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公开(公告)号：US12069797B2
公开(公告)日：2024-08-20
申请号：US18275896
申请日：2022-01-17
发明人： Shota Suzuki
CPC分类号： H05K1/0215 , H01G2/08 , H01G2/106 , H05K7/2039 , H05K2201/10409
摘要： An electrical device according to the present invention has a case (1), a metallic heat sink plate (4) disposed an opening portion (OP) of the case and a circuit board (5) arranged on the heat sink plate. The heat sink plate (4) is interposed between a capacitor (2) and the circuit board (5) so that the circuit board (5) is separated from the capacitor (2) by not only the resinous case (1) but also the metallic heat sink plate (4). Thus, electromagnetic space noise generated from the capacitor (2) is shielded or reduced by the metallic heat sink plate (4) whereby a malfunction of the circuit board (5) is prevented from occurring due to electromagnetic space noise generated from the capacitor (2).
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公开(公告)号：US20240222984A1
公开(公告)日：2024-07-04
申请号：US18401122
申请日：2023-12-29
申请人： KEHUA DATA CO., LTD.
发明人： Zhao Liu , Qianqian Peng , Longglang Yi
CPC分类号： H02J7/0019 , H01G2/08 , H02J7/0025 , H02J7/007192 , H02J7/345 , H02M3/015
摘要： A power storage apparatus includes a first power storage unit, a second power storage unit, a resonant circuit, a first switch, a second switch, a third switch and a fourth switch. The first end of the first switch is coupled to a first end of the first power storage unit. The second end of the first switch is coupled to a first end of the second switch and is coupled to a first end of the resonant circuit. The second end of the second switch is coupled to a second end of the first power storage unit and is coupled to a first end of the second power storage unit. The first end of the third switch is coupled to the first end of the second power storage unit and is coupled to the second end of the second switch.
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公开(公告)号：US20240222008A1
公开(公告)日：2024-07-04
申请号：US18549932
申请日：2021-05-10
摘要： A capacitor unit includes a plurality of capacitor elements and one or more heat transfer members located adjacent to at least one capacitor element of the plurality of capacitor elements. The one or more heat transfer members internally dissipate heat received from at least one capacitor element of the plurality of capacitor elements.
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公开(公告)号：US12004332B2
公开(公告)日：2024-06-04
申请号：US17573445
申请日：2022-01-11
发明人： Gilberto Moreno , Sreekant Venkat Jagannath Narumanchi , Xuhui Feng , Ammar Osman , Steve Michael Myers , Brian James Kelly , Paul Philip Paret
IPC分类号： H05K7/20 , B60K11/02 , H01G2/08 , H01L23/473
CPC分类号： H05K7/20927 , H05K7/20272 , H05K7/209 , B60K11/02 , H01G2/08 , H01L23/473
摘要： The present disclosure relates generally to methods and devices for the cooling (or removal of heat from) power electronics modules in automotive vehicles, wherein the cooling is done by positioning the power electronics module in a housing, directing a fluid into the housing, and impinging the fluid onto the power electronics module and/or an electrical connection in contact with the power electronics module.
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公开(公告)号：US11798748B2
公开(公告)日：2023-10-24
申请号：US18184583
申请日：2023-03-15
发明人： Ryo Ono , Tetsuhiko Fukuoka , Shoji Kusumoto , Akihiko Kono
摘要： A multi-layer ceramic electronic component includes (I) a ceramic body including (i) a protective portion that includes an end surface facing in a first direction, circumferential surfaces, and a ridge including a recess extending along the first direction and connects the circumferential surfaces, and (ii) a functional portion including internal electrodes laminated in a second direction, and (II) an external electrode including (i) a base film covering the end surface and including a first, second, and third covering portions formed on the end surface, on the circumferential surfaces, and on the recess, respectively, (ii) an intermediate film formed on the base film and continuously covering the first, second, and third covering portions, and (iii) a surface film formed on the intermediate film, wherein the recess is disposed outside end portions of the internal electrodes in a third direction orthogonal to the first and second directions.
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公开(公告)号：US11776758B2
公开(公告)日：2023-10-03
申请号：US17485309
申请日：2021-09-24
发明人： Yuki Urano , Ayaka Nakada , Akihiro Ozaki
摘要： A capacitor includes a capacitor element, a bus bar connected to an electrode of the capacitor element, a case housing the capacitor element, and a filling resin filled in the case. The bus bar includes a first section and a second section. The first section is exposed from the filling resin and includes a connection terminal configured to be connected to an external terminal. The second section has a buried section buried in the filling resin and an exposed section exposed from the filling resin, and includes a connection part connected to the electrode. The exposed section is located away from the first section.
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公开(公告)号：US20230298815A1
公开(公告)日：2023-09-21
申请号：US18323442
申请日：2023-05-25
发明人： Ronald S. Demcko
摘要： A component array can include a first multilayer ceramic component having a first terminal at a first end and a second terminal at a second end opposite the first end in a first direction. A second component can have a first terminal at a first end and a second terminal at a second end opposite the first end in the first direction. A heat sink layer can be arranged between the first component and the second component in a second direction that is perpendicular to the first direction. The heat sink layer can include a first metallization layer electrically connecting the first terminal of the first multilayer ceramic component with the first terminal of the second multilayer ceramic component and a second metallization layer electrically connecting the second terminal of the first multilayer ceramic component with the second terminal of the second multilayer ceramic component.
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公开(公告)号：US20230207191A1
公开(公告)日：2023-06-29
申请号：US18081962
申请日：2022-12-15
发明人： Chan Ho Yang , Min Jun Kim , Jung Mi Baek , Da Eun Kim , Hye Min Park , Jong Min Kim , Seong Hyeon Cho , Min San Seo , Hong Seok Kim
摘要： A multilayer electronic component includes a body including dielectric layers and a plurality of internal electrodes stacked on each other in a first direction, and having a respective one of the dielectric layers interposed therebetween; a thermoelectric element disposed inside the body; and external electrodes disposed outside the body.
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公开(公告)号：US11664159B2
公开(公告)日：2023-05-30
申请号：US17228810
申请日：2021-04-13
申请人： AVX Corporation
发明人： Ronald S. Demcko
摘要： A component array can include a first multilayer ceramic component having a first terminal at a first end and a second terminal at a second end opposite the first end in a first direction. A second component can have a first terminal at a first end and a second terminal at a second end opposite the first end in the first direction. A heat sink layer can be arranged between the first component and the second component in a second direction that is perpendicular to the first direction. The heat sink layer can include a first metallization layer electrically connecting the first terminal of the first multilayer ceramic component with the first terminal of the second multilayer ceramic component and a second metallization layer electrically connecting the second terminal of the first multilayer ceramic component with the second terminal of the second multilayer ceramic component.
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公开(公告)号：US20230154687A1
公开(公告)日：2023-05-18
申请号：US17919851
申请日：2020-04-30
摘要： Embodiments of present disclosure relate to a capacitor assembly and a dry-type capacitor. The capacitor assembly includes: a first layer of capacitor elements; a second layer of capacitor elements, wherein the first layer of capacitor elements is stacked on the second layer of capacitor elements; a first busbar comprising a first conductive plate provided with a plurality of holes, wherein the first conductive plate is electrically coupled to the capacitor elements of the first layer via a plurality of connecting elements arranged at the respective holes of the first conductive plate; and a second busbar electrically coupled to the first busbar and including a second conductive plate provided with a plurality of holes, wherein the second conductive plate is electrically coupled to the capacitor elements of the second layer via a plurality of connecting elements arranged at the respective holes of the second conductive plate.
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