METAL COMPOSITE STRUCTURE AND METHOD FOR PRODUCING SAME

    公开(公告)号:US20250065604A1

    公开(公告)日:2025-02-27

    申请号:US18805924

    申请日:2024-08-15

    Inventor: Katsuyuki AWANO

    Abstract: A metal composite structure includes: a thin steel sheet; a low-specific-gravity sheet material having a lower specific gravity than the thin steel sheet and a lower strength than the thin steel sheet; and an adhesive layer which bonds the thin steel sheet and the low-specific-gravity sheet material and has a lower strength than the thin steel sheet and the low-specific-gravity sheet material, wherein a sheet thickness of the thin steel sheet and a sheet thickness of the low-specific-gravity sheet material are set so that a neutral axis of the metal composite structure is located in the adhesive layer for a bending rigidity set in advance for the metal composite structure, based on an equation representing the bending rigidity.

    MULTILAYER BODY AND METHOD FOR PRODUCING MULTILAYER BODY

    公开(公告)号:US20250026107A1

    公开(公告)日:2025-01-23

    申请号:US18713568

    申请日:2022-08-23

    Abstract: To provide a multilayer body, containing a metal plate; and a prepreg adhered directly or indirectly to the metal plate in the plane direction, wherein the prepreg has continuous reinforcing fibers arranged parallelly in one direction impregnated with a polyamide resin, and contains 5 to 300 parts by mass of the continuous reinforcing fibers with respect to 100 parts by mass of the polyamide resin; and the metal plate has a tensile strength as measured according to JIS Z2241 of 300 MPa or higher and 1,400 MPa or lower.

    Package device
    4.
    发明授权

    公开(公告)号:US12200857B2

    公开(公告)日:2025-01-14

    申请号:US18373284

    申请日:2023-09-27

    Abstract: The present disclosure provides a package device including a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.

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