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公开(公告)号：US20130112989A1
公开(公告)日：2013-05-09
申请号：US13677508
申请日：2012-11-15
CPC分类号： H05K3/32 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L25/0753 , H01L33/08 , H01L33/44 , H01L33/48 , H01L33/50 , H01L2221/6834 , H01L2221/68363 , H01L2224/16225 , H01L2224/24101 , H01L2224/24227 , H01L2224/245 , H01L2224/24992 , H01L2224/32238 , H01L2224/73204 , H01L2224/82104 , H01L2224/82105 , H01L2224/82138 , H01L2224/82855 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83486 , H01L2224/96 , H01L2924/01029 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/15787 , H05K3/321 , H05K13/00 , Y10T29/49117 , Y10T29/4913 , H01L2924/00014 , H01L2924/01049 , H01L2924/0105 , H01L2924/053 , H01L2224/82 , H01L2924/01013 , H01L2924/01079 , H01L2924/01047 , H01L2924/01078 , H01L2924/00
摘要： In accordance with certain embodiments, illumination systems are formed by aligning light-emitting elements with optical elements and/or disposing light-conversion materials on the light-emitting elements, as well as by providing electrical connectivity to the light-emitting elements
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公开(公告)号：US07973417B2
公开(公告)日：2011-07-05
申请号：US12105489
申请日：2008-04-18
申请人： Alfred Martin , Barbara Hasler
发明人： Alfred Martin , Barbara Hasler
CPC分类号： H05K3/3442 , B23K35/262 , B23K2101/36 , H01L24/05 , H01L24/64 , H01L24/66 , H01L24/89 , H01L25/0657 , H01L25/50 , H01L2224/16105 , H01L2224/16168 , H01L2224/24992 , H01L2224/27013 , H01L2224/83051 , H01L2225/06551 , H01L2924/00013 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10156 , H01L2924/10157 , H01L2924/14 , H01L2924/351 , H05K1/182 , H05K2201/09427 , H05K2201/09472 , H05K2201/10454 , H05K2203/0465 , Y02P70/613 , H01L2224/29099 , H01L2924/00
摘要： An article including a substrate having a blind hole formed therein, wherein the blind hole is defined by a floor and a sidewall and a solder connection is provided. The solder connection may couple a first contact pad to a second contact pad. The first contact pad may cover a first field of the floor of the blind hole, and may also promote wetting of a solder material of the solder connection. Wetting may be impeded on a second field of the floor of the blind hole. The second contact pad may be arranged above a surface of a further substrate, wherein the surface of the further substrate may be oriented perpendicularly to the floor of the blind hole in the substrate.
摘要翻译： 一种包括其中形成有盲孔的基板的制品，其中所述盲孔由地板和侧壁限定，并且提供焊接连接。 焊接连接可以将第一接触焊盘耦合到第二接触焊盘。 第一接触垫可以覆盖盲孔的底板的第一场，并且还可以促进焊料连接的焊料材料的润湿。 在盲孔的地板的第二场可能会妨碍润湿。 第二接触焊盘可以布置在另一基板的表面之上，其中另外的基板的表面可以垂直于基板中的盲孔的底板定向。
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公开(公告)号：US20090261480A1
公开(公告)日：2009-10-22
申请号：US12105489
申请日：2008-04-18
申请人： Alfred Martin , Barbara Hasler
发明人： Alfred Martin , Barbara Hasler
IPC分类号： H01L23/488 , H05K1/11 , H01L21/60 , B23K35/12
CPC分类号： H05K3/3442 , B23K35/262 , B23K2101/36 , H01L24/05 , H01L24/64 , H01L24/66 , H01L24/89 , H01L25/0657 , H01L25/50 , H01L2224/16105 , H01L2224/16168 , H01L2224/24992 , H01L2224/27013 , H01L2224/83051 , H01L2225/06551 , H01L2924/00013 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10156 , H01L2924/10157 , H01L2924/14 , H01L2924/351 , H05K1/182 , H05K2201/09427 , H05K2201/09472 , H05K2201/10454 , H05K2203/0465 , Y02P70/613 , H01L2224/29099 , H01L2924/00
摘要： An article including a substrate having a blind hole formed therein, wherein the blind hole is defined by a floor and a sidewall and a solder connection is provided. The solder connection may couple a first contact pad to a second contact pad. The first contact pad may cover a first field of the floor of the blind hole, and may also promote wetting of a solder material of the solder connection. Wetting may be impeded on a second field of the floor of the blind hole. The second contact pad may be arranged above a surface of a further substrate, wherein the surface of the further substrate may be oriented perpendicularly to the floor of the blind hole in the substrate.
