-
公开(公告)号：US06894386B2
公开(公告)日：2005-05-17
申请号：US10118576
申请日：2002-04-08
Applicant: Chia Yong Poo , Boon Suan Jeung , Low Siu Waf , Chan Min Yu , Neo Yong Loo , Eng Meow Koon , Ser Bok Leng , Chua Swee Kwang , So Chee Chung , Ho Kwok Seng
Inventor： Chia Yong Poo , Boon Suan Jeung , Low Siu Waf , Chan Min Yu , Neo Yong Loo , Eng Meow Koon , Ser Bok Leng , Chua Swee Kwang , So Chee Chung , Ho Kwok Seng
IPC: H01L21/301 , H01L21/60 , H01L21/78 , H01L23/04 , H01L23/48 , H01L23/485 , H01L23/50 , H01L23/52 , H01L23/58
CPC classification number: H01L21/78 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/80 , H01L24/93 , H01L27/105 , H01L2224/02311 , H01L2224/02313 , H01L2224/02331 , H01L2224/02371 , H01L2224/02375 , H01L2224/02379 , H01L2224/0239 , H01L2224/0345 , H01L2224/03452 , H01L2224/0361 , H01L2224/03622 , H01L2224/039 , H01L2224/05548 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/056 , H01L2224/08237 , H01L2224/80357 , H01L2224/804 , H01L2224/80898 , H01L2224/93 , H01L2924/0002 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/19041 , H01L2224/0231 , H01L2224/03 , H01L2224/05552 , H01L2924/00
Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
-
公开(公告)号：US20080054423A1
公开(公告)日：2008-03-06
申请号：US11934556
申请日：2007-11-02
Applicant: Chia Poo , Boon Jeung , Low War , Chan Yu , Nao Loo , Eng Koon , Ser Leng , Chua Kwang , So Chung , Hu Seng
Inventor： Chia Poo , Boon Jeung , Low War , Chan Yu , Nao Loo , Eng Koon , Ser Leng , Chua Kwang , So Chung , Hu Seng
IPC: H01L23/495 , H01L23/488
CPC classification number: H01L21/78 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/80 , H01L24/93 , H01L27/105 , H01L2224/02311 , H01L2224/02313 , H01L2224/02331 , H01L2224/02371 , H01L2224/02375 , H01L2224/02379 , H01L2224/0239 , H01L2224/0345 , H01L2224/03452 , H01L2224/0361 , H01L2224/03622 , H01L2224/039 , H01L2224/05548 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/056 , H01L2224/08237 , H01L2224/80357 , H01L2224/804 , H01L2224/80898 , H01L2224/93 , H01L2924/0002 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/19041 , H01L2224/0231 , H01L2224/03 , H01L2224/05552 , H01L2924/00
Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
Abstract translation: 描述了在模具和边缘接触结构上形成边缘接触的方法。 模具上的边缘接触不会增加模具的高度。 边缘触点位于模具的周边。 边缘触点定位在锯木街道上。 每个边缘接触件连接到邻近锯街的每个模具的一个接合焊盘。 当模具分离时，边缘触点被分成每个相邻模具的触点。 在一个实施例中，在锯街道中形成凹部。 在一个实施例中，凹槽通过用机械切割器划线锯条形成。 将凹槽图案化并且沉积接触材料以形成边缘接触。
-
公开(公告)号：US06955975B2
公开(公告)日：2005-10-18
申请号：US10433525
申请日：2002-09-05
Applicant: Frank Reichenbach , Frank Fischer , Ralf Hausner , Frieder Haag , Eckhard Graf , Markus Lutz
Inventor： Frank Reichenbach , Frank Fischer , Ralf Hausner , Frieder Haag , Eckhard Graf , Markus Lutz
IPC: B29C65/16 , B29C65/60 , B81C1/00 , H01L21/20 , H01L21/58 , H01L21/60 , H01L21/762 , H01L21/30 , H01L21/46
CPC classification number: B29C65/1635 , B29C65/1612 , B29C65/1683 , B29C65/608 , B29C66/1122 , B29C66/12421 , B29C66/472 , B29C66/53461 , B29C66/71 , B29C66/712 , B29C66/7392 , B29K2083/00 , B29L2031/756 , B81C1/00269 , B81C1/00357 , B81C2201/019 , B81C2203/019 , H01L21/2007 , H01L21/76251 , H01L24/83 , H01L2224/80224 , H01L2224/80365 , H01L2224/80379 , H01L2224/804 , H01L2224/80488 , H01L2224/83224 , H01L2224/834 , H01L2224/83424 , H01L2224/83447 , H01L2224/83466 , H01L2224/83471 , H01L2224/83487 , H01L2224/8349 , H01L2224/83801 , H01L2924/01029 , H01L2924/09701 , H01L2924/12042 , H01L2924/01014 , H01L2924/00014 , H01L2924/00
Abstract: A method for joining a silicon plate to a second plate, a laser beam being directed through the silicon plate at the second plate. In the process, the wavelength of the laser beam is selected in such a way that only a negligibly small amount of energy is absorbed in the silicon plate. A strongly absorbent material is hotmelted by the laser beam's energy and then produces a bond between the silicon plate and the second plate.
