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公开(公告)号：US06812580B1
公开(公告)日：2004-11-02
申请号：US10457632
申请日：2003-06-09
Applicant: Robert J. Wenzel , Peter R. Harper
Inventor： Robert J. Wenzel , Peter R. Harper
IPC: H01L2348
CPC classification number: H01L24/06 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/50 , H01L23/66 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/6616 , H01L2224/0401 , H01L2224/04042 , H01L2224/05001 , H01L2224/05082 , H01L2224/05554 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/06136 , H01L2224/0616 , H01L2224/06163 , H01L2224/32145 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/4554 , H01L2224/4809 , H01L2224/48091 , H01L2224/48092 , H01L2224/48095 , H01L2224/4813 , H01L2224/48137 , H01L2224/48145 , H01L2224/48195 , H01L2224/48227 , H01L2224/48229 , H01L2224/48233 , H01L2224/48235 , H01L2224/4824 , H01L2224/48247 , H01L2224/48455 , H01L2224/48465 , H01L2224/48601 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48701 , H01L2224/48724 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48801 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4903 , H01L2224/49051 , H01L2224/49052 , H01L2224/49096 , H01L2224/49097 , H01L2224/4912 , H01L2224/4917 , H01L2224/49171 , H01L2224/49174 , H01L2224/49175 , H01L2224/49179 , H01L2224/49431 , H01L2224/854 , H01L2224/85401 , H01L2224/85424 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15313 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/013 , H01L2924/00013
Abstract: Closely-spaced bonding wires may be used in a variety of different packaging applications to achieve improved electrical performance. In one embodiment, two adjacent bonding wires within a wire grouping are closely-spaced if a separation distance D between the two adjacent wires is met for at least 50 percent of the length of the shorter of the two adjacent wires. In one embodiment, the separation distance D is at most two times a diameter of the wire having the larger diameter of the two adjacent wires. In another embodiment, the separation distance D is at most three times a wire-to-wire pitch between the two adjacent wires. Each wire grouping may include two of more closely-spaced wires. Wire groupings of closely-spaced bonding wires may be used to form, for example, power-signal-ground triplets, signal-ground pairs, signal-power pairs, or differential signal pairs or triplets.
Abstract translation: 紧密间隔的接合线可用于各种不同的包装应用中，以实现改进的电气性能。 在一个实施例中，如果两条相邻导线之间的间隔距离D达到两条相邻导线中较短的长度的至少50％，则导线组内的两个相邻接合线是紧密间隔的。 在一个实施例中，分离距离D为具有两个相邻线的较大直径的线的直径的至多两倍。 在另一个实施例中，分离距离D至少为两条相邻线之间的线对线间距的三倍。 每个线分组可以包括两个更紧密间隔的导线。 紧密间隔的接合线的电线分组可用于形成例如功率 - 信号 - 接地三通态，信号 - 接地对，信号 - 功率对或差分信号对或三线态。
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公开(公告)号：US08183683B1
公开(公告)日：2012-05-22
申请号：US12549068
申请日：2009-08-27
Applicant: Joon Su Kim , Jung Soo Park , Tae Kyung Hwang
Inventor： Joon Su Kim , Jung Soo Park , Tae Kyung Hwang
IPC: H01L23/488
CPC classification number: H01L24/05 , H01L23/3128 , H01L24/03 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L25/0657 , H01L2224/02163 , H01L2224/04042 , H01L2224/05556 , H01L2224/05578 , H01L2224/05601 , H01L2224/05618 , H01L2224/05623 , H01L2224/05624 , H01L2224/05638 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48618 , H01L2224/48623 , H01L2224/48624 , H01L2224/48801 , H01L2224/48818 , H01L2224/48823 , H01L2224/48838 , H01L2224/73265 , H01L2224/85 , H01L2224/92247 , H01L2225/0651 , H01L2225/06565 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/01048 , H01L2924/01004 , H01L2924/0665 , H01L2924/00012 , H01L2224/48824 , H01L2924/00 , H01L2224/48638
Abstract: A semiconductor device is provided. The semiconductor device comprises a semiconductor die having bond pads, each of which consists of a first bond pad made of a material whose ionization tendency is relatively low and a second bond pad made of a material whose ionization tendency is relatively high. The second bond pads function as sacrificial anodes to prevent the occurrence of galvanic corrosion at the interfaces between the first bond pads and conductive wires. In an embodiment, the upper surfaces of the second bond pads are marked instead of those of the first bond pads, which reduces the number of defects in the first bond pads. A method for fabricating the semiconductor device is also provided.