摘要翻译： 一种包括其中形成有盲孔的基板的制品，其中所述盲孔由地板和侧壁限定，并且提供焊接连接。 焊接连接可以将第一接触焊盘耦合到第二接触焊盘。 第一接触垫可以覆盖盲孔的底板的第一场，并且还可以促进焊料连接的焊料材料的润湿。 在盲孔的地板的第二场可能会妨碍润湿。 第二接触焊盘可以布置在另一基板的表面之上，其中另外的基板的表面可以垂直于基板中的盲孔的底板定向。
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公开(公告)号：US20130056749A1
公开(公告)日：2013-03-07
申请号：US13604880
申请日：2012-09-06
CPC分类号： H05K3/32 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L25/0753 , H01L33/08 , H01L33/44 , H01L33/48 , H01L33/50 , H01L2221/6834 , H01L2221/68363 , H01L2224/16225 , H01L2224/24101 , H01L2224/24227 , H01L2224/245 , H01L2224/24992 , H01L2224/32238 , H01L2224/73204 , H01L2224/82104 , H01L2224/82105 , H01L2224/82138 , H01L2224/82855 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83486 , H01L2224/96 , H01L2924/01029 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/15787 , H05K3/321 , H05K13/00 , Y10T29/49117 , Y10T29/4913 , H01L2924/00014 , H01L2924/01049 , H01L2924/0105 , H01L2924/053 , H01L2224/82 , H01L2924/01013 , H01L2924/01079 , H01L2924/01047 , H01L2924/01078 , H01L2924/00
摘要： In accordance with certain embodiments, illumination systems are formed by aligning light-emitting elements with optical elements and/or disposing light-conversion materials on the light-emitting elements, as well as by providing electrical connectivity to the light-emitting elements
摘要翻译： 根据某些实施例，通过将发光元件与光学元件对准和/或在发光元件上设置光转换材料以及通过提供与发光元件的电连接来形成照明系统
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公开(公告)号：US20120248607A1
公开(公告)日：2012-10-04
申请号：US13243877
申请日：2011-09-23
CPC分类号： H01L24/83 , H01L23/293 , H01L23/3185 , H01L24/05 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/0345 , H01L2224/0346 , H01L2224/038 , H01L2224/0381 , H01L2224/0401 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05567 , H01L2224/05573 , H01L2224/05644 , H01L2224/05664 , H01L2224/1131 , H01L2224/11848 , H01L2224/13017 , H01L2224/1329 , H01L2224/133 , H01L2224/13311 , H01L2224/13313 , H01L2224/13347 , H01L2224/16145 , H01L2224/24051 , H01L2224/24105 , H01L2224/24146 , H01L2224/24226 , H01L2224/244 , H01L2224/245 , H01L2224/24992 , H01L2224/24997 , H01L2224/25175 , H01L2224/2919 , H01L2224/82009 , H01L2224/82039 , H01L2224/82101 , H01L2224/831 , H01L2225/06524 , H01L2225/06562 , H01L2924/00014 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/12042 , H01L2924/14 , H01L2924/0665 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
摘要： A die has interconnect pads on an interconnect side near an interconnect edge and has at least a portion of the interconnect side covered by a conformal dielectric coating, in which an interconnect trace over the dielectric coating forms a high interface angle with the surface of the dielectric coating. Because the traces have a high interface angle, a tendency for the interconnect materials to “bleed” laterally is mitigated and contact or overlap of adjacent traces is avoided. The interconnect trace includes a curable electrically conductive interconnect material; that is, it includes a material that can be applied in a flowable form, and thereafter cured or allowed to cure to form the conductive traces. Also, a method includes, prior to forming the traces, subjecting the surface of the conformal dielectric coating with a CF4 plasma treatment.
