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    PROCESS FOR CLEANING ARTICLES
    2.
    发明申请
    PROCESS FOR CLEANING ARTICLES 有权
    清洁文章的过程

    公开(公告)号：US20110030736A1

    公开(公告)日：2011-02-10

    申请号：US12936942

    申请日：2009-02-18

    Applicant: Konrad Geissler ,  Marius Kuemin

    Inventor： Konrad Geissler ,  Marius Kuemin

    IPC: B08B3/00

    CPC classification number: B08B3/00 ,  B08B7/00 ,  B08B2230/01 ,  H05K3/26 ,  H05K2203/0783 ,  H05K2203/0786 ,  H05K2203/088

    Abstract: A method of cleaning at least one article having a surface to be cleaned, the method comprising the steps of inserting the article into a cleaning chamber (3), subjecting the surface of the article to treatment with water vapour under conditions such that at least a portion of the water vapour condenses on said surface of the article as condensed water, and introducing an organic solvent into the cleaning chamber (3) and thereby removing the condensed water from the surface of the article, wherein no immersion of the article in water or aqueous solution takes place in the cleaning chamber.

    Abstract translation: 一种清洁具有待清洁表面的至少一个物品的方法，所述方法包括以下步骤：将物品插入清洁室（3）中，使物品的表面经受水蒸汽处理，条件是至少 水蒸气的一部分作为冷凝水冷凝在制品的所述表面上，并将有机溶剂引入清洗室（3）中，从而从制品表面除去冷凝水，其中不将物品浸入水中或 水溶液发生在清洁室中。

    THERMALLY CONDUCTIVE STRUCTURE OF LED AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    THERMALLY CONDUCTIVE STRUCTURE OF LED AND MANUFACTURING METHOD THEREOF 失效
    LED的导热结构及其制造方法

    公开(公告)号：US20100133553A1

    公开(公告)日：2010-06-03

    申请号：US12325554

    申请日：2008-12-01

    Applicant: George Anthony Meyer, IV ,  Chien-Hung Sun ,  Chieh-Ping Chen

    Inventor： George Anthony Meyer, IV ,  Chien-Hung Sun ,  Chieh-Ping Chen

    IPC: H01L21/50 ,  H01L33/00

    CPC classification number: H05K1/0203 ,  F21K9/00 ,  F21V29/51 ,  F21V29/75 ,  F21V29/763 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/0272 ,  H05K1/056 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2203/088

    Abstract: A thermally conductive structure of a light emitting diode (LED) includes a vapor chamber, an insulating layer, an electrically conductive layer and a plurality of LEDs. In the invention, the insulating layer is plated over a surface of the vapor chamber; the electrically conductive layer disposed on the insulating layer is electrically separated from the vapor chamber and has a first electrode and a second electrode; and the LEDs arranged on the insulating layer respectively have a first leg connected to the first electrode and a second leg connected to the second electrode; thereby, the invention has an excellent performance of thermal conduction and heat dissipation, which is capable of prolonging the lifespan of LED.

    Abstract translation: 发光二极管（LED）的导热结构包括蒸气室，绝缘层，导电层和多个LED。 在本发明中，绝缘层被镀在蒸气室的表面上; 设置在绝缘层上的导电层与蒸气室电分离并具有第一电极和第二电极; 布置在绝缘层上的LED分别具有连接到第一电极的第一支脚和连接到第二电极的第二支脚; 因此，本发明具有优异的热传导和散热性能，能够延长LED的寿命。

    Method and apparatus for CO.sub.2 cleaning with mitigated ESD
    6.
    发明授权
    Method and apparatus for CO.sub.2 cleaning with mitigated ESD 失效
    减轻ESD的二氧化碳清洗方法和设备

    公开(公告)号：US5651834A

    公开(公告)日：1997-07-29

    申请号：US521495

    申请日：1995-08-30

    Applicant: Min-Chung Jon ,  Hugh Nicholl ,  Peter Hartpence Read

    Inventor： Min-Chung Jon ,  Hugh Nicholl ,  Peter Hartpence Read

    IPC: B08B7/02 ,  B24C1/00 ,  B24C3/12 ,  B24C3/32 ,  H05K3/26 ,  B08B5/00

    CPC classification number: H05K3/26 ,  B08B7/02 ,  B24C1/003 ,  B24C3/12 ,  B24C3/322 ,  H05K1/0259 ,  H05K2203/025 ,  H05K2203/0786 ,  H05K2203/083 ,  H05K2203/088 ,  Y10S134/902

    Abstract: An object (12) may be cleaned by CO.sub.2 reduced ESD by directing a first water mist (23) at a surface (14) of the object while imparting a relative motion between the object board and the mist to form a film of water on the object surface. As the relative motion is imparted between the board and the first mist (23), a second water mist (32) is injected into a stream (30) of solid CO.sub.2 particles (27) directed at the object surface downstream of the first mist. Water droplets in the second mist in the second mist combine with the CO.sub.2 particles to create carbonic acid that disassociates into charged ions that increase the conductivity of the water film, allowing for increased charge dissipation, thus reducing the incidence of ESD.