Abstract translation: 提供半导体器件。 半导体器件包括具有接合焊盘的半导体管芯，每个半导体管芯由电离倾向相对较低的材料制成的第一接合焊盘和由电离倾向相对较高的材料制成的第二接合焊盘构成。 第二接合焊盘用作牺牲阳极，以防止在第一接合焊盘和导电线之间的界面处发生电偶腐蚀。 在一个实施例中，标记第二接合焊盘的上表面而不是第一接合焊盘的上表面，这减少了第一接合焊盘中的缺陷数量。 还提供了一种用于制造半导体器件的方法。
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公开(公告)号：US09171827B2
公开(公告)日：2015-10-27
申请号：US14148717
申请日：2014-01-06
Applicant: Jin-Ho Lee , Hee-Seok Lee , Se-Ho You , Jeong-Oh Ha
Inventor： Jin-Ho Lee , Hee-Seok Lee , Se-Ho You , Jeong-Oh Ha
CPC classification number: H01L25/105 , H01L23/3128 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L2224/13101 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45157 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/45171 , H01L2224/48091 , H01L2224/48227 , H01L2224/48601 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48701 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48801 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/73204 , H01L2224/73265 , H01L2224/81815 , H01L2224/85401 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/19106 , H05K1/0271 , H05K3/284 , H05K2201/09136 , H05K2201/09909 , H05K2201/10734 , H01L2924/00014 , H01L2924/014 , H01L2924/00 , H01L2924/00012
Abstract: A stack type semiconductor package includes a lower semiconductor package including a lower package substrate and at least one lower semiconductor chip disposed on the lower package substrate; an upper semiconductor package including an upper package substrate larger than the lower package substrate and at least one upper semiconductor chip disposed on the upper package substrate; an inter-package connector connecting an upper surface of the lower package substrate to a lower surface of the upper package substrate; and a filler filling in between the lower package substrate and the upper package substrate while substantially surrounding the inter-package connector.
Abstract translation: 堆叠型半导体封装包括下半导体封装，其包括下封装衬底和布置在下封装衬底上的至少一个下半导体芯片; 上半导体封装，包括比下封装衬底大的上封装衬底和设置在上封装衬底上的至少一个上半导体芯片; 将所述下封装基板的上表面连接到所述上封装基板的下表面的封装间连接器; 以及填充在下封装衬底和上封装衬底之间的填料，同时基本上围绕封装间连接器。
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公开(公告)号：US20140291868A1
公开(公告)日：2014-10-02
申请号：US14148717
申请日：2014-01-06
Applicant: JIN-HO LEE , HEE-SEOK LEE , SE-HO YOU , JEONG-OH HA
Inventor： JIN-HO LEE , HEE-SEOK LEE , SE-HO YOU , JEONG-OH HA
IPC: H01L23/00
CPC classification number: H01L25/105 , H01L23/3128 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L2224/13101 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45157 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/45171 , H01L2224/48091 , H01L2224/48227 , H01L2224/48601 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48701 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48801 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/73204 , H01L2224/73265 , H01L2224/81815 , H01L2224/85401 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/19106 , H05K1/0271 , H05K3/284 , H05K2201/09136 , H05K2201/09909 , H05K2201/10734 , H01L2924/00014 , H01L2924/014 , H01L2924/00 , H01L2924/00012
Abstract: A stack type semiconductor package includes a lower semiconductor package including a lower package substrate and at least one lower semiconductor chip disposed on the lower package substrate; an upper semiconductor package including an upper package substrate larger than the lower package substrate and at least one upper semiconductor chip disposed on the upper package substrate; an inter-package connector connecting an upper surface of the lower package substrate to a lower surface of the upper package substrate; and a filler filling in between the lower package substrate and the upper package substrate while substantially surrounding the inter-package connector.
Abstract translation: 堆叠型半导体封装包括下半导体封装，其包括下封装衬底和设置在下封装衬底上的至少一个下半导体芯片; 上半导体封装，包括比下封装衬底大的上封装衬底和设置在上封装衬底上的至少一个上半导体芯片; 将所述下封装基板的上表面连接到所述上封装基板的下表面的封装间连接器; 以及填充在下封装基板和上封装基板之间的填料，同时基本上围绕封装间连接器。
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