摘要翻译： 裸片在互连端附近在互连边缘附近具有互连焊盘，并且互连面的至少一部分由保形电介质涂层覆盖，其中在电介质涂层上的互连迹线与电介质的表面形成高界面角 涂层。 由于迹线具有高界面角度，互连材料横向渗出的趋势被减轻，并且避免了相邻迹线的接触或重叠。 互连迹线包括可固化的导电互连材料; 也就是说，它包括可以以可流动形式施加的材料，然后固化或允许其固化以形成导电迹线。 此外，一种方法包括在形成迹线之前，用CF 4等离子体处理对保形电介质涂层的表面进行处理。
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公开(公告)号：US20080258313A1
公开(公告)日：2008-10-23
申请号：US11737187
申请日：2007-04-19
CPC分类号： H01L23/48 , B81B2207/098 , B81C1/00301 , H01L21/4864 , H01L24/24 , H01L24/32 , H01L24/82 , H01L24/83 , H01L2224/1131 , H01L2224/24226 , H01L2224/244 , H01L2224/24992 , H01L2224/27013 , H01L2224/73217 , H01L2224/82039 , H01L2224/82102 , H01L2224/83051 , H01L2224/838 , H01L2224/92144 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/0781 , H01L2924/12041 , H01L2924/1306 , H05K3/0032 , H05K3/107 , H05K3/125 , H05K3/1258 , H05K3/321 , H05K2201/09472 , H05K2201/10674 , H05K2203/013 , H05K2203/0568 , H05K2203/1469 , Y10S438/94 , H01L2924/00 , H01L2224/0401
摘要： A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.
摘要翻译： 提供与微型化装置的连通性的方法，该方法包括以下步骤：提供具有至少顶表面的烧蚀性基材; 提供具有第一和第二表面的模具，并且至少在所述第一表面上具有焊盘; 使所述模具与所述模具的所述至少第一表面接触所述可烧蚀基材的所述至少第一表面; 并且在靠近模具的烧蚀材料中烧蚀通道。
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公开(公告)号：US20130111744A1
公开(公告)日：2013-05-09
申请号：US13692129
申请日：2012-12-03
CPC分类号： H05K3/32 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L25/0753 , H01L33/08 , H01L33/44 , H01L33/48 , H01L33/50 , H01L2221/6834 , H01L2221/68363 , H01L2224/16225 , H01L2224/24101 , H01L2224/24227 , H01L2224/245 , H01L2224/24992 , H01L2224/32238 , H01L2224/73204 , H01L2224/82104 , H01L2224/82105 , H01L2224/82138 , H01L2224/82855 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83486 , H01L2224/96 , H01L2924/01029 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/15787 , H05K3/321 , H05K13/00 , Y10T29/49117 , Y10T29/4913 , H01L2924/00014 , H01L2924/01049 , H01L2924/0105 , H01L2924/053 , H01L2224/82 , H01L2924/01013 , H01L2924/01079 , H01L2924/01047 , H01L2924/01078 , H01L2924/00
摘要： In accordance with certain embodiments, illumination systems are formed by aligning light-emitting elements with optical elements and/or disposing light-conversion materials on the light-emitting elements, as well as by providing electrical connectivity to the light-emitting elements
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公开(公告)号：US07696013B2
公开(公告)日：2010-04-13
申请号：US11737187
申请日：2007-04-19
IPC分类号： H01L21/00
CPC分类号： H01L23/48 , B81B2207/098 , B81C1/00301 , H01L21/4864 , H01L24/24 , H01L24/32 , H01L24/82 , H01L24/83 , H01L2224/1131 , H01L2224/24226 , H01L2224/244 , H01L2224/24992 , H01L2224/27013 , H01L2224/73217 , H01L2224/82039 , H01L2224/82102 , H01L2224/83051 , H01L2224/838 , H01L2224/92144 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01082 , H01L2924/0781 , H01L2924/12041 , H01L2924/1306 , H05K3/0032 , H05K3/107 , H05K3/125 , H05K3/1258 , H05K3/321 , H05K2201/09472 , H05K2201/10674 , H05K2203/013 , H05K2203/0568 , H05K2203/1469 , Y10S438/94 , H01L2924/00 , H01L2224/0401
摘要： A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.
