Object detection by indexed optical fiber fabrics

    公开(公告)号:US11773518B2

    公开(公告)日:2023-10-03

    申请号:US16778838

    申请日:2020-01-31

    IPC分类号: D03D15/267 B60R21/015

    摘要: An apparatus comprises a first plurality of optical fibers embedded in a first plurality of fabric strands, a second plurality of optical fibers embedded in a second plurality of fabric strands, and a detector. The first plurality of optical fibers are positioned adjacent to each other and oriented along a first direction and the second plurality of optical fibers are positioned adjacent to each other and oriented along a second direction orthogonal to the first direction. The first and second plurality of optical fibers are configured to receive ambient light emitted onto them. The detector detects the light received into at least some of the first and second plurality of optical fibers and creates data configured to be processed to identify an object adjacent to the apparatus. The data is based on the light received into the first plurality of optical fibers and the second plurality of optical fibers.

    Surface-Colored Glass Cloth and Fiber-Reinforced Resin Molded Product

    公开(公告)号:US20230133229A1

    公开(公告)日:2023-05-04

    申请号:US17925290

    申请日:2021-02-01

    IPC分类号: D03D15/267 B29C70/22

    摘要: A surface-colored glass cloth including a glass cloth which includes a warp and a weft and a plurality of colored portions which are attached to a surface of the glass cloth is disclosed. One colored portion is disposed in each area including one colored point. An average distance D between the adjacent colored points is 0.50 to 10.00 mm. When the number of warp rows is St, a warp widening degree is Et, the number of weft rows is Sy, and a weft widening degree is Ey in the glass cloth, D, St, Et, Sy, and Ey satisfy a formula: 3.3≤100×D1/2×(Et×Ey)/(St×Sy)≤25.0.

    Thermal management of printed circuit board components

    公开(公告)号:US11284540B2

    公开(公告)日:2022-03-22

    申请号:US16589503

    申请日:2019-10-01

    摘要: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.