An electronic device includes a semiconductor die with first and second sides, a semiconductor layer extending to the first side, an array of unit cells arranged in rows columns, and a conductive reference terminal in the semiconductor layer that laterally surrounds the array, the first and second sides being spaced apart from one another by a thickness distance of 50 μm or less, and the respective unit cells including: a circuit component in the semiconductor layer; a holey semiconductor portion in the semiconductor layer that laterally surrounds the respective circuit component and includes holes that extend from the metallization structure toward the first side; and a conductive control terminal in the semiconductor layer that laterally surrounds the respective holey semiconductor portion, and an adhesive layer extends between the first side of the semiconductor die and a die attach pad.