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公开(公告)号：US09907215B2
公开(公告)日：2018-02-27
申请号：US15243168
申请日：2016-08-22
发明人： Klaus Backhaus , Roland Bittner , Marco Lederer , Rainer Popp
IPC分类号： H05K7/20 , H01L23/473 , H01G4/38 , H01G4/40 , H01G2/08 , H05K7/14 , H01G2/02 , H01G2/10 , H01L23/02 , H01L23/367 , H01L23/467 , H02M7/00
CPC分类号： H05K7/2089 , H01G2/02 , H01G2/08 , H01G2/106 , H01G4/38 , H01G4/40 , H01L23/02 , H01L23/3675 , H01L23/467 , H01L23/473 , H02M7/003 , H05K7/1432 , H05K7/20 , H05K7/209
摘要： A power electronic subassembly having a housing and a capacitor arranged therein. The housing has an internally arranged cooling area, which is cooled by a cooling device integrated in the housing or an external cooling device. The capacitor has a contact device of a first polarity and a contact device of a second polarity and a capacitor busbar system. This capacitor busbar system comprises first and second sheet-like shaped metal bodies. The first metal body with the first contact device of the first polarity and the second metal body with the second contact device of the second polarity are electrically conductively connected. A first portion of the first metal body has a first subportion, which is arranged parallel to and at a distance from the cooling area, and a second subportion, which is in thermal contact with the cooling area, wherein the two subportions are connected by an intermediate portion.
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公开(公告)号：US20180050406A1
公开(公告)日：2018-02-22
申请号：US15556241
申请日：2016-03-15
发明人： JORG AMMON , HARALD KOBOLLA
CPC分类号： B23K3/085 , B23K1/0016 , B23K37/003 , C21D1/38 , C21D11/00 , C21D11/005 , C21D2221/00
摘要： The apparatus serves for inhomogeneous cooling of a flat object with a first main face and a second main face opposite the first main face. The flat object is cooled by a cooling device from the direction of the first main face. On the second main face, a heating device locally acts upon a first partial face in such a way that the flat object is subjected to heat at said first partial face relative to a second partial face adjoining said first partial face in such a way that said first partial face is cooled more slowly in comparison with the second partial face and, during the cooling process, the second main face of the flat object therefore has an inhomogeneous temperature distribution at least in a partial time period of the cooling.
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公开(公告)号：US20180019138A1
公开(公告)日：2018-01-18
申请号：US15649999
申请日：2017-07-14
发明人： NEDZAD BAKIJA , Christian GÕBL
CPC分类号： H01L21/52 , H01L23/051 , H01L23/3121 , H01L23/49838 , H01L25/18 , H02M3/1588 , H02M2001/0058
摘要： A switching device and a power semiconductor module are configured with a substrate, a power semiconductor component arranged thereupon and with a load connection device. The substrate incorporates mutually electrically-insulated printed conductors and wherein the load connection device, preferably for an AC potential, comprises at least two partial connection devices, having mutually corresponding contact surfaces and being interconnected in an force-fitted or materially-bonded manner and, on the contact surfaces, an electrically conductive manner, wherein a first partial connection device has a first contact device, which is force-fitted or materially-bonded to the printed conductor of the substrate, and wherein a second partial connection device has a second contact device for the further, preferably external, connection of a load connection device.
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公开(公告)号：US20170301600A1
公开(公告)日：2017-10-19
申请号：US15487519
申请日：2017-04-14
发明人： Thomas FRANK , Christian WALTER , Stefan WEISS , Thomas ZIEGLER
IPC分类号： H01L23/32 , B60K1/04 , H01R13/73 , H01R12/70 , B60K1/02 , B66F9/075 , B60K7/00 , H01L23/367 , H01R12/82
CPC分类号： H01L23/32 , B60K1/02 , B60K1/04 , B60K7/0007 , B60K2007/0061 , B66F9/07572 , H01L23/3672 , H01L2224/18 , H01L2224/24137 , H01L2224/4846 , H01L2224/48472 , H01L2224/73267 , H01R12/7047 , H01R12/82 , H01R13/73 , H01R2201/26 , H05K7/1432
摘要： A power electronics arrangement has a power semiconductor module, with a contact spring, with a load connecting element and with a mounting device which is embodied as part of an electrically operated vehicle. The power semiconductor module has a load connection element which preferably projects outwards from the interior of the power semiconductor module, and preferably has there a first external contact face for external connection, and the load-connecting element has a second contact face. An electrically conductive pressure contact connection is embodied between the first contact face and the second contact face by a contact spring, wherein the pressure on the contact spring which is necessary for this is implemented by connecting the power semiconductor module in a frictionally locking fashion to the mounting device.
