Profile adjustment in plasma ion implanter
    123.
    发明授权
    Profile adjustment in plasma ion implanter 有权
    等离子体离子注入机轮廓调整

    公开(公告)号:US07528389B2

    公开(公告)日:2009-05-05

    申请号:US11376522

    申请日:2006-03-15

    Abstract: A method and apparatus are directed to providing a dopant profile adjustment solution in plasma doping systems for meeting both concentration and junction depth requirements. Bias ramping and bias ramp rate adjusting may be performed to achieve a desired dopant profile so that shallow and abrupt junctions in vertical and lateral directions are realized that are critical to device scaling in plasma doping systems.

    Abstract translation: 一种方法和装置旨在在等离子体掺杂系统中提供掺杂剂分布调整解决方案,以满足浓度和结深度要求。 可以执行偏置斜坡调整和偏置斜率调整以实现期望的掺杂剂分布,使得在垂直和横向方向上的浅和突变结被实现,这对于等离子体掺杂系统中的器件缩放至关重要。

    Ion implanters
    125.
    发明申请
    Ion implanters 审中-公开
    离子注入机

    公开(公告)号:US20080164427A1

    公开(公告)日:2008-07-10

    申请号:US11651107

    申请日:2007-01-09

    Abstract: The present invention relates to components in ion implanters having surfaces adjacent to the path of the ion beam through the ion implanter. Such surfaces will be prone to deposition and the present invention addresses problems associated with delamination of deposited material. An ion implanter component is provided that has a surface defining at least in part an ion beam path through the ion implanter, wherein at least a portion of the surface has been roughened. The portion of the surface may be roughened to provide surface features defined at least in part by sharp changes in orientation of adjacent parts of the surface.

    Abstract translation: 本发明涉及具有与通过离子注入机的离子束的路径相邻的表面的离子注入机中的部件。 这种表面将易于沉积,并且本发明解决与沉积材料的分层相关的问题。 提供了离子注入机部件,其具有至少部分地限定通过离子注入机的离子束路径的表面,其中表面的至少一部分已被粗糙化。 表面的部分可以被粗糙化以提供至少部分地由表面的相邻部分的取向的急剧变化限定的表面特征。

    Irradiation system with ion beam
    126.
    发明授权
    Irradiation system with ion beam 有权
    离子束照射系统

    公开(公告)号:US07351987B2

    公开(公告)日:2008-04-01

    申请号:US11202100

    申请日:2005-08-12

    Abstract: An irradiation system comprises a beam generation source, a mass analysis device, a beam transformer, a deflector for scanning which swings the beam reciprocally, a beam parallelizing device, an acceleration/deceleration device, and an energy filtering device. According to this invention, a hybrid angular energy filter generating both electric and magnetic fields to bend trajectories is provided as the energy filtering device. A pair of multi-surface energy slit units each having a plurality of energy slits that are switchable therebetween depending on an ion species for irradiation are further provided on a downstream side of the hybrid angular energy filter. It is possible to selectively irradiate a target wafer with high-current beams from low energy to high energy in the conditions where contamination such as neutral particles, different kinds of dopants, ions with different energies, metal, and dust particles is extremely small in amount.

    Abstract translation: 照射系统包括光束产生源,质量分析装置,光束变换器,用于使光束往复摆动的扫描偏转器,光束并行化装置,加速/减速装置以及能量过滤装置。 根据本发明,提供了产生电场和磁场以弯曲轨迹的混合角能量滤波器作为能量过滤装置。 在混合角能量滤波器的下游侧还设置有一对多表面能量狭缝单元,其具有可根据用于照射的离子种类在其间切换的多个能量狭缝。 在诸如中性粒子,不同种类的掺杂剂,具有不同能量的离子,金属和灰尘颗粒的污染物的量非常小的条件下,可以从具有低能量到高能量的大电流束选择性地照射目标晶片 。

    Electrostatic chuck to limit particle deposits thereon
    127.
    发明申请
    Electrostatic chuck to limit particle deposits thereon 有权
    静电吸盘以限制其上的颗粒沉积

    公开(公告)号:US20070268650A1

    公开(公告)日:2007-11-22

    申请号:US11436471

    申请日:2006-05-18

    Applicant: Scott Pietzsch

    Inventor: Scott Pietzsch

    Abstract: An ion implanter includes an electrostatic chuck. The electrostatic chuck is configured to repel charged particles from a surface of the electrostatic chuck to limit deposits of the charged particles on the surface when the electrostatic chuck is not supporting any workpiece. An electrostatic chuck including a dielectric layer and at least one electrode is also provided. The at least one electrode is configured to accept a DC voltage signal to produce a first charge to repel charged particles from the dielectric layer when the dielectric layer is not supporting any workpiece to thereby limit deposits of the charged particles on the dielectric layer.

    Abstract translation: 离子注入机包括静电卡盘。 静电卡盘被配置为当静电卡盘不支撑任何工件时,从静电卡盘的表面排出带电粒子以限制带电粒子沉积在表面上。 还提供了包括电介质层和至少一个电极的静电卡盘。 所述至少一个电极被配置为当所述电介质层不支撑任何工件从而限制所述电介质层上带电粒子的沉积时,接受DC电压信号以产生第一电荷以从所述电介质层排斥带电粒子。

    Ion beam contamination determination
    128.
    发明申请
    Ion beam contamination determination 有权
    离子束污染测定

    公开(公告)号:US20070241276A1

    公开(公告)日:2007-10-18

    申请号:US11289885

    申请日:2005-11-30

    CPC classification number: H01J37/3171 H01J37/304 H01J2237/31705 H01L22/12

    Abstract: A system, method and program product for determining contamination of an ion beam are disclosed. In the event of an isobaric interference, or near isobaric interference between a contaminant ion and an expected ion of an ion beam, which is difficult to detect, it is possible to measure a third ion in the ion beam and estimate, based on the amount of the third ion measured, a relative amount of the contaminant ion compared to the expected ion. The estimated relative amount of the contaminant ion is used together with a measured mass resolution of the ion implantation system to determine whether an ion implantation process needs to be suspended.

    Abstract translation: 公开了一种用于确定离子束污染的系统,方法和程序产品。 在难以检测的等离子体干扰或离子束的预期离子之间的等压干扰或接近等压干扰的情况下,可以测量离子束中的第三离子并基于量 测量的第三离子,与预期离子相比的污染物离子的相对量。 污染物离子的估计相对量与离子注入系统的测量质量分辨率一起使用以确定离子注入过程是否需要暂停。

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