公开(公告)号：US12004332B2

公开(公告)日：2024-06-04

申请号：US17573445

申请日：2022-01-11

申请人： Alliance for Sustainable Energy, LLC ,  BorgWarner, Inc.

发明人： Gilberto Moreno ,  Sreekant Venkat Jagannath Narumanchi ,  Xuhui Feng ,  Ammar Osman ,  Steve Michael Myers ,  Brian James Kelly ,  Paul Philip Paret

IPC分类号： H05K7/20 ,  B60K11/02 ,  H01G2/08 ,  H01L23/473

CPC分类号： H05K7/20927 ,  H05K7/20272 ,  H05K7/209 ,  B60K11/02 ,  H01G2/08 ,  H01L23/473

摘要： The present disclosure relates generally to methods and devices for the cooling (or removal of heat from) power electronics modules in automotive vehicles, wherein the cooling is done by positioning the power electronics module in a housing, directing a fluid into the housing, and impinging the fluid onto the power electronics module and/or an electrical connection in contact with the power electronics module.

公开(公告)号：US11751365B2

公开(公告)日：2023-09-05

申请号：US17084236

申请日：2020-10-29

申请人： Alliance for Sustainable Energy, LLC

发明人： Gilberto Moreno ,  Sreekant Venkat Jagannath Narumanchi ,  Kevin Scott Bennion ,  Ramchandra Mahendrabhai Kotecha ,  Paul Philip Paret ,  Xuhui Feng

IPC分类号： H05K7/20 ,  F28F3/12

CPC分类号： H05K7/20927 ,  F28F3/12 ,  H05K7/20272

摘要： The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.