SLOT DIE COATING DEVICE AND CONTROL METHOD THEREFOR

    公开(公告)号:US20180275071A1

    公开(公告)日:2018-09-27

    申请号:US15762177

    申请日:2016-09-23

    IPC分类号: G01N21/84 B05C5/02 B05C11/00

    摘要: The present invention relates to a slot die coating device and a control method therefor. The slot die coating device according to one embodiment of the present invention comprises: a slot die for performing a coating process by coating a substrate with ink; an image capturing unit located adjacent to the slot die, and photographing a state of the slot die and a state of the ink coated on the substrate during the coating process; and a control unit for controlling an operation of the slot die according to a result of the comparison between an image captured by the image capturing unit and a reference image, wherein the slot die comprises: a first body having a cavity in which the ink supplied from the outside is accommodated; a second body arranged so as to be spaced apart from the first body; and a shim plate coupled between the first body and the second body, having an outlet communicating with the cavity so as to discharge the ink accommodated in the cavity, and having at least one protrusion part exposed to the outside of the first body and the second body, wherein the control unit sets the reference image on the basis of the at least one protrusion part and compares the image captured by the image capturing unit and the reference image.

    METHOD AND DEVICE FOR DETERMINING THE TRANSMITTANCE OF A FLAT GLASS SUBSTRATE

    公开(公告)号:US20180128740A1

    公开(公告)日:2018-05-10

    申请号:US15520444

    申请日:2015-10-20

    申请人: Cibite AG

    IPC分类号: G01N21/59 G01N21/896

    摘要: The invention relates to a method and an associated device for determining the transmittance of a flat-glass substrate (40) with a measuring device (10), with which light of at least one light source (20) is guided from one side of the flat-glass substrate (40) through the flat-glass substrate (40) to the opposite side of the flat-glass substrate (40), where it is captured by at least one receiving unit (30) and the transmittance of the flat-glass substrate (40) is determined by means of a comparison between the intensity of the light emitted by the light source (20) and the light incident upon the receiving unit (30). The light source is a surface-like diffuse light source (20), and the receiving unit (30) comprises at least one spatially resolving receiver (31; 31n). By evaluating brightness values in the measuring image (33; 33′) of the spatially resolving receiver (31; 31n), the transmittance is determined in a spatially resolved manner in a partial surface of the flat-glass substrate (40), which is covered by the measuring image (33; 33′).

    INTEGRATED EMISSIVITY SENSOR ALIGNMENT CHARACTERIZATION

    公开(公告)号:US20180094921A1

    公开(公告)日:2018-04-05

    申请号:US15281757

    申请日:2016-09-30

    摘要: A workpiece alignment system has a workpiece support to support a workpiece. A first light emitter directs a first light beam toward the workpiece. A first light receiver receives the first light beam. A rotation device rotates the workpiece support about a support axis. A second light emitter directs a second light beam toward a peripheral region of the workpiece. A second light receiver receives the second light beam concurrent with the rotation of the workpiece. A controller determines a transmissivity of the workpiece based on a total initial emittance of the first light beam a transmission of the first light beam through the workpiece. The controller determines a position of the workpiece with respect to the support axis based, at least in part, on a rotational position of the workpiece, a portion of the second light beam received, and the determined transmissivity.

    Computer program product and method of controlling polishing of a substrate
    10.
    发明授权
    Computer program product and method of controlling polishing of a substrate 有权
    控制基板抛光的计算机程序产品和方法

    公开(公告)号:US09573242B2

    公开(公告)日:2017-02-21

    申请号:US14299728

    申请日:2014-06-09

    摘要: A method of controlling polishing includes polishing a substrate of a non-metallic layer undergoing polishing and a metal layer underlying the non-metallic layer; storing a metal reference spectrum, the metal reference spectrum being a spectrum of light reflected from a same metal material as the metal layer; measuring a sequence of raw spectra of light reflected from the substrate during polishing with an in-situ optical monitoring system; normalizing each raw spectrum in the sequence of spectra to generate a sequence of normalized spectra, of which normalizing includes a division operation where the measured spectrum is in the numerator and the metal reference spectrum is in the denominator; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least one normalized predetermined spectrum from the sequence of normalized spectra.

    摘要翻译: 控制抛光的方法包括抛光经历抛光的非金属层的基底和非金属层下面的金属层; 存储金属参考光谱,所述金属参考光谱是从与所述金属层相同的金属材料反射的光谱; 用原位光学监测系统测量在抛光过程中从衬底反射的光的原始光谱序列; 对光谱序列中的每个原始光谱进行归一化以产生归一化光谱序列,其归一化包括除法运算,其中所测量的光谱在分子中,金属参考光谱在分母中; 以及基于来自归一化光谱序列的至少一个归一化的预定光谱来确定抛光终点或抛光速率的调整中的至少一个。