摘要翻译： 提供与微型化装置的连通性的方法，该方法包括以下步骤：提供具有至少顶表面的烧蚀性基材; 提供具有第一和第二表面的模具，并且至少在所述第一表面上具有焊盘; 使所述模具与所述模具的所述至少第一表面接触所述可烧蚀基材的所述至少第一表面; 并且在靠近模具的烧蚀材料中烧蚀通道。
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9.发明申请公开(公告)号：US20070210458A1
公开(公告)日：2007-09-13
申请号：US11682509
申请日：2007-03-06
申请人： Yoshinori HAGIO
发明人： Yoshinori HAGIO
IPC分类号： H01L23/52
CPC分类号： H01L24/32 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/82 , H01L29/0657 , H01L2224/05553 , H01L2224/24051 , H01L2224/24225 , H01L2224/24226 , H01L2224/24227 , H01L2224/24992 , H01L2224/24998 , H01L2224/27013 , H01L2224/32225 , H01L2224/73267 , H01L2224/82007 , H01L2224/83051 , H01L2224/92 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/10157 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/83 , H01L2224/82 , H01L2924/01022 , H01L2924/01028 , H01L2924/00
摘要： A semiconductor device includes a base plate including a plurality of terminals; a semiconductor chip, mounted above the base plate, including a plurality of pads arranged on a face of the semiconductor chip; an insulating slope member, disposed around the semiconductor chip, covering steps between the semiconductor chip and the base plate; and a wiring pattern extending on the insulating slope member to electrically connect the terminals to the pads. The base plate has a base-side retaining section for retaining the insulating slope member.
摘要翻译： 半导体器件包括：包括多个端子的基板; 半导体芯片，安装在所述基板上方，包括布置在所述半导体芯片的表面上的多个焊盘; 绝缘斜面部件，设置在所述半导体芯片周围，覆盖所述半导体芯片与所述基板之间的台阶; 以及在绝缘斜坡部件上延伸以将端子电连接到焊盘的布线图案。 基板具有用于保持绝缘斜边部件的基部侧保持部。
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公开(公告)号：US20150056753A1
公开(公告)日：2015-02-26
申请号：US14480373
申请日：2014-09-08
申请人： Invensas Corporation
IPC分类号： H01L23/00
CPC分类号： H01L24/83 , H01L23/293 , H01L23/3185 , H01L24/05 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/0345 , H01L2224/0346 , H01L2224/038 , H01L2224/0381 , H01L2224/0401 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05567 , H01L2224/05573 , H01L2224/05644 , H01L2224/05664 , H01L2224/1131 , H01L2224/11848 , H01L2224/13017 , H01L2224/1329 , H01L2224/133 , H01L2224/13311 , H01L2224/13313 , H01L2224/13347 , H01L2224/16145 , H01L2224/24051 , H01L2224/24105 , H01L2224/24146 , H01L2224/24226 , H01L2224/244 , H01L2224/245 , H01L2224/24992 , H01L2224/24997 , H01L2224/25175 , H01L2224/2919 , H01L2224/82009 , H01L2224/82039 , H01L2224/82101 , H01L2224/831 , H01L2225/06524 , H01L2225/06562 , H01L2924/00014 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/12042 , H01L2924/14 , H01L2924/0665 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
摘要： A die has interconnect pads on an interconnect side near an interconnect edge and has at least a portion of the interconnect side covered by a conformal dielectric coating, in which an interconnect trace over the dielectric coating forms a high interface angle with the surface of the dielectric coating. Because the traces have a high interface angle, a tendency for the interconnect materials to “bleed” laterally is mitigated and contact or overlap of adjacent traces is avoided. The interconnect trace includes a curable electrically conductive interconnect material; that is, it includes a material that can be applied in a flowable form, and thereafter cured or allowed to cure to form the conductive traces. Also, a method includes, prior to forming the traces, subjecting the surface of the conformal dielectric coating with a CF4 plasma treatment.
摘要翻译： 裸片在互连端附近在互连边缘附近具有互连焊盘，并且互连面的至少一部分由保形电介质涂层覆盖，其中在电介质涂层上的互连迹线与电介质的表面形成高界面角 涂层。 由于迹线具有较高的界面角度，因此互连材料横向“渗出”的趋势得到缓解，避免了相邻迹线的接触或重叠。 互连迹线包括可固化的导电互连材料; 也就是说，它包括可以以可流动形式施加的材料，然后固化或允许其固化以形成导电迹线。 此外，一种方法包括在形成迹线之前，用CF 4等离子体处理对保形电介质涂层的表面进行处理。
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