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公开(公告)号：US20220248526A1
公开(公告)日：2022-08-04
申请号：US17571585
申请日：2022-01-10
摘要： A low dielectric substrate for high-speed millimeter-wave communication includes a quartz glass cloth with a dielectric loss tangent of 0.0001 to 0.0015 and a dielectric constant of 3.0 to 3.8 at 10 GHz, and an organic resin with a dielectric loss tangent within 80% to 150% of the dielectric loss tangent of the quartz glass cloth at 10 GHz and a dielectric constant within 50% to 110% of the dielectric constant of the quartz glass cloth at 10 GHz. This provides a low dielectric substrate for high-speed millimeter-wave communication where the low dielectric substrate makes it possible to send signals that are stable and have excellent quality with no difference in propagation time between wirings even if the substrate has an uneven resin distribution and the quartz glass cloth above and below the wirings, and the difference in dielectric loss tangent between members has been reduced to lower transmission loss.
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公开(公告)号：US20240140863A1
公开(公告)日：2024-05-02
申请号：US18497527
申请日：2023-10-30
CPC分类号： C03C25/68 , B32B5/024 , C03C3/06 , C03C3/091 , C03C13/00 , C08J5/248 , H05K1/0366 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2457/08 , C03C2201/02 , C03C2203/52 , H05K2201/029
摘要： In a glass cloth made of glass filaments having a composition which is at least 50 wt % SiO2, the filaments have a diameter that is 0.5 μm or more and less than 3.0 μm. The glass cloth has a thickness of 15 μm or less and a weight of from 0.3 to 10 g/m2.
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公开(公告)号：US20210403672A1
公开(公告)日：2021-12-30
申请号：US17346897
申请日：2021-06-14
发明人： Toshio SHIOBARA , Yusuke TAGUCHI , Hajime ITOKAWA
摘要： The present invention is a low dielectric resin substrate, which is a composite including an annealed quartz glass cloth and an organic resin, where the annealed quartz glass cloth has a dielectric loss tangent of less than 0.0010 at 10 GHz, and tensile strength of 1.0 N/25 mm or more per cloth weight (g/m2). This provides a resin substrate that includes a quartz glass cloth which has a low dielectric loss tangent and which is also excellent in tensile strength.
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公开(公告)号：US20230247759A1
公开(公告)日：2023-08-03
申请号：US18118915
申请日：2023-03-08
CPC分类号： H05K1/024 , H05K1/0248 , H05K1/0306 , H05K2201/0209 , H05K2201/0175 , H05K2201/0195 , H05K2201/015
摘要： A low dielectric substrate for high-speed millimeter-wave communication includes a quartz glass cloth with a dielectric loss tangent of 0.0001 to 0.0015 and a dielectric constant of 3.0 to 3.8 at 10 GHz, and an organic resin with a dielectric loss tangent within 80% to 150% of the dielectric loss tangent of the quartz glass cloth at 10 GHz and a dielectric constant within 50% to 110% of the dielectric constant of the quartz glass cloth at 10 GHz. This provides a low dielectric substrate for high-speed millimeter-wave communication where the low dielectric substrate makes it possible to send signals that are stable and have excellent quality with no difference in propagation time between wirings even if the substrate has an uneven resin distribution and the quartz glass cloth above and below the wirings, and the difference in dielectric loss tangent between members has been reduced to lower transmission loss.
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公开(公告)号：US20220356107A1
公开(公告)日：2022-11-10
申请号：US17732612
申请日：2022-04-29
发明人： Yusuke TAGUCHI , Hiroyuki FUKASAWA , Toshio SHIOBARA , Yuta TAKAHASHI , Toshifumi IKAGA , KyoungHou KIM , Yutaka OHKOSHI
IPC分类号： C03B37/025 , C03C3/06
摘要： A method for producing a glass filament, the method including: irradiating a raw yarn containing 70 wt % or more of SiO2 and having a raw yarn diameter of 100 to 2,000 μm with laser light having a wavelength of 0.7 to 100 μm to heat the raw yarn; and stretching the raw yarn to obtain the glass filament having a hydroxyl group (Si—OH) content of 300 ppm or less and a diameter of 1 to 20 μm.
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公开(公告)号：US20220275158A1
公开(公告)日：2022-09-01
申请号：US17580262
申请日：2022-01-20
IPC分类号： C08J5/24
摘要： The present invention is a resin substrate including an organic resin and a quartz glass cloth, where the organic resin has a dielectric loss tangent of 0.0002 to 0.0020 measured at 10 GHz and a 40 GHz/10 GHz ratio is 0.4 to 0.9, the quartz glass cloth has a dielectric loss tangent of 0.0001 to 0.0015 measured at 10 GHz and a 40 GHz/10 GHz ratio is 1.2 to 2.0, and the resin substrate has a dielectric loss tangent of 0.0001 to 0.0020 at 10 GHz and a 40 GHz/10 GHz ratio is 0.8 to 1.2. This provides a resin substrate having a low dielectric loss tangent in a high-frequency region and dielectric characteristics with little frequency dependence.
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公开(公告)号：US20210395929A1
公开(公告)日：2021-12-23
申请号：US17339176
申请日：2021-06-04
IPC分类号： D03D15/267 , C03C13/00 , C03C3/06 , C03C25/68 , C03B25/02 , D03D15/573 , D06M23/00
摘要： The present invention is an annealed quartz glass cloth that has an SiO2 content of 99.5 mass % or more, a dielectric loss tangent of less than 0.0010 at 10 GHz, and a tensile strength of 1.0 N/25 mm or more per cloth weight (g/m2). This provides an annealed quartz glass cloth that has a low dielectric loss tangent and that is also excellent in tensile strength; and a method for manufacturing an annealed quartz glass cloth by which strength recovers after a high-temperature heat treatment.
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公开(公告)号：US20130312906A1
公开(公告)日：2013-11-28
申请号：US13956461
申请日：2013-08-01
IPC分类号： H01L33/48
CPC分类号： H01L33/486 , H01L33/56 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/10253 , H01L2924/15747 , H01L2924/00014 , H01L2924/00
摘要： A surface-mount light emitting device is provided comprising a light emitting element (2), a reflector (1) which is molded integral with a leadframe (11, 12) having the light emitting element mounted thereon, and an encapsulating resin composition (4). The reflector is molded from a heat curable resin composition to define a recess with bottom and side walls. The resin side wall has a thickness of 50-500 μm. The encapsulating resin composition is a heat curable resin composition having a hardness of 30-70 Shore D units in the cured state.
摘要翻译： 提供了一种表面贴装发光器件，包括发光元件（2），与安装有发光元件的引线框架（11,12）成一体模制的反射器（1）和封装树脂组合物（4） ）。 反射器由热固性树脂组合物模制，以限定具有底壁和侧壁的凹部。 树脂侧壁的厚度为50-500μm。 封装树脂组合物是在固化状态下硬度为30-70肖氏D单位的热固性树脂组合物。
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