Abstract translation: 一种用于将硅板接合到第二板的方法，激光束被引导通过硅板在第二板。 在该过程中，激光束的波长以这样一种方式选择，即在硅板中仅吸收可忽略的少量能量。 强吸收性材料被激光束的能量热熔化，然后在硅板和第二板之间产生粘结。
-
公开(公告)号：US20050029668A1
公开(公告)日：2005-02-10
申请号：US10929932
申请日：2004-08-30
Applicant: Chia Poo , Boon Jeung , Low Waf , Chan Yu , Neo Loo , Eng Koon , Ser Leng , Chua Kwang , So Chung , Ho Seng
Inventor： Chia Poo , Boon Jeung , Low Waf , Chan Yu , Neo Loo , Eng Koon , Ser Leng , Chua Kwang , So Chung , Ho Seng
IPC: H01L21/301 , H01L21/60 , H01L21/78 , H01L23/04 , H01L23/48 , H01L23/485 , H01L23/50 , H01L23/52 , H01L23/58
CPC classification number: H01L21/78 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/80 , H01L24/93 , H01L27/105 , H01L2224/02311 , H01L2224/02313 , H01L2224/02331 , H01L2224/02371 , H01L2224/02375 , H01L2224/02379 , H01L2224/0239 , H01L2224/0345 , H01L2224/03452 , H01L2224/0361 , H01L2224/03622 , H01L2224/039 , H01L2224/05548 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/056 , H01L2224/08237 , H01L2224/80357 , H01L2224/804 , H01L2224/80898 , H01L2224/93 , H01L2924/0002 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/19041 , H01L2224/0231 , H01L2224/03 , H01L2224/05552 , H01L2924/00
Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
Abstract translation: 描述了在模具和边缘接触结构上形成边缘接触的方法。 模具上的边缘接触不会增加模具的高度。 边缘触点位于模具的周边。 边缘触点定位在锯木街道上。 每个边缘接触件连接到邻近锯街的每个模具的一个接合焊盘。 当模具分离时，边缘触点被分成每个相邻模具的触点。 在一个实施例中，在锯街道中形成凹部。 在一个实施例中，凹槽通过用机械切割器划线锯条形成。 将凹槽图案化并且沉积接触材料以形成边缘接触。
-
公开(公告)号：US08778737B2
公开(公告)日：2014-07-15
申请号：US13285443
申请日：2011-10-31
Applicant: Edward C. Cooney, III , James S. Dunn , Dale W. Martin , Charles F. Musante , BethAnn Rainey , Leathen Shi , Edmund J. Sprogis , Cornelia K. Tsang
Inventor： Edward C. Cooney, III , James S. Dunn , Dale W. Martin , Charles F. Musante , BethAnn Rainey , Leathen Shi , Edmund J. Sprogis , Cornelia K. Tsang
CPC classification number: H01L23/4825 , H01L21/6835 , H01L21/76819 , H01L22/32 , H01L22/34 , H01L23/5223 , H01L23/5283 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/13 , H01L24/16 , H01L24/80 , H01L24/81 , H01L29/1054 , H01L2221/68327 , H01L2221/6834 , H01L2221/68363 , H01L2221/68381 , H01L2224/0361 , H01L2224/0401 , H01L2224/05166 , H01L2224/05187 , H01L2224/05567 , H01L2224/05624 , H01L2224/05687 , H01L2224/06181 , H01L2224/08225 , H01L2224/131 , H01L2224/73251 , H01L2224/80011 , H01L2224/80013 , H01L2224/80075 , H01L2224/80203 , H01L2224/804 , H01L2224/80487 , H01L2224/80896 , H01L2224/80907 , H01L2224/80948 , H01L2224/81203 , H01L2224/81801 , H01L2224/81815 , H01L2924/00014 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13062 , H01L2924/15788 , H01L2924/014 , H01L2224/08 , H01L2224/16 , H01L2924/05432 , H01L2924/053 , H01L2924/01031 , H01L2924/01033 , H01L2924/04941 , H01L2924/00 , H01L2224/05552