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115.发明申请公开(公告)号：US20170263530A1
公开(公告)日：2017-09-14
申请号：US15452020
申请日：2017-03-07
发明人： MICHAEL SCHLEICHER
IPC分类号： H01L23/427 , H01L23/528 , H01L23/522 , H01L23/31 , H01L25/065
CPC分类号： H01L23/427 , H01L23/06 , H01L23/3121 , H01L23/5226 , H01L23/528 , H01L25/0652
摘要： A power semiconductor device has a metal moulded body forming a first connecting conductor, with a first main surface of the metal moulded body there is a first recess having a first base in which a first power semiconductor component is arranged which faces the first base and is connected in an electrically conductive manner. From a second main surface of the metal moulded body, a second recess has a second base and a second power semiconductor component is arranged with the first contact surface thereof associated with the second base connected in an electrically conductive manner to this base. An insulating material layer is on both main surfaces, filling and completely covering the recess, wherein the first insulating layer has an electrically conductive first via which connects a second contact surface of the first power semiconductor component in an electrically conductive manner to a first conducting surface arranged on the first insulating layer.
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公开(公告)号：US20170148710A1
公开(公告)日：2017-05-25
申请号：US15356598
申请日：2016-11-20
发明人： Frank STEIGLER , Stefan Schmitt , Harald Kobolla
IPC分类号： H01L23/495 , H02M7/00 , H01L23/538 , H01L23/00
CPC分类号： H01L23/49575 , H01L23/36 , H01L23/3735 , H01L23/50 , H01L23/5386 , H01L24/06 , H01L24/32 , H01L24/48 , H01L24/49 , H01L2224/05552 , H01L2224/0603 , H01L2224/48137 , H01L2224/48139 , H01L2224/4846 , H01L2224/4847 , H01L2224/4903 , H01L2224/49111 , H01L2224/49113 , H01L2924/00014 , H01L2924/1427 , H01L2924/19107 , H02M7/003 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
摘要： A power electronic switching device having plurality of potential surfaces. At least two different potentials are respectively assigned to at least one of the potential surfaces. A plurality of semiconductor components are arranged in an n×m matrix, oriented in the x-y-direction, on a first conductor track, formed by at least one potential surface of the first potential. The semiconductor components are connected in parallel with one another and form a current valve. In this case, the semiconductor components can be distributed among a plurality of potential surfaces of the first potential which form the first conductor track.
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公开(公告)号：US09653862B2
公开(公告)日：2017-05-16
申请号：US15096245
申请日：2016-04-11
发明人： Roland Bittner
IPC分类号： H01L23/473 , H01R25/16 , H02G5/02 , H01R4/36 , H01R13/621
CPC分类号： H01R25/162 , H01R4/36 , H01R13/621 , H01R2201/26 , H02G5/02
摘要： An arrangement having a DC-voltage busbar and a power component. The power component has two flat DC-voltage connection conductors, each with a contact section and arranged closely adjacent to one another. Each connection conductor has a clamping section beside the respective contact section in the direction of current flow. The busbar has two partial busbars, each with a contact section and arranged closely adjacent to one another. Each partial busbar has a clamping section beside the respective contact section in the direction of current flow. The contact section of at least one connection conductor is electrically connected to the contact section of the associated partial busbar by connecting the clamping sections of the connection conductor to the clamping section of the partial busbars in a flat and force-fitting manner above one another and the respective contact sections therefore lying directly flat on one another.
