公开(公告)号：US11946881B2

公开(公告)日：2024-04-02

申请号：US17719842

申请日：2022-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Martin Priwisch ,  Jongmin Yoon ,  Suhwan Park ,  Junbum Park ,  Inkeun Baek ,  Wonki Lee ,  Ikseon Jeon ,  Kwangrak Kim

IPC: G01N22/02 ,  G01R1/067 ,  H01L21/66

CPC classification number: G01N22/02 ,  H01L22/12

Abstract: An inspection apparatus includes an inspection signal source configured to irradiate a wafer with an inspection ray having a frequency in a range of 0.1 terahertz (THz) to 10 THz, a curved rail, a probe mount configured to move along the curved rail, and first and second probes coupled to the probe mount, wherein the first probe is configured to detect the inspection ray transmitted through the wafer, and the curved rail has a curved surface convex toward the first and second probes.

公开(公告)号：US20240019362A1

公开(公告)日：2024-01-18

申请号：US18220672

申请日：2023-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junbum Park ,  Namil Koo ,  Jaeho Kim ,  Jongsu Kim ,  Suhwan Park ,  Sangwoo Bae ,  Inkeun Baek ,  Ikseon Jeon ,  Martin Priwisch

IPC: G01N21/3581 ,  G01N21/956

CPC classification number: G01N21/3581 ,  G01N21/956 ,  G01N2021/95676

Abstract: An inspection apparatus is provided. The inspection apparatus includes a substrate extending in a first direction and a second direction perpendicular to the first direction, a receiver antenna arranged on the substrate and including first and second antenna electrodes, a first waveguide on the substrate, and a second waveguide on the substrate, wherein the first antenna electrode overlaps the first waveguide in a third direction that is perpendicular to the first direction and the second direction, and the second antenna electrode overlaps the second waveguide in the third direction.

公开(公告)号：US20230204503A1

公开(公告)日：2023-06-29

申请号：US17882673

申请日：2022-08-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Martin Priwisch ,  Jongmin Yoon ,  Suhwan Park ,  Inkeun Baek

IPC: G01N21/3581 ,  G01N21/95 ,  G01Q60/22 ,  G01R31/311

CPC classification number: G01N21/3581 ,  G01N21/9501 ,  G01Q60/22 ,  G01R31/311

Abstract: An inspection apparatus includes: a first probe including a receiver antenna configured to detect the terahertz wave emitted by an inspection signal source and that has passed through the wafer, wherein the first probe includes: a first probe tip in which the receiver antenna is embedded, the receiver antenna including a first photoconductive switch; a first printed circuit board on which the first probe tip is mounted; a first optical bracket coupled to the first printed circuit board; a first optical connector configured to transmit a first laser beam into the first probe, and coupled to the first optical bracket, wherein the first laser beam is configured to excite the first photoconductive switch.

公开(公告)号：US12196669B2

公开(公告)日：2025-01-14

申请号：US17882673

申请日：2022-08-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Martin Priwisch ,  Jongmin Yoon ,  Suhwan Park ,  Inkeun Baek

IPC: G01N21/3581 ,  G01N21/95 ,  G01Q60/22 ,  G01R31/311

Abstract: An inspection apparatus includes: a first probe including a receiver antenna configured to detect the terahertz wave emitted by an inspection signal source and that has passed through the wafer, wherein the first probe includes: a first probe tip in which the receiver antenna is embedded, the receiver antenna including a first photoconductive switch; a first printed circuit board on which the first probe tip is mounted; a first optical bracket coupled to the first printed circuit board; a first optical connector configured to transmit a first laser beam into the first probe, and coupled to the first optical bracket, wherein the first laser beam is configured to excite the first photoconductive switch.

公开(公告)号：US20230417820A1

公开(公告)日：2023-12-28

申请号：US18134731

申请日：2023-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Martin Priwisch ,  Alexander Michalski ,  Michael Nagel ,  Namil Koo ,  Suhwan Park ,  Junbum Park ,  Inkeun Baek ,  Jongmin Yoon ,  Yoonkyung Jang ,  Ikseon Jeon

IPC: G01R31/265 ,  G01R1/07

CPC classification number: G01R31/2656 ,  G01R1/07

Abstract: According to embodiments, a cantilever is provided. The cantilever includes a first conductive line, a second conductive line, and a third conductive line extending on the substrate, a microtip arranged on the substrate, and an emitter antenna arranged on the microtip, connected to the first to third conductive lines, and configured to produce a scattering signal of a terahertz wave band, wherein the emitter antenna includes a first emitter electrode connected to the first conductive line, a second emitter electrode connected to the second conductive line and adjacent to the first emitter electrode, a third emitter electrode connected to the third conductive line and spaced apart from the first emitter electrode with the second emitter electrode in-between, and a scattering part connecting the first and second emitter electrodes with each other.

公开(公告)号：US20220412898A1

公开(公告)日：2022-12-29

申请号：US17719842

申请日：2022-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Martin Priwisch ,  Jongmin Yoon ,  Suhwan Park ,  Junbum Park ,  Inkeun Baek ,  Wonki Lee ,  Ikseon Jeon ,  Kwangrak Kim

IPC: G01N22/02

Abstract: An inspection apparatus includes an inspection signal source configured to irradiate a wafer with an inspection ray having a frequency in a range of 0.1 terahertz (THz) to 10 THz, a curved rail, a probe mount configured to move along the curved rail, and first and second probes coupled to the probe mount, wherein the first probe is configured to detect the inspection ray transmitted through the wafer, and the curved rail has a curved surface convex toward the first and second probes.