Abstract: Methods for bonding substrate surfaces, bonded substrate assemblies, and design structures for a bonded substrate assembly. Device structures of a product chip are formed using a first surface of a device substrate. A wiring layer of an interconnect structure for the device structures is formed on the product chip. The wiring layer is planarized. A temporary handle wafer is removably bonded to the planarized wiring layer. In response to removably bonding the temporary handle wafer to the planarized first wiring layer, a second surface of the device substrate, which is opposite to the first surface, is bonded to a final handle substrate. The temporary handle wafer is then removed from the assembly.
Abstract translation: 用于粘结衬底表面，键合衬底组件和用于键合衬底组件的设计结构的方法。 使用器件基板的第一表面形成产品芯片的器件结构。 在产品芯片上形成用于器件结构的互连结构的布线层。 布线层被平坦化。 临时处理晶片可移除地结合到平坦化的布线层。 响应于将临时手柄晶片可移除地结合到平坦化的第一布线层，与第一表面相对的器件基板的第二表面被结合到最终的手柄基板。 然后将临时手柄晶片从组件中取出。
-
Patent Agency Ranking
公开(公告)号：US20100140794A1
公开(公告)日：2010-06-10
申请号：US12705277
申请日：2010-02-12
Applicant: Chia Yong Poo , Boon Suan Jeung , Low Siu Waf , Chan Min Yu , Neo Yong Lou , Eng Meow Koon , Ser Bok Leng , Chun Swee Kwang , So Chee Chung , Ho Kwok Song
Inventor： Chia Yong Poo , Boon Suan Jeung , Low Siu Waf , Chan Min Yu , Neo Yong Lou , Eng Meow Koon , Ser Bok Leng , Chun Swee Kwang , So Chee Chung , Ho Kwok Song
IPC: H01L23/498
CPC classification number: H01L21/78 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/80 , H01L24/93 , H01L27/105 , H01L2224/02311 , H01L2224/02313 , H01L2224/02331 , H01L2224/02371 , H01L2224/02375 , H01L2224/02379 , H01L2224/0239 , H01L2224/0345 , H01L2224/03452 , H01L2224/0361 , H01L2224/03622 , H01L2224/039 , H01L2224/05548 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/056 , H01L2224/08237 , H01L2224/80357 , H01L2224/804 , H01L2224/80898 , H01L2224/93 , H01L2924/0002 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/19041 , H01L2224/0231 , H01L2224/03 , H01L2224/05552 , H01L2924/00
Abstract: An apparatus comprises an integrated circuit die including a main body having a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer. The integrated circuit die also includes a bond pad on the main body, an edge contact at the peripheral edge surface and a line connecting the bond pad to the edge contact. The edge contact includes a bottom surface that substantially in the same plane as a surface of an encapsulant encasing the die. Additional apparatus, systems, and methods are disclosed.
