公开(公告)号：US20210384094A1

公开(公告)日：2021-12-09

申请号：US17406512

申请日：2021-08-19

Applicant: Intel Corporation

Inventor： Robert Starkston ,  Robert L. Sankman ,  Scott M. Mokler ,  Richard Christopher Stamey ,  Amruthavalli Pallavi Alur

IPC: H01L23/13 ,  H01L23/498 ,  H01L23/538 ,  H01L23/488 ,  H01L23/485

Abstract: Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.

公开(公告)号：US11022792B2

公开(公告)日：2021-06-01

申请号：US16464257

申请日：2016-12-27

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Anna M. Prakash ,  Suriyakala Ramalingam ,  Liwei Wang ,  Robert Starkston ,  Arnab Choudhury ,  Sandeep S. Iyer ,  Amanuel M. Abebaw ,  Nick Labanok

IPC: G02B26/08 ,  B81C3/00

Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

公开(公告)号：US10304769B2

公开(公告)日：2019-05-28

申请号：US15748106

申请日：2015-08-27

Applicant: INTEL CORPORATION

Inventor： Robert L. Sankman ,  Allan A. Ovrom, III ,  Robert Starkston ,  Oren Arad

IPC: H01L23/52 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00

Abstract: Embodiments herein may relate to a package that includes a package substrate with a first die on a first side of the package substrate and a second die on a second side of the package substrate. Solder balls may be coupled with the second side of the package substrate and the second die such that the solder balls are approximately coplanar. Other embodiments may be described and/or claimed.

公开(公告)号：US20170200677A1

公开(公告)日：2017-07-13

申请号：US15469964

申请日：2017-03-27

Applicant: INTEL CORPORATION

Inventor： Qing Ma ,  Johanna M. Swan ,  Robert Starkston ,  John S. Guzek ,  Robert L. Sankman ,  Aleksandar Aleksov

IPC: H01L23/538 ,  H01L25/065 ,  H01L21/683 ,  H01L21/48 ,  H01L23/498 ,  H01L23/15 ,  H01L23/00

CPC classification number: H01L23/5386 ,  B32B2457/08 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/13 ,  H01L24/17 ,  H01L24/19 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/08238 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/81192 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/18162 ,  H01L2924/2064 ,  H01L2924/20641 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4688 ,  H05K2201/017 ,  H05K2203/1469 ,  Y10T156/1057 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.

公开(公告)号：US09269701B2

公开(公告)日：2016-02-23

申请号：US14818902

申请日：2015-08-05

Applicant: Intel Corporation

Inventor： Robert Starkston ,  Debendra Mallik ,  John S. Guzek ,  Chia-Pin Chiu ,  Deepak Kulkarni ,  Ravi V. Mahajan

IPC: H01L21/44 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/5226 ,  H01L21/563 ,  H01L23/5385 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L25/0655 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/05568 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/83102 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/00014 ,  H01L2924/206 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments of a system and methods for localized high density substrate routing are generally described herein. In one or more embodiments an apparatus includes a medium, first and second circuitry elements, an interconnect element, and a dielectric layer. The medium can include low density routing therein. The interconnect element can be embedded in the medium, and can include a plurality of electrically conductive members therein, the electrically conductive member can be electrically coupled to the first circuitry element and the second circuitry element. The interconnect element can include high density routing therein. The dielectric layer can be over the interconnect die, the dielectric layer including the first and second circuitry elements passing therethrough.

公开(公告)号：US20150156869A1

公开(公告)日：2015-06-04

申请号：US14618235

申请日：2015-02-10

Applicant: Intel Corporation

Inventor： Qing Ma ,  Johanna M. Swan ,  Robert Starkston ,  John S. Guzek ,  Robert L. Sankman ,  Aleksandar Aleksov

IPC: H05K1/03 ,  H01L21/48 ,  H05K1/11 ,  H01L23/498 ,  H05K1/02 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/5386 ,  B32B2457/08 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/13 ,  H01L24/17 ,  H01L24/19 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/08238 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/81192 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/18162 ,  H01L2924/2064 ,  H01L2924/20641 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4688 ,  H05K2201/017 ,  H05K2203/1469 ,  Y10T156/1057 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.

Abstract translation: 本说明书的实施例涉及制造微电子结构的领域。 微电子结构可以包括与轨迹路由结构分开形成的玻璃布线结构，其中玻璃布线结构以层叠或嵌入的形式结合到迹线布线基板中。 还公开了微电子封装的实施例，其包括设置在微电子衬底的玻璃布线结构附近并通过多个互连与微电子衬底耦合的至少一个微电子器件。 此外，公开了微电子结构的实施例，其包括嵌入微电子密封剂内的至少一个微电子器件，该微电子器件具有连接到微电子密封剂的玻璃布线结构和形成在玻璃布线结构上的迹线布线结构。

公开(公告)号：US11984396B2

公开(公告)日：2024-05-14

申请号：US18089213

申请日：2022-12-27

Applicant: Intel Corporation

Inventor： Robert Starkston ,  Debendra Mallik ,  John S. Guzek ,  Chia-Pin Chiu ,  Deepak Kulkarni ,  Ravi V. Mahajan

IPC: H01L23/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/522 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L23/5226 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/14 ,  H01L25/0655 ,  H01L25/50 ,  H01L21/563 ,  H01L24/05 ,  H01L24/13 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/05568 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/83102 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2224/83102 ,  H01L2924/00014 ,  H01L2224/05541 ,  H01L2924/206 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

Abstract: Embodiments of a system and methods for localized high density substrate routing are generally described herein. In one or more embodiments an apparatus includes a medium, first and second circuitry elements, an interconnect element, and a dielectric layer. The medium can include low density routing therein. The interconnect element can be embedded in the medium, and can include a plurality of electrically conductive members therein, the electrically conductive member can be electrically coupled to the first circuitry element and the second circuitry element. The interconnect element can include high density routing therein. The dielectric layer can be over the interconnect die, the dielectric layer including the first and second circuitry elements passing therethrough.

公开(公告)号：US11114353B2

公开(公告)日：2021-09-07

申请号：US16080093

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Robert Starkston ,  Robert L. Sankman ,  Scott M. Mokler ,  Richard Christopher Stamey ,  Amruthavalli Pallavi Alur

IPC: H01L23/13 ,  H01L23/498 ,  H01L23/538 ,  H01L23/488 ,  H01L23/485

Abstract: Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.

公开(公告)号：US10716214B2

公开(公告)日：2020-07-14

申请号：US15771774

申请日：2015-12-03

Applicant: INTEL CORPORATION

Inventor： Robert Starkston ,  Richard C. Stamey ,  Robert L. Sankman ,  Scott M. Mokler

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/14 ,  H05K3/42 ,  H05K3/00

Abstract: A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.

公开(公告)号：US20190391386A1

公开(公告)日：2019-12-26

申请号：US16464257

申请日：2016-12-27

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Anna M. Prakash ,  Suriyakala Ramalingam ,  Liwei Wang ,  Robert Starkston ,  Arnab Choudhury ,  Sandeep S. Iyer ,  Amanuel M. Abebaw ,  Nick Labanok

IPC: G02B26/08 ,  B81C3/00

Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.