公开(公告)号：US20180019138A1

公开(公告)日：2018-01-18

申请号：US15649999

申请日：2017-07-14

申请人： SEMIKRON ELEKTRONIK GMBH & CO. KG

发明人： NEDZAD BAKIJA ,  Christian GÕBL

IPC分类号： H01L21/52 ,  H01L23/31 ,  H01L23/498 ,  H01L25/18 ,  H02M3/158 ,  H02M1/00

CPC分类号： H01L21/52 ,  H01L23/051 ,  H01L23/3121 ,  H01L23/49838 ,  H01L25/18 ,  H02M3/1588 ,  H02M2001/0058

摘要： A switching device and a power semiconductor module are configured with a substrate, a power semiconductor component arranged thereupon and with a load connection device. The substrate incorporates mutually electrically-insulated printed conductors and wherein the load connection device, preferably for an AC potential, comprises at least two partial connection devices, having mutually corresponding contact surfaces and being interconnected in an force-fitted or materially-bonded manner and, on the contact surfaces, an electrically conductive manner, wherein a first partial connection device has a first contact device, which is force-fitted or materially-bonded to the printed conductor of the substrate, and wherein a second partial connection device has a second contact device for the further, preferably external, connection of a load connection device.