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1.发明授权公开(公告)号：US12095212B2
公开(公告)日：2024-09-17
申请号：US17219603
申请日：2021-03-31
发明人： Jürgen Steger , Harald Kobolla
CPC分类号： H01R4/029 , H01L25/072 , H01R4/308 , H01R43/0221 , H02M3/04 , H05K7/20927
摘要： A power electronic arrangement has a power converter module including a switching device with a substrate with a first and a second DC voltage conductor track and a first and a second DC voltage terminal element connected in an electrically conducting manner with the correct polarity, and has a first and a second DC voltage connection element. The first DC voltage terminal element is connected to the first DC voltage connection element in an electrically conducting manner with the correct polarity by means of a first materially-bonded connection. The second DC voltage terminal element is connected to the second DC voltage connection element in an electrically conducting manner with the correct polarity by means of a second materially-bonded connection. The second DC voltage terminal element or the second DC voltage connection element has a continuous welding cavity in the region of the first connection.
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公开(公告)号：US20240079367A1
公开(公告)日：2024-03-07
申请号：US17902629
申请日：2022-09-02
发明人： Ingo BOGEN , Stefan OEHLING
IPC分类号： H01L23/00 , H01L23/373 , H01L25/07
CPC分类号： H01L24/40 , H01L23/3735 , H01L24/32 , H01L24/73 , H01L25/072 , H01L2224/32225 , H01L2224/40139 , H01L2224/40225 , H01L2224/73263
摘要： A power semiconductor module has a substrate arrangement which has a substrate, wherein the respective substrate has conductor tracks, power semiconductor components arranged on the substrate conductor tracks and electrically conductively contacted therewith, a foil stack arrangement which has at least one foil stack, and the foil stack comprises foil stack conductor tracks. The power semiconductor components are electrically conductively connected to by the substrate conductor tracks and the foil stack conductor tracks to form a circuit, and having an electrically conductive bridging element which has first and second contact sections extending from the foil stack arrangement and a connecting section which connects the first and second contact sections, the first contact section is electrically conductively contacted with a first substrate conductor track or with a foil stack conductor track, and the second contact section is electrically conductively contacted with a second substrate conductor track or with a foil stack conductor track, the bridging element is electrically connected in parallel with at least one section of a foil stack conductor track of the foil stack.
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公开(公告)号：US20240022014A1
公开(公告)日：2024-01-18
申请号：US18219042
申请日：2023-07-06
发明人： André SCHLÖTTERER , Harald KOBOLLA
IPC分类号： H01R13/502 , H01L23/498 , H01L23/04 , H01R13/24
CPC分类号： H01R13/502 , H01L23/49811 , H01L23/04 , H01R13/24
摘要： An arrangement having a housing and an electrically conductive contact spring is presented, wherein the contact spring has a first and a second orthogonal main plane along its specified spring direction, wherein it is formed so as to be symmetric with respect to the first main plane, x-z plane, and asymmetric with respect to the second main plane, x-y plane, and also with respect to a rotation through 180° about the specified spring direction. The housing has a spring shaft for receiving the contact spring, and wherein this spring shaft likewise has a first and a second main plane, which coincides with the respective main plane of the contact spring, and wherein the spring shaft is formed so as to be symmetric relative to both main planes. And a power semiconductor module having such an arrangement.
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公开(公告)号：US20230240035A1
公开(公告)日：2023-07-27
申请号：US18097949
申请日：2023-01-17
发明人： Sandro BULOVIC , Christian ZEILER
CPC分类号： H05K7/1432 , H05K7/20927 , H05K7/20272
摘要： An electronic power converter is in a housing of a power converter arrangement. A cooling duct for cooling the power converter with a cooling liquid is inside the housing. The cooling duct has a connection supplying the cooling liquid to the cooling duct and for discharging. Mating connections are connected to the connections of the cooling duct. The connections and the mating connections have sealing surfaces which face each other. The interior of the housing and the cooling duct is sealed via sealing devices each have two sealing rings spaced apart from each other. First sealing rings seal the cooling duct and the other sealing rings seal the housing. Annular grooves as outflow ducts in the housing lead off and open out on the outside of the housing and are introduced into the sealing surfaces in the region between the sealing rings.
