Abstract:
The invention relates to curable polyorganosiloxanes with special silicon-containing terminal groups and curable compositions based on these polyorganosiloxanes, a capped adhesion promoter, and a curing catalyst. These compositions have improved adhesion properties and excellent storage stability. The invention also relates to the use thereof.
Abstract:
A silicone-based aerosol product includes a container and an aerosol silicone composition within the container. The aerosol silicone composition includes a silicone elastomer composition and a propellant.
Abstract:
A composition includes an elastomer and a ketoximo silane or a ketoxime additive. The ketoximo silane corresponds to Formula I: D-SA—B (I) where B defined as: where D is selected from a C1 to C60 hydrocarbyl group, or when A is 0 or 1 a hydrogen, or the structure in Formula III; and wherein n and j are independently 1, 2, or 3, m and q are independently 0 or 1, z and t are independently 0 or 1 and (n+m+z) is equal to 3 and (j+q+t) is equal to 3; A is 0 or greater than or equal to 1; R1 and R2 are independently C1 to C60 divalent organic groups and may optionally include O, N S, Si, and/or P heteroatoms with the proviso that when A is 0 either of R1 and R2 may be a chemical bond; R3, R4, R8 and R9 are independently a hydrogen, or a C1 to C60 hydrocarbyl or alkoxy group optionally including O, N, S, Si and/or P; R5 and R6 are independently hydrogen or C1 to C60 hydrocarbyl groups and may optionally include O, N S, Si, and/or P heteroatoms, and may optionally be bonded together to form a cyclic ring; R10 and R11 are independently hydrogen or C1 to C60 hydrocarbyl groups and may optionally include O, N S, Si, and/or P heteroatoms, and may optionally be bonded together to form a cyclic ring.
Abstract:
The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.
Abstract:
A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles). Alternatively, a monomer having a brominated aromatic functional group may be reacted with a silane to produce a brominated alkoxysilane monomer, which is then reacted with the surface of silica particles.
Abstract:
The present invention provides curable compositions that are substantially free of metal catalysts including both tin and non-tin metal catalysts. The curable compositions employ a catalyst composition comprising the combination of a (i) carbodiimide functional compound, and (ii) an amino-containing compound such as an amino silane functional compound and/or an organic amine compound. The combination of these materials, particularly when aged, accelerates the condensation curing of moisture cur able silicones/non-silicones even in the absence of a metal-based catalyst.
Abstract:
Azocarbonyl-functionalized silanes of formula I (R1)3-a(R2)aSi—R1—NH—C(O)—N═N—R4 (I) and methods for their production are provided. The silanes of formula (I) are useful in rubber mixtures to provide moldings having improved tear-resistance.
Abstract:
A room temperature-curable electrically conductive fluorosilicone rubber composition comprises: (A) a fluoropolysiloxane capped at the molecular terminals with hydroxyl groups having a viscosity at 25° C. of from 1,000 to 1,000,000 mPa·s; (B) fine silica powder having a BET specific surface area of not less than 50 m2/g; (C) a carbon black; (D) a fibrous carbon allotrope having a graphene structure; and (E) a crosslinking agent. Component (D) is comprised in an amount of not less than 1.5 parts by mass per 100 parts by mass of component (A). The room temperature-curable electrically conductive fluorosilicone rubber composition is cured to form a cured product having both superior post-cure physical strength and electrical conductivity. Also, the room temperature-curable electrically conductive fluorosilicone rubber composition has viscosity that enables superior handling, and provides superior post-cure surface smoothness, solvent resistance, and adhesion.
Abstract:
A polyphenylene sulfide resin composition has excellent heat resistance, flowability and lightweight property as well as surface smoothness and impact resistance. The polyphenylene sulfide resin composition includes 1 to 30 parts by weight of a mica (b) having an aspect ratio of not less than 80, relative to 100 parts by weight of a polyphenylene sulfide resin (a).
Abstract:
An odorless curable composition containing a hydrolyzable silyl group-containing urethane compound with good storage stability is provided.A curable composition comprising 100 parts by mass of a polymer (P) obtained by a urethane-forming reaction of a polymer (pP) having a polyoxyalkylene chain and hydroxyl groups and a compound (U) represented by the following formula (I): Si(X1)m(R1)3-m-Q-NCO (I) (wherein Q is a C2-20 bivalent linear hydrocarbon group, X1 is a C1-6 alkoxy group, R1 is a C1-6 alkyl group, and m is an integer of from 1 to 3) in the presence of a urethane-forming catalyst and from 0.0001 to 0.1 part by mass of an inorganic acid or an organic acid having an active hydrogen bonded to an oxygen atom.