductive switch.

公开(公告)号：US20230417820A1

公开(公告)日：2023-12-28

申请号：US18134731

申请日：2023-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Martin Priwisch ,  Alexander Michalski ,  Michael Nagel ,  Namil Koo ,  Suhwan Park ,  Junbum Park ,  Inkeun Baek ,  Jongmin Yoon ,  Yoonkyung Jang ,  Ikseon Jeon

IPC: G01R31/265 ,  G01R1/07

CPC classification number: G01R31/2656 ,  G01R1/07

Abstract: According to embodiments, a cantilever is provided. The cantilever includes a first conductive line, a second conductive line, and a third conductive line extending on the substrate, a microtip arranged on the substrate, and an emitter antenna arranged on the microtip, connected to the first to third conductive lines, and configured to produce a scattering signal of a terahertz wave band, wherein the emitter antenna includes a first emitter electrode connected to the first conductive line, a second emitter electrode connected to the second conductive line and adjacent to the first emitter electrode, a third emitter electrode connected to the third conductive line and spaced apart from the first emitter electrode with the second emitter electrode in-between, and a scattering part connecting the first and second emitter electrodes with each other.

公开(公告)号：US20220412898A1

公开(公告)日：2022-12-29

申请号：US17719842

申请日：2022-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Martin Priwisch ,  Jongmin Yoon ,  Suhwan Park ,  Junbum Park ,  Inkeun Baek ,  Wonki Lee ,  Ikseon Jeon ,  Kwangrak Kim

IPC: G01N22/02

Abstract: An inspection apparatus includes an inspection signal source configured to irradiate a wafer with an inspection ray having a frequency in a range of 0.1 terahertz (THz) to 10 THz, a curved rail, a probe mount configured to move along the curved rail, and first and second probes coupled to the probe mount, wherein the first probe is configured to detect the inspection ray transmitted through the wafer, and the curved rail has a curved surface convex toward the first and second probes.

公开(公告)号：US20250003734A1

公开(公告)日：2025-01-02

申请号：US18639332

申请日：2024-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyoon Ryu ,  Ingi Kim ,  Suhwan Park ,  Inkeun Baek ,  Younghoon Sohn ,  Soobin Sinn ,  Yusin Yang ,  Sunhong Jun ,  Ikseon Jeon

IPC: G01B11/06

Abstract: A measuring system measures an overall resistance of two or more films on a substrate/measurement object by a terahertz absorption measurement and an overall film thickness by a photoacoustic measurement. The system estimates a first film thickness based on the overall resistance, then subtracts this estimated thickness from the overall film thickness measured by the photoacoustic measurement. The system includes a source unit to output a laser beam. A first pump-probe unit receives the laser beam and performs a photoacoustic test on the measurement object. A second pump-probe unit receives the laser beam and performs a terahertz signal test on the measurement object. The system also includes a stage to support the measurement object and controls for controlling elements and calculating the film thicknesses

公开(公告)号：US11680898B2

公开(公告)日：2023-06-20

申请号：US17183577

申请日：2021-02-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junbum Park ,  Namil Koo ,  Inkeun Baek ,  Jongmin Yoon

IPC: G01N21/3581 ,  H01Q23/00 ,  H01Q19/10 ,  H01Q21/06 ,  H01Q1/52 ,  G01N21/3563

CPC classification number: G01N21/3581 ,  G01N21/3563 ,  H01Q1/525 ,  H01Q19/108 ,  H01Q21/062 ,  H01Q23/00 ,  G01N2021/3568 ,  G01N2201/061

Abstract: A hybrid probe includes a probe body including a wiring and extending in a first direction; and a probe tip coupled to the probe body and including a first antenna, a second antenna, and an isolation layer. The hybrid probe may operate in a reflection mode using the first antenna and the second antenna, and operate in a transmission mode using the second antenna.

公开(公告)号：US20220155340A1

公开(公告)日：2022-05-19

申请号：US17488657

申请日：2021-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ikseon Jeon ,  Namil Koo ,  Junbum Park ,  Inkeun Baek

IPC: G01Q60/22 ,  G01Q20/02

Abstract: Provided is a probe configured to detect a near field, the probe including a probe substrate having a tip region at an end portion of the probe substrate, a width of the tip region being less than a width of a remaining region of the probe substrate, a first electrode and a second electrode disposed on a surface of the probe substrate, the first electrode and the second electrode being spaced apart from each other and extending from the tip region along the probe substrate, an emitter and a detector disposed between the first electrode and the second electrode, the emitter and the detector being spaced apart from each other in a direction in which the probe substrate extends, and being configured to be photo switched, and a reflector disposed above the emitter and the detector in the direction in which the probe substrate extends opposite to the tip region, and configured to reflect an electromagnetic wave emitted from the emitter.

公开(公告)号：US12165933B2

公开(公告)日：2024-12-10

申请号：US17180343

申请日：2021-02-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inkeun Baek ,  Namil Koo ,  Suhwan Park ,  Junbum Park

IPC: H01L21/66 ,  G01N21/95 ,  G01N21/956 ,  H01L21/683

Abstract: A semiconductor substrate processing apparatus includes: a metastructure layer divided into a plurality of microstructures by grooves, a light-transmitting dielectric substrate that supports the plurality of microstructures and is configured to allow an electromagnetic wave to be transmitted therethrough, and a frame including an exhaust hole configured to receive gas introduced from the grooves such as to provide suction force to the semiconductor substrate, wherein each of the plurality of microstructures has a smaller width than a wavelength of the electromagnetic wave, and each of the grooves has a smaller width than the wavelength of the electromagnetic wave.