Abstract translation: 一种装置包括集成电路管芯，其包括具有顶层，底层和在顶层和底层之间延伸的周边边缘表面的主体。 集成电路管芯还包括主体上的接合焊盘，外围边缘表面处的边缘接触以及将接合焊盘连接到边缘接触件的线。 边缘接触包括底面，其基本上在与包封模具的密封剂的表面相同的平面内。 公开了附加装置，系统和方法。
-
公开(公告)号：US20060084240A1
公开(公告)日：2006-04-20
申请号：US11281084
申请日：2005-11-17
Applicant: Chia Poo , Boon Jeung , Low Waf , Chan Yu , Neo Loo , Eng Koon , Ser Leng , Chua Kwang , So Chung , Ho Seng
Inventor： Chia Poo , Boon Jeung , Low Waf , Chan Yu , Neo Loo , Eng Koon , Ser Leng , Chua Kwang , So Chung , Ho Seng
IPC: H01L21/78
CPC classification number: H01L21/78 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/80 , H01L24/93 , H01L27/105 , H01L2224/02311 , H01L2224/02313 , H01L2224/02331 , H01L2224/02371 , H01L2224/02375 , H01L2224/02379 , H01L2224/0239 , H01L2224/0345 , H01L2224/03452 , H01L2224/0361 , H01L2224/03622 , H01L2224/039 , H01L2224/05548 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/056 , H01L2224/08237 , H01L2224/80357 , H01L2224/804 , H01L2224/80898 , H01L2224/93 , H01L2924/0002 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/19041 , H01L2224/0231 , H01L2224/03 , H01L2224/05552 , H01L2924/00
Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
-
公开(公告)号：US20040082145A1
公开(公告)日：2004-04-29
申请号：US10433525
申请日：2003-11-13
Inventor： Frank Reichenbach , Frank Fischer , Ralf Hausner , Frieder Haag , Eckhard Graf , Markus Lutz
IPC: H01L021/30 , H01L021/46
CPC classification number: B29C65/1635 , B29C65/1612 , B29C65/1683 , B29C65/608 , B29C66/1122 , B29C66/12421 , B29C66/472 , B29C66/53461 , B29C66/71 , B29C66/712 , B29C66/7392 , B29K2083/00 , B29L2031/756 , B81C1/00269 , B81C1/00357 , B81C2201/019 , B81C2203/019 , H01L21/2007 , H01L21/76251 , H01L24/83 , H01L2224/80224 , H01L2224/80365 , H01L2224/80379 , H01L2224/804 , H01L2224/80488 , H01L2224/83224 , H01L2224/834 , H01L2224/83424 , H01L2224/83447 , H01L2224/83466 , H01L2224/83471 , H01L2224/83487 , H01L2224/8349 , H01L2224/83801 , H01L2924/01029 , H01L2924/09701 , H01L2924/12042 , H01L2924/01014 , H01L2924/00014 , H01L2924/00
Abstract: A method is proposed for joining a silicon plate (1) to a second plate (2), a laser beam being directed through the silicon plate (1) at the second plate (2). In the process, the wavelength of the laser beam is selected in such a way that only a negligibly small amount of energy is absorbed in the silicon plate (1). A strongly absorbent material is hotmelted by the laser beam's energy and then produces a bond between the silicon plate (1) and the second plate (2).