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公开(公告)号：US09627343B2
公开(公告)日：2017-04-18
申请号：US14708275
申请日：2015-05-10
IPC分类号： H05K7/20 , H01L23/00 , H01L23/367 , H01L23/043 , H01L23/29 , H01L23/492 , H01L23/40 , H01L23/498 , H01L25/07 , H01L23/13 , H01L23/373
CPC分类号： H01L24/34 , H01L23/043 , H01L23/13 , H01L23/296 , H01L23/3672 , H01L23/3675 , H01L23/3735 , H01L23/4006 , H01L23/492 , H01L23/4985 , H01L23/49861 , H01L24/90 , H01L25/072 , H01L2023/4031 , H01L2023/4056 , H01L2023/4087 , H01L2224/73263 , H01L2224/8384 , H01L2924/00014 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2224/37099 , H01L2224/84
摘要： A power semiconductor module and an arrangement including it. The module includes a housing, a switching device having a substrate connected to the housing, a connecting device, load connection devices and a pressure device movable relative to the housing. The substrate has a first central passage and conductor tracks which are electrically insulated from one another. A power semiconductor component sits on a conductor track. The connecting device has two main surfaces and an electrically conductive film. The pressure device has a pressure body with a second passage, in alignment with the first passage and a first recess. A pressure element projects out of the recess, and presses onto a section of the second main surface. This section is within the surface of the component projects normal to the substrate. The first and second passages receive a fastener which force-fittingly fastens the module to the cooling device.
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119.发明申请公开(公告)号：US20170092574A1
公开(公告)日：2017-03-30
申请号：US15276623
申请日：2016-09-26
发明人： Florian WAGNER , Hartmut Kulas
IPC分类号： H01L23/498 , H01L23/29 , H01L21/56 , H01L23/31 , H01L23/00
CPC分类号： H01L23/49838 , H01L21/50 , H01L21/56 , H01L23/293 , H01L23/3121 , H01L24/37 , H01L24/40 , H01L24/84 , H01L25/072 , H01L25/18 , H01L2224/32225 , H01L2224/37599 , H01L2224/40221 , H01L2224/84201 , H01L2224/8484 , H01L2924/00014 , H01L2924/0685 , H01L2924/07025 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2224/37099
摘要： A method for producing a power-electronics switching device and a power electronic switching device produced thereby. In the power-electronics switching device, a power semiconductor component is arranged on a first region of a conductor track of a substrate. An insulating film comprising a cutout is then provided, wherein an overlap region of the insulating film, which overlap region is adjacent to the cutout, is designed to cover an edge region of the power semiconductor component. This is followed by arranging the insulating film on the substrate, with the power semiconductor component arranged on it, in such a way that the power semiconductor component is covered on all sides of its edge region by the covering region of the insulating film, wherein a further section of the insulating film covers parts of one of the conductor tracks. Finally, the connecting device is arranged.
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公开(公告)号：US20170055366A1
公开(公告)日：2017-02-23
申请号：US15243168
申请日：2016-08-22
发明人： Klaus BACKHAUS , Roland BITTNER , Marco LEDERER , Rainer POPP
IPC分类号： H05K7/20 , H01G2/08 , H01L23/367 , H01L23/02 , H01L23/467 , H01L23/473 , H01G2/02 , H01G2/10
CPC分类号： H05K7/2089 , H01G2/02 , H01G2/08 , H01G2/106 , H01G4/38 , H01G4/40 , H01L23/02 , H01L23/3675 , H01L23/467 , H01L23/473 , H02M7/003 , H05K7/1432 , H05K7/20 , H05K7/209
摘要： A power electronic subassembly having a housing and a capacitor arranged therein. The housing has an internally arranged cooling area, which is cooled by a cooling device integrated in the housing or an external cooling device. The capacitor has a contact device of a first polarity and a contact device of a second polarity and a capacitor busbar system. This capacitor busbar system comprises first and second sheet-like shaped metal bodies. The first metal body with the first contact device of the first polarity and the second metal body with the second contact device of the second polarity are electrically conductively connected. A first portion of the first metal body has a first subportion, which is arranged parallel to and at a distance from the cooling area, and a second subportion, which is in thermal contact with the cooling area, wherein the two subportions are connected by an intermediate portion.
摘要翻译： 一种具有外壳和布置在其中的电容器的电力电子组件。 壳体具有内部布置的冷却区域，其由集成在壳体中的冷却装置或外部冷却装置冷却。 电容器具有第一极性的接触装置和第二极性的接触装置和电容器母线系统。 该电容器母线系统包括第一和第二片状金属体。 具有第一极性的第一接触装置的第一金属体和具有第二极性的第二接触装置的第二金属体导电连接。 第一金属体的第一部分具有与冷却区域平行并且与冷却区域一定距离的第一子部分，以及与冷却区域热接触的第二子部分，其中两个子部分通过 中间部分。
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