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公开(公告)号：US11706883B2
公开(公告)日：2023-07-18
申请号：US16822903
申请日：2020-03-18
发明人： Sandro Bulovic , Harald Kobolla
CPC分类号： H05K5/0091 , H01L24/72 , H01L25/072 , H05K5/06
摘要： A power semiconductor module contains a power semiconductor assembly, a housing which in a housing side with an outer surface has a recess with a direction of passage in the normal direction of the outer surface, having an internal contact device which has an electrically conducting contact inside the housing to an external connection element, designed as a load terminal element, with one section in the recess and having a spring element. The connection element is designed as a rigid metallic shaped body with an inner and an outer contact surface, and the outer contact surface is accessible from the outside, and the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage.
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6.发明授权公开(公告)号：US11705650B2
公开(公告)日：2023-07-18
申请号：US17318566
申请日：2021-05-12
发明人： Jörg Ammon , Harald Kobolla , Jürgen Riegel
CPC分类号： H01R12/57 , H01R13/10 , H05K1/181 , H05K2201/10325
摘要： A power electronic assembly with a sleeve that has a virtual longitudinal axis and a circuit carrier. The sleeve has a tube-shaped plug-in section which runs around the longitudinal axis, and a first base section arranged at a first end of the plug-in section and runs around the longitudinal axis and extends away from the longitudinal axis. The first base section has at its end a flat first contact surface which runs around the longitudinal axis in a closed manner and which runs in a first plane which runs perpendicular to the longitudinal axis. The first base section has an edge surface which runs around the longitudinal axis in a closed manner and the first base section has a second contact surface which runs from the first contact surface and away from the first plane in the direction towards the edge surface.
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公开(公告)号：US20230023512A1
公开(公告)日：2023-01-26
申请号：US17861102
申请日：2022-07-08
摘要： A method and an apparatus for the pressure-sintering connection of a first and a second connection provide a frame element lowerable onto a frame surface surrounding the supporting surface, having a sintering ram lowerable lowered from the normal direction onto the second connection partner and exerts pressure thereon, and converting a sintering paste between the connection partners into a sintered metal, and having an auxiliary apparatus for the arrangement of a separating film for the peripheral covering of the frame surface and the connection partners. This arrangement of the separating film produces an inner region bounded by the frame element and bounded by a separating film portion within the frame element and by the supporting surface, and injection opening and an outlet opening allow a second gas to flush through said inner region from the injection opening to the outlet opening and displace a first gas.
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公开(公告)号：US20220406674A1
公开(公告)日：2022-12-22
申请号：US17840405
申请日：2022-06-14
发明人： Ingo BOGEN , Manuel NODERER , Alexander WEHNER
IPC分类号： H01L23/32
摘要： A pressing device for indirectly or directly applying pressure to power-semiconductor components of a power-semiconductor module, having a pressing plate, having a pressing nub element which is formed from an elastic material and which has a pressing nub plate and pressing nubs projecting therefrom, and having a receiving device for receiving the pressing nub element, which receiving device has a base plate provided with recesses, wherein the recesses run through the base plate, wherein the pressing nub plate is arranged on the base plate and the pressing nubs run through the recesses and, on the main side of the base plate facing away from the pressing nub plate, project beyond this main side of the base plate, and wherein the pressing nub plate is arranged between the pressing plate and the base plate.
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公开(公告)号：US20220181079A1
公开(公告)日：2022-06-09
申请号：US17537322
申请日：2021-11-29
发明人： Markus DIENSTBIER
摘要： A power semiconductor device has a substrate on which power semiconductor switches are arranged and has a circuit board which includes conductive first plug-in connection contacts, a capacitor, a capacitor holding element that includes a reception device for receiving the capacitor, a temperature sensor for the capacitor, a temperature sensor holding element that has a plug-in region for conductive second plug-in connection contacts. There are temperature sensor connecting lines which electrically connect the temperature sensor and the second plug-in connection contacts to one another, at least one section of a temperature sensor connecting line being configured as a conductor track on the temperature sensor holding element, the second plug-in connection contacts forming an electrically conductive plug-in connection with the first plug-in connection contacts.
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公开(公告)号：US20210408698A1
公开(公告)日：2021-12-30
申请号：US17355319
申请日：2021-06-23
摘要： A component for a vehicle electric drive is described, which includes at least one connecting lug pair projecting from the component for electrically connecting the component. Here, a first connecting lug and a second connecting lug of the connecting lug pair each have a joining zone for electrically connecting the component. Furthermore, an assembly for a vehicle electric drive is presented, which has at least two such components. Further presented is a method of electrically conductively connecting two components.
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