Abstract translation: 提出一种将硅板（1）接合到第二板（2）的方法，激光束被引导通过第二板（2）处的硅板（1）。 在该过程中，选择激光束的波长，使得在硅板（1）中仅吸收可忽略的少量能量。 强吸收性材料被激光束的能量热熔化，然后在硅板（1）和第二板（2）之间产生粘结。
-
9.发明授权公开(公告)号：US08436255B2
公开(公告)日：2013-05-07
申请号：US12651295
申请日：2009-12-31
Applicant: Kim-Yong Goh
Inventor： Kim-Yong Goh
IPC: H05K1/11
CPC classification number: H01L23/3128 , H01L21/563 , H01L23/293 , H01L24/05 , H01L24/08 , H01L24/19 , H01L24/20 , H01L24/80 , H01L2224/03334 , H01L2224/0391 , H01L2224/0401 , H01L2224/04105 , H01L2224/05008 , H01L2224/05571 , H01L2224/08238 , H01L2224/12105 , H01L2224/16225 , H01L2224/16227 , H01L2224/221 , H01L2224/80357 , H01L2224/804 , H01L2224/80815 , H01L2224/814 , H01L2924/0002 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/3025 , Y10T29/49117 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
Abstract: A polymeric layer encompassing the solder elements of a ball grid array in an electronics package. The polymeric layer reinforces the solder bond at the solder ball-component interface by encasing the elements of the ball grid array in a rigid polymer layer that is adhered to the package structure. Stress applied to the package through the ball grid array is transmitted to the package structure through the polymeric layer, bypassing the solder joint and improving mechanical and electrical circuit reliability. In one embodiment of a method for making the polymeric layer, solder elements bonded to external pads on a structure of the package are submerged in a fluidic form of the polymeric layer. The fluidic form is solidified and then a portion of the resulting polymeric layer is removed to make the solder elements accessible for mounting the package to a printed circuit board or other external circuit.
Abstract translation: 包含电子封装中的球栅阵列的焊料元件的聚合物层。 聚合物层通过将球栅阵列的元件包围在粘合到封装结构的刚性聚合物层中来加强焊球组分界面处的焊料接合。 通过球栅阵列施加到封装的应力通过聚合物层传递到封装结构，绕过焊点并改善机电电路的可靠性。 在制造聚合物层的方法的一个实施方案中，与封装结构上的外部焊盘接合的焊料元素浸没在聚合物层的流体形式中。 流体形式被固化，然后去除所得聚合物层的一部分，以使焊料元件可接近以将封装安装到印刷电路板或其它外部电路。
-
公开(公告)号：US08138617B2
公开(公告)日：2012-03-20
申请号：US10929932
申请日：2004-08-30
Applicant: Chia Yong Poo , Boon Suan Jeung , Low Siu Waf , Chan Min Yu , Neo Yong Loo , Eng Meow Koon , Ser Bok Leng , Chua Swee Kwang , So Chee Chung , Ho Kwok Seng
Inventor： Chia Yong Poo , Boon Suan Jeung , Low Siu Waf , Chan Min Yu , Neo Yong Loo , Eng Meow Koon , Ser Bok Leng , Chua Swee Kwang , So Chee Chung , Ho Kwok Seng
CPC classification number: H01L21/78 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/80 , H01L24/93 , H01L27/105 , H01L2224/02311 , H01L2224/02313 , H01L2224/02331 , H01L2224/02371 , H01L2224/02375 , H01L2224/02379 , H01L2224/0239 , H01L2224/0345 , H01L2224/03452 , H01L2224/0361 , H01L2224/03622 , H01L2224/039 , H01L2224/05548 , H01L2224/05569 , H01L2224/05571 , H01L2224/05572 , H01L2224/056 , H01L2224/08237 , H01L2224/80357 , H01L2224/804 , H01L2224/80898 , H01L2224/93 , H01L2924/0002 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/19041 , H01L2224/0231 , H01L2224/03 , H01L2224/05552 , H01L2924/00
Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
Abstract translation: 描述了在模具和边缘接触结构上形成边缘接触的方法。 模具上的边缘接触不会增加模具的高度。 边缘触点位于模具的周边。 边缘触点定位在锯木街道上。 每个边缘接触件连接到邻近锯街的每个模具的一个接合焊盘。 当模具分离时，边缘触点被分成每个相邻模具的触点。 在一个实施例中，在锯街道中形成凹部。 在一个实施例中，凹槽通过用机械切割器划线锯条形成。 将凹槽图案化并且沉积接触材料以形成边缘接触。
-
-
-
-
-
-
-
-
-
Search Results
18
records
(took 0.013 seconds)
