THERMOELECTRIC COOLING FOR PACKAGE LEVEL THERMAL MANAGEMENT

    公开(公告)号:US20240363484A1

    公开(公告)日:2024-10-31

    申请号:US18308411

    申请日:2023-04-27

    IPC分类号: H01L23/38 H10N10/01 H10N10/17

    CPC分类号: H01L23/38 H10N10/01 H10N10/17

    摘要: An electronic device includes a semiconductor die with first and second sides, a semiconductor layer extending to the first side, an array of unit cells arranged in rows columns, and a conductive reference terminal in the semiconductor layer that laterally surrounds the array, the first and second sides being spaced apart from one another by a thickness distance of 50 μm or less, and the respective unit cells including: a circuit component in the semiconductor layer; a holey semiconductor portion in the semiconductor layer that laterally surrounds the respective circuit component and includes holes that extend from the metallization structure toward the first side; and a conductive control terminal in the semiconductor layer that laterally surrounds the respective holey semiconductor portion, and an adhesive layer extends between the first side of the semiconductor die and a die attach pad.

    Seebeck effect renewable energy arrangement

    公开(公告)号:US12108675B1

    公开(公告)日:2024-10-01

    申请号:US18440596

    申请日:2024-02-13

    申请人: Bernard Pappert

    发明人: Bernard Pappert

    IPC分类号: H10N10/17 H10N19/00

    CPC分类号: H10N10/17 H10N19/00

    摘要: A Seebeck effect renewable energy arrangement can be used to generate electricity due to temperature differences. The Seebeck effect renewable energy arrangement includes an environmental arrangement, a ground arrangement, and a power output arrangement. The environmental arrangement is connected to the ground arrangement to create an electrical circuit such that the temperature difference between the environmental temperature and the ground temperature generates electricity due to the Seebeck effect. The power output arrangement is operatively connected to the circuit to conduct electricity generated thereby to storage or use to power electrical devices.

    Thermoelectric element
    6.
    发明授权

    公开(公告)号:US12102008B2

    公开(公告)日:2024-09-24

    申请号:US17916210

    申请日:2021-03-25

    IPC分类号: H10N10/17 H10N10/817

    CPC分类号: H10N10/817 H10N10/17

    摘要: Provided according to an embodiment is a thermoelectric element comprising: a first insulating part; multiple first electrodes disposed on the first insulating part; a second electrode disposed above the first electrodes; a first conductive semiconductor structure and a second conductive semiconductor structure disposed while being spaced each other between the first electrodes and the second electrode; and a second insulating part disposed on the second electrode, wherein the first insulating part comprises first protrusions protruding toward the first electrodes, and the second insulating part comprises a second protrusion protruding toward the second electrode.

    THERMAL SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20240298543A1

    公开(公告)日:2024-09-05

    申请号:US18587644

    申请日:2024-02-26

    IPC分类号: H10N10/17 H10N10/01 H10N10/13

    CPC分类号: H10N10/17 H10N10/01 H10N10/13

    摘要: A method of manufacturing a thermal sensor (106) comprises providing a first part (102) of a body of the sensor (106), the first part (102) of the body being configured to define a first part (114) of a chamber (310). A second part (104) of the body of the sensor (106) is also provided, the second part (104) of the body being configured to define a second part (118) of the chamber (310). A getter material (112) is disposed in the first part (114) of the body of the sensor (106), and the first part (102) and the second part (104) of the body of the sensor (106) are brought together so that the first and second parts (102, 104) of the chamber (310) define the chamber (310). The chamber (310) is backfilled with a gas to a pressure greater than 10 mbar, and the first part (102) of the body is bonded to the second part (104) of the body so as to seal hermetically the chamber (310).

    THERMOELECTRIC DEVICE
    8.
    发明公开

    公开(公告)号:US20240284800A1

    公开(公告)日:2024-08-22

    申请号:US18572365

    申请日:2022-06-22

    发明人: Un Hak LEE

    IPC分类号: H10N19/00 H10N10/13 H10N10/17

    摘要: A thermoelectric device according to an embodiment of the present invention comprises: a fluid flow part including one surface and the other surface spaced apart from the one surface in a first direction; a first thermoelectric element arranged on one surface of the fluid flow part; and a second thermoelectric element arranged on the other surface of the fluid flow part, wherein a first through-hole penetrating from the one surface to the other surface thereof is arranged in the fluid flow part, and a wire electrically connected to the first thermoelectric element is electrically connected to the second thermoelectric element through the first through-hole.

    Thermoelectric element
    9.
    发明授权

    公开(公告)号:US12063860B2

    公开(公告)日:2024-08-13

    申请号:US17041695

    申请日:2019-04-02

    CPC分类号: H10N10/17 H10N10/856

    摘要: A thermoelectric element according to an embodiment of the present invention comprises: a first metal substrate; a first resin layer disposed on the first metal substrate and in direct contact with the first metal substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metal substrate disposed on the second resin layer, wherein the first resin layer comprises a polymeric resin and an inorganic filler and at least a part of side surfaces of the plurality of first electrodes are embedded in the first resin layer.

    Thermoelectric device
    10.
    发明授权

    公开(公告)号:US12058935B2

    公开(公告)日:2024-08-06

    申请号:US17913982

    申请日:2021-03-02

    IPC分类号: H10N10/17 H10N10/13

    CPC分类号: H10N10/17 H10N10/13

    摘要: According to an embodiment, disclosed is a thermoelectric device comprising: a thermoelectric element comprising a first substrate, a plurality of first electrodes disposed on the first substrate, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes, a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs, and a second substrate disposed on the plurality of second electrodes; and a heat sink comprising a plurality of fins disposed to be spaced apart on the second substrate, wherein the second substrate comprises a first region overlapping the second electrodes in a vertical direction and a second region not overlapping the second electrodes in the vertical direction, and wherein separation distances between adjacent fins of the plurality of fins are different from each other in the first region and the second region.