    Abstract translation: 可以通过在物体的表面（14）处引导第一水雾（23）同时在物体板和雾之间施加相对运动来在物体（12）上形成水膜 物体表面。 当在板和第一雾（23）之间施加相对运动时，将第二水雾（32）注入到位于第一雾下游的物体表面的固体CO 2颗粒（27）的流（30）中。 第二雾中的第二雾中的水滴与CO 2颗粒结合，产生分解成带电离子的碳酸，从而增加了水膜的电导率，从而增加了电荷耗散，从而降低了ESD的发生。

    Apparatus for solder removal
    8.
    发明授权
    Apparatus for solder removal 失效
    焊料去除设备

    公开(公告)号：US4757780A

    公开(公告)日：1988-07-19

    申请号：US865232

    申请日：1986-05-20

    Applicant: Donald J. Spigarelli ,  Douglas J. Peck ,  Walter J. Hall ,  James L. Finney

    Inventor： Donald J. Spigarelli ,  Douglas J. Peck ,  Walter J. Hall ,  James L. Finney

    IPC: B23K1/015 ,  B23K1/018 ,  B23K1/08 ,  H05K3/34 ,  H05K3/24 ,  B05C3/10

    CPC classification number: H05K3/34 ,  B23K1/015 ,  B23K1/018 ,  B23K1/085 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/044 ,  H05K2203/0746 ,  H05K2203/0776 ,  H05K2203/088 ,  H05K2203/1509

    Abstract: A vapor phase system for soldering of a workpiece. A vessel for containing an electronic liquid which is heated to generate a zone of saturated vapor. A first inclined throat communicates with the vessel and a solder pot is located within the vessel. The solder pot including a reservoir for containing molten solder, a second throat aligned with the first throat and communicating at one end with molten solder contained in the reservoir means and communicating at the other end with the saturated vapor, molten solder contained in the reservoir means is pumped through the second throat and is captured by the reservoir and a conveyor carries work product through the first throat, through the saturated vapor and into the second throat whereby the work product will become immersed in the molten solder contained within the second throat.

    Abstract translation: 用于焊接工件的气相系统。 用于容纳电子液体的容器，其被加热以产生饱和蒸汽区域。 第一倾斜喉管与容器连通，并且容器内设有焊锡锅。 焊料罐包括用于容纳熔融焊料的储存器，与第一喉部对准的第二喉部，并且在一端与包含在储存器装置中的熔融焊料连通，并且在另一端与在储存器装置中包含的饱和蒸气，熔融焊料连通 被泵送通过第二喉管并且被储存器捕获，并且输送器通过第一喉管，通过饱和蒸气并将其运送到第二喉部，由此工件将浸入包含在第二喉部内的熔融焊料中。

    Vapor phase bonding for RF microstrip line circuits
    9.
    发明授权
    Vapor phase bonding for RF microstrip line circuits 失效
    RF微带线路电路的气相接合

    公开(公告)号：US4638938A

    公开(公告)日：1987-01-27

    申请号：US882215

    申请日：1986-07-03

    Applicant: Andrew J. Yarne ,  Eldon F. Burr

    Inventor： Andrew J. Yarne ,  Eldon F. Burr

    IPC: B23K3/08 ,  H05K1/02 ,  H05K3/00 ,  H05K3/34 ,  B23K31/02

    CPC classification number: H05K3/0061 ,  B23K3/087 ,  H05K3/341 ,  H05K1/0237 ,  H05K1/0272 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/0405 ,  H05K2203/088 ,  H05K2203/1178 ,  H05K3/3494 ,  Y02P70/613 ,  Y10T29/49124

    Abstract: An improved vapor phase soldering process and apparatus are disclosed having particular application to electronic circuitry designed for operation at frequencies higher than 1 MHz. A printed circuit board having a defined circuit pattern on both sides is clamped between two parallel clamping fixtures, one having circuit matching characteristics for the specified PC board, and the fixture further having vents allowing vapor phase gas access to the PC board and soldering process waste gasses egress from the soldering area. This process and apparatus allows shortened soldering time, and improves performance characteristics of the PC board by improving the conduction characteristics of the defined circuit pattern.

    Abstract translation: 公开了一种改进的气相焊接工艺和装置，其特别适用于设计用于在高于1MHz的频率下操作的电子电路。 具有两侧限定电路图案的印刷电路板被夹紧在两个平行的夹紧夹具之间，一个具有用于指定的PC板的电路匹配特性，并且夹具还具有允许气相气体进入PC板和焊接工艺废料的通风口 气体从焊接区域出口。 该方法和装置允许缩短的焊接时间，并且通过改进限定的电路图案的传导特性来改善PC板